• Transactions on Electrical and Electronic Materials
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• v.16 no.4
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• pp.187-189
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• 2015

A charge-trap flash (CTF) thin film transistor (TFT) memory is proposed at a low-temperature process (≤ 450℃). The memory cell consists of a sputtered oxide-nitride-oxide (ONO) gate dielectric and Schottky barrier (SB) source/drain (S/D) junctions using nickel silicide. These components enable the ultra-low-temperature process to be successfully achieved with the ONO gate stacks that have a substrate temperature of room temperature and S/D junctions that have an annealing temperature of 200℃. The silicidation process was optimized by measuring the electrical characteristics of the Ni-silicided Schottky diodes. As a result, the Ion/Ioff current ratio is about 1.4×10⁵ and the subthreshold swing and field effect mobility are 0.42 V/dec and 14 cm²/V·s at a drain voltage of −1 V, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.9
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• pp.710-712
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• 2011

In this study, we fabricate resistive switching random access memory (ReRAM) devices constructed with a Al/$HfO_2$/ITO structure on glass substrates and investigate their memory characteristics. The hafnium oxide thin film used as a resistive switching layer is sputtered at room temperature in a sputtering system with a cooling unit. The Al/$HfO_2$/ITO device exhibits bipolar resistive switching characteristics, and the ratio of the high resistance (HRS) to low resistance states (LRS) is more than 60. In addition, the resistance ratio maintains even after $10^4$ seconds.

• Korean Journal of Materials Research
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• v.21 no.10
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• pp.550-555
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• 2011

A high-quality CIGS film with a selenization process needs to be developed for low-cost and large-scale production. In this study, we used $Cu_2In_3$, CuGa and $Cu_2Se$ sputter targets for the deposition of a precursor. The precursor deposited by sputtering was selenized in Se vapor. The precursor layer deposited by the co-sputtering of $Cu_2In_3$, CuGa and $Cu_2Se$ showed a uniform distribution of Cu, In, Ga, and Se throughout the layer with Cu, In, CuIn, CuGa and $Cu_2Se$ phases. After selenization at $550^{\circ}C$ for 30 min, the CIGS film showed a double-layer microstructure with a large-grained top layer and a small-grained bottom layer. In the AES depth profile, In was found to have accumulated near the surface while Cu had accumulated in the middle of the CIGS film. By adding a Cu-In-Ga interlayer between the co-sputtered precursor layer and the Mo film and adding a thin $Cu_2Se$ layer onto the co-sputtered precursor layer, large CIGS grains throughout the film were produced. However, the Cu accumulated in the middle of CIGS film in this case as well. By supplying In, Ga and Se to the CIGS film, a uniform distribution of Cu, In, Ga and Se was achieved in the middle of the CIGS film.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.145-146
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• 2002

Tribological properties of co-sputtered Molybdenum disulfide $(MoS_2)/Carbon\;(C)$ films were studied and compared with those of sputtered $MoS_2$ films. Friction tests were carried out using pin-on-disk friction testers to evluated their friction and wear behaviors in a vacuum ($10^{-5}Pa$), air and humid air of 30, 50, 80% RH. $MoS_2/C$ (14%) composite films exhibited about 9 times longer wear life in a vacuum and about 6 times longer wear life in dry air than $MoS_2$ films did. They also showed stable low friction coefficient of about 0.02 in a vacuum. In humid air, however, $MoS_2/C$ composite films hardly showed good tribological properties.

• Korean Journal of Materials Research
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• v.9 no.4
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• pp.368-372
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• 1999

The suggested electrode structure of MOCVD-Pt/sputtered-Ru/polysilicon has an excellent adhesion with increasing annealing temperatures and shows a stable electrode structure up to $600^{\circ}C$. However, the ruthenium used for barrier layer increased the roughness of platinum bottom electrodes because ruthenium diffused through the Pt bottom electrode and reacted with oxygen during the annealing above $700^{\circ}C$. The surface roughness increased the resistivity of Pt bottom electrodes. The resistivity of samples annealed at $600^{\circ}C$ was about $13\mu$Ω.cm. The electrode structure was possible to apply for ferroelectric thin film integration of semiconductor memory devices.

• Journal of the Korean institute of surface engineering
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• v.50 no.2
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• pp.55-71
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• 2017

Transparent Conductive Oxide (TCO), especially Indium Tin Oxide (ITO) films are almost prepared by DC magnetron sputtering because of the advantage of obtaining homogeneous large area coatings with high reproducibility. The purpose of this report is describe a detailed investigation of key factors dominating electrical and structural properties of sputtered ITO films. It was confirmed that crystallinity and electrical properties of ITO films were strongly depend on the sputtering pressure and kinetic energy of sputtered particles which are expected to have a close relation with the transport processes between target and substrate. And also, nodule formation on the ITO target was suppressed by both $CaCO_3$ addition and decreasing micro-pore in the target. On the other hand, we focused on the characteristics of amorphous TCO film to use as transparent electrode for various applications. To realize high thermoelectric performance, it was tried to control both high electrical conductivity and low thermal conductivity for the amorphous IZO:Sn films.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.44-44
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.06a
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• pp.4-5
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• 2001

• Proceedings of the Korean Magnestics Society Conference
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• 1994.10a
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• pp.80-81
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• 1994

• Proceedings of the Korean Magnestics Society Conference
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• 2000.05a
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• pp.144-145
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• 2000