Effects of Bonding Conditions on Mechanical Strength of Sn-58Bi Lead-Free Solder Joint using Thermo-compression Bonding Method |
Choi, Ji-Na
(School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Ko, Min-Kwan (School of Advanced Materials Science and Engineering, Sungkyunkwan University) Lee, Sang-Min (SKKU Advanced Institute of Nanotechnology, Sungkyunkwan University) Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University) |
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