Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Introduction of Routable Molded Lead Frame and its Application

RtMLF(Routable Molded Lead Frame) 패키지 소개 및 응용

  • Kim, ByongJin (Amkor Technology Research & Development Center, Amkor Technology Korea, Inc.) ;
  • Bang, Wonbae (Amkor Technology Research & Development Center, Amkor Technology Korea, Inc.) ;
  • Kim, GiJung (Amkor Technology Research & Development Center, Amkor Technology Korea, Inc.) ;
  • Jung, JiYoung (Amkor Technology Research & Development Center, Amkor Technology Korea, Inc.) ;
  • Yoon, JuHoon (Amkor Technology Research & Development Center, Amkor Technology Korea, Inc.)
  • 김병진 (앰코테크놀로지 코리아 기술연구소) ;
  • 방원배 (앰코테크놀로지 코리아 기술연구소) ;
  • 김기정 (앰코테크놀로지 코리아 기술연구소) ;
  • 정지영 (앰코테크놀로지 코리아 기술연구소) ;
  • 윤주훈 (앰코테크놀로지 코리아 기술연구소)
  • Received : 2015.05.28
  • Accepted : 2015.06.18
  • Published : 2015.06.30
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Abstract

RtMLF (Routable Molded Lead Frame) based on molded substrate has been developed to maximize advantages of both leadframe product which has high thermal and electrical performance and laminate product which accommodates more I/O count and keeps fan-in/fan-out design flexibility. Due to its structural features, RtMLF provided excellent thermal and electrical performance which was confirmed with simulation. The RtMLF samples were manufactured and its reliability analysis was done to evaluate the opportunities of the production and application.

리드프레임의 우수한 열적/전기적 특성을 유지하면서 많은 I/O수를 수용할 수 있는 구조, 그리고 라미네이트의 디자인 팬인(Fan-in) 및 팬아웃(Fan-out) 설계 유연성을 유지하면서 가격경쟁력을 향상 시킬 수 있는 몰딩기판(Molded substrate)을 기반으로 한 RtMLF(Routable Molded Lead Frame) 패키지를 개발하였다. 개발된 패키지의 구조적 특징을 이용하여, 열적 전기적 성능의 우수성을 시뮬레이션을 통해서 확인하였으며, 제조 및 신뢰성 분석을 수행하여 생산 적용 가능성을 확인하였다.

Keywords

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