• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.68-71
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• 2003

The reaction of ultra-small eutectic 58Bl-42Sn solder bump with Au/Ni/Ti and Au/Cu/Ti UBMs during reflow was studied. The eutectic Bi-Sn solder bumps of $46{\mu}m$ diameter were fabricated by using the evaporation method and were reflowed using the rapid thermal annealing system. The intermetallic compound was characterized using a SEM, an EDS, and an XRD. The $(Cu_xAu_{1-x})_6Sn_5$ compounds formed at the interface between Bi-Sn solder and Au/Cu/Ti UBM. On the other hand, in the Bi-Sn solder bump on Au/Ni/Ti UBM, the faceted and rectangular intermetallic compounds were observed on the solder bump surface and inside the solder bump as well as at the UBM interface. These intermetallic compounds were Identified as $(Au_{l-x-y}Bi_xNi_y)Sn_2$ phase.

• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.17-22
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• 2013

본 연구에서는 Sn-58Bi 솔더를 이용한 경성 인쇄 회로 기판 (Rigid printed circuit board, RPCB)과 연성 인쇄회로 기판 (Flexible printed circuit board, FPCB) 간의 열압착 접합 시, 접합 조건에 따른 기계적 특성에 대하여 연구하였다. 접합 온도와 접합 시간을 변수로 열압착 접합을 실시하여 $90^{\circ}$ 필 테스트(Peel test)를 통해 접합 강도를 측정하고, 단면과 파단면을 관찰하였다. 접합 온도가 증가할수록 접합 강도가 증가하였으며, 접합 시간에 따른 접합 강도의 변화 또한 관찰할 수 있었다. 접합 시간이 증가하면서 접합부의 파괴에 영향을 미치는 요인이 솔더 층에서 금속간 화합물(Intermetallic compound, IMC) 층으로 변화하는 것을 관찰할 수 있었다. 필 테스트 과정의 F-x(Force-distance) curve를 통해 파괴 에너지를 계산하여 금속간 화합물이 접합 강도에 미치는 영향을 평가하였으며, 본 연구에서 $195^{\circ}C$, 7초 조건이 접합 강도와 파괴 에너지가 가장 높게 나타나는 최적 접합 조건으로 도출되었다.

• Journal of Welding and Joining
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• 제23권3호
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• pp.61-67
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• 2005

Since lead (Pb)-free solders for electronics have higher melting points than that of eutectic Sn-Pb solder, they need higher soldering temperatures. In order to decrease the soldering temperature we tried to coat Sn-Bi layer on $Sn-3.5\%Ag$ solder by electroplating, which applies the mechanism of transient liquid phase bonding to soldering. During heating Bi will diffuse into the $Sn-3.5\%Ag$ solder and this results in decreasing soldering temperature. As bonding samples, the 1608 capacitor electroplated with Sn, and PCB, its surface was finished with electroless-plated Ni/Au, were selected. The $Sn-95.7\%Bi$ coated Sn-3.5Ag was supplied as a solder between the capacitor and PCB land. The samples were reflowed at $220^{\circ}C$, which was lower than that of normal reflow temperature, $240\~250^{\circ}C$, for the Pb-free. As experimental result, the joint of $Sn-95.7\%Bi$ coated Sn-3.5Ag showed high shear strength. In the as-reflowed state, the shear strength of the coated solder showed 58.8N, whereas those of commercial ones were 37.2N (Sn-37Pb), 31.4N (Sn-3Ag-0.5Cu), and 40.2N (Sn-8Zn-3Bi). After thermal shock of 1000 cycles between $-40^{\circ}C$ and $+125^{\circ}C$, shear strength of the coated solder showed 56.8N, whereas the previous commercial solders were in the range of 32.3N and 45.1N. As the microstructures, in the solder $Ag_3Sn$ intermetallic compound (IMC), and along the bonded interface $Ni_3Sn_4$ IMC were observed.

• Journal of Welding and Joining
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• 제30권5호
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2010년도 춘계학술발표대회 초록집
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• pp.79-79
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• 2010

저온용 무연 솔더의 대표 조성으로 고려되고 있는 Sn-58Bi(융점: $138^{\circ}C$) 공정(eutectic) 조성은 우수한 강도에도 불구하고 연성(ductility) 측면에서의 문제점이 지속적으로 보고되고 있다. 따라서 이 합금계의 연성을 최대로 개선시킬 수 있으면서도 실제 상용화가 가능한 합금 조성의 개발 연구가 요청된다. 본 연구에서는 Sn-Bi 2원계 조성에서 최대의 연성을 나타내는 것으로 보고된 Sn-40Bi 조성에 미량의 합금원소를 첨가함으로써 최대의 연성을 확보하는 한편, 그 연성 특성이 변형속도에 어느 정도 민감한지를 인장 실험을 통해 결정하고자 하였다. 합금원소로는 0.1~0.5 wt%의 Ag, Mn, In, Cu를 선택하였으며, 인장 시편을 제조하여 $10^{-2}$, $10^{-3}$, $10^{-4}\;s^{-1}$의 3종류로 변형속도를 변형시켜가며 응력-변형 곡선(stress-strain curve)을 측정하였고, 조성별, 변형속도별로 최대인장강도(ultimate tensile stress, UTS) 및 연신율 결과들을 정리하였다. 합금원소를 첨가한 조성의 경우는 모든 시험 조건에서 Sn-40Bi보다 우수한 연신률을 나타내는 것으로 측정되었으나, $10^{-2}\;s^{-1}$의 빠른 변형속도에서는 그 향상 정도가 상대적으로 감소하는 경향이 관찰되었다. 특히 Sn-40Bi-0.5Ag 조성의 경우 느린 변형속도에서 특히 눈에 띄는 연신률 값을 나타내며, 모든 변형속도 조건에서 가장 우수한 연성을 나타내었다. 한편 Sn-40Bi-0.1Cu 조성의 경우 변형속도에 따른 연신률의 변화 정도, 즉, 변형속도에 따른 연신률의 민감도가 매우 커 $10^{-4}\;s^{-1}$ 속도에서는 Sn-40Bi-0.5Ag에 버금가는 연신률 값이 측정되었으나, $10^{-2}\;s^{-1}$ 속도에서는 가장 나쁜 연신률 특성을 보여주었다. Sn-40Bi-0.2Mn 조성은 최고의 연신률 향상 특성을 나타내지는 않았으나, In을 첨가한 경우보다는 대체적으로 우수한 연성을 나타내었다. 이상의 각 합금별 연성 특성은 인장시험 전의 미세조직 관찰 결과와 인장시험 후 파면부의 조직변화 관찰 결과로부터 해석되었다. 그 결과 석출상의 형성 여부, 인장 시험 중 재결정 조직의 형성 여부, 라멜라(lamellar) 조직의 분율과 라멜라 간격(lamellar spacing)의 정도 또는 $\beta$-Sn과 라멜라 조직 사이의 결정립계와 라멜라 조직 내 결정립계에서의 슬라이딩 모드(sliding mode) 변형 정도, 석출상의 크기와 분포 정도 등이 연신률 및 변형속도 민감도와 같은 연성 특성에 가장 큰 영향을 미치는 인자인 것으로 분석되었다.

• Journal of Welding and Joining
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• 제31권3호
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• 박물관보존과학
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• 제10권
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• pp.1-13
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• 2009

국립부여박물관 소장 고려시대 범종은 일부가 결실된 상태이며, 표면은 부식물과 매장당시 고착된 흙, 먼지 등으로 곳곳이 오염된 상태이다. 동종의 분석 결과, 주요 성분으로 Cu 74.18%, Sn 9.58%, Pb 15.77%가 검출되었고 기타 미량성분으로 As, Fe, Sb, Bi, Ag가 확인되었다. 동종의 미세조직은 α상 기지에 부분적으로 흰색(α+δ)공석상이 관찰되고 곳곳에서 회색 개재물(S)과 검은색 개재물(Pb 편석)이 분포하였다. 동종의 안정적 보존을 위하여 보존처리를 실시하였다.

• 한국전기전자재료학회논문지
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• 제32권1호
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.28-31
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• 2001

Recently, in order to satisfy the consumer's demand the life cycle and the lead-time of a product is to be shortened. It is thus important to reduce the time and cost in manufacturing trial products. Several techniques have been developed and successfully commercialized in the market RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome this problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP process. HisRP is a combination process using high-speed machining technology with automatic filling. In filling process, Bi58-Sn alloy is chosen because of the properties of los-melting point, low coefficient of thermal expansion and enviromental friendship. Also the use of filling wire is of advantage in term of simple and flexible mechanism. Then the rapid manufacturing product, for example a skull, is machined for aluminum material by HisRP process with an automatic set-up device of 4-faces machining.

• 한국정밀공학회지
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• 제19권3호
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• pp.88-94
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• 2002

Recently, the life cycle and the lead-time of a product are to be shortened in order to satisfy consumer's demand. It is thus important to reduce the time and cost in manufacturing trial products. Several technique have been developed and successfully commercialized in the market of RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome these problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP(High-Speed RP) process. HisRP is a new RP process that is combined high-speed machining with automatic filling. In filling process, Bi58-Sn alloy is chosen as filling material because of the properties of low-melting point, low coefficient of thermal expansion and no harm to environment. Also the use of filling wire it if advantage since it needs simple and flexible mechanism. Then the rapid product, for example a skull, is manufactured for aluminum material by HisRP process with an automatic set-up device thor 4-faces machining.