Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate
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Shin, Hyun-Pil
(Chungsol C&E CO., LTD.)
Ahn, Byung-Wook (School of Advanced Materials Science and Engineering, Sungkyunkwan University) Ahn, Jee-Hyuk (Advanced Characteriazation and Analysis Department, Korea Institute of Materials Science) Lee, Jong-Gun (School of Advanced Materials Science and Engineering, Sungkyunkwan University) Kim, Kwang-Seok (SKKU Advanced Institute of Nanotechnology (SAINT), Sungkyunkwan University) Kim, Duk-Hyun (Department of Chemcal Engineering & Biotechnology, Korea Polytechnic University) Jung, Seung-Boo (School of Advanced Materials Science and Engineering, Sungkyunkwan University) |
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