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http://dx.doi.org/10.6117/kmeps.2015.22.2.041

Introduction of Routable Molded Lead Frame and its Application  

Kim, ByongJin (Amkor Technology Research & Development Center, Amkor Technology Korea, Inc.)
Bang, Wonbae (Amkor Technology Research & Development Center, Amkor Technology Korea, Inc.)
Kim, GiJung (Amkor Technology Research & Development Center, Amkor Technology Korea, Inc.)
Jung, JiYoung (Amkor Technology Research & Development Center, Amkor Technology Korea, Inc.)
Yoon, JuHoon (Amkor Technology Research & Development Center, Amkor Technology Korea, Inc.)
Publication Information
Journal of the Microelectronics and Packaging Society / v.22, no.2, 2015 , pp. 41-45 More about this Journal
Abstract
RtMLF (Routable Molded Lead Frame) based on molded substrate has been developed to maximize advantages of both leadframe product which has high thermal and electrical performance and laminate product which accommodates more I/O count and keeps fan-in/fan-out design flexibility. Due to its structural features, RtMLF provided excellent thermal and electrical performance which was confirmed with simulation. The RtMLF samples were manufactured and its reliability analysis was done to evaluate the opportunities of the production and application.
Keywords
molded substrate; RtMLF; thermal performance; electrical performance; reliability;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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