Browse > Article
http://dx.doi.org/10.6117/kmeps.2013.20.2.017

Effects of Bonding Conditions on Mechanical Strength of Sn-58Bi Lead-Free Solder Joint using Thermo-compression Bonding Method  

Choi, Ji-Na (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Ko, Min-Kwan (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Lee, Sang-Min (SKKU Advanced Institute of Nanotechnology, Sungkyunkwan University)
Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.20, no.2, 2013 , pp. 17-22 More about this Journal
Abstract
We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.
Keywords
Thermo-compression bonding; PCB; solder; peel test; fracture energy;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 J. H. Choi, J. G. Lee, J. W. Yoon and S. B. Jung, "Thermocompression Bonding of Electrodes between RPCB and FPCB using Sn-Pb Solder (in Korean)", J. Microelectron. Packag. Soc., 17(3), 11 (2010)
2 J. G. Lee, M. K. Ko, J. B. Lee, B. I. Noh, J. W. Yoon and S, B. Jung, "Effects of Bonding conditions on Joint Property between FPCB and RPCB using Thermo-compression Bonding Method (in Korean)", J. Microelectron. Packag. Soc., 18(2), 63 (2011)
3 J. W. Yoon, J. K. Jang, J. H. Choi, J. G. Lee, J. B. Lee, B. I. Noh and S. B. Jung, "Thermo-compression Bonding of Electrodes between FPCB and RPCB", 12th Electronics Packaging Technology Conference (EPTC), Singapore, 811, IEEE Components(2010)
4 J. W. Yoon, J. G. Lee, J. B. Lee, B. I. Noh and S. B. Jung, "Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders", J Mater Sci: Mater Electron, 23, 41 (2012)   DOI
5 H. P. Shin, B. W. Ahn, J. H. Ahn, J. G. Lee, K. S. Kim, D. H. Kim and S. B. Jung, "Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate (in Korean)", Journal of KWJS, 30(5), 458 (2012)   과학기술학회마을   DOI   ScienceOn
6 K. Suganuma, "Advances in lead-free electronics soldering", Current Opinion in Solid State and Materials Science, 5, 55 (2001)   DOI   ScienceOn
7 K. O. Lee and J. Yu, "Effects of Surface Finishes on the Low Cycle Fatigue Characteristics of Sn-based Pb-free Solder Joints (in Korean)", J. Microelectron. Packag. Soc., 10(3), 19 (2003)
8 "Lead-Free Alloy Trends for the Assembly of Mixed Tech-nology PWBs", Proc. NEPCON-West 2000, Anaheim, CA, (2000)