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http://dx.doi.org/10.7735/ksmte.2013.22.3.356

A Study on the Optimal Design of Mechanical Molding Press for Semiconductor Packaging  

Kim, Moon-Ki (School of Mechatronics Engineering, Korea University of Technology and Education)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.22, no.3, 2013 , pp. 356-363 More about this Journal
Abstract
Mechanical molding press which is used for transformation process during semiconductor manufacturing process has structural deformations by pressure. If these deformations have over limit range, life of the press itself can be reduced and it will be exerted on a bad effect for quality of the semiconductor. In this research, the main plates and links of a press are analyzed in relation to the structural deformations caused by pressure excluding thermal deformations. After modifying the modeling, the analysis is performed again to determine optimal design of the press, and this design is introduced to ensure that most of the stresses on the main plates are within safe allowable limits. As a result, an optimal design method for the structure is investigated to produce the desired pressure even when the size of the main structure is minimized.
Keywords
Mechanical molding press; Optimal design; Finite element method; Semiconductor;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
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