1 |
W.J. Plumbirdge et al.. J. Elec. Mater.. 30. (2001) 1178
DOI
ScienceOn
|
2 |
T.M. Korhonen et al.. IEEE Trans. on Adv. Pack. 24-4. (2001) 515
DOI
|
3 |
S. Kou: Welding Metallurgy. Wiley-Interscience. N.J.. 2003
|
4 |
E. Lugscheider et al.. Surf. Coat. Tech. 704 (2003). 174
|
5 |
L. Xiao et al.. IEEE International Symposium on Advanced Packaging Materials. 2000. 145
DOI
|
6 |
T. Reinikainen et al.. Metallug, Trans. A, 30A (1999). 123
|
7 |
X.Qiao et al., Mater. Sci. Eng A283. 2000. 38
DOI
ScienceOn
|
8 |
C.H. Reader et al.. J. Elec. Mater.. 28 (1999). 1045
DOI
|
9 |
Thaddeus B. Massalski : Binary alloy phase diagrams American society for metals. Ohio. 1986
|
10 |
Min-Suk Suh et al., J. Kor. Inst. Met. & Mater, 40 (2002), 74
|
11 |
J.S. Lee et al.. Material transactions,45. (2004). 783
DOI
ScienceOn
|
12 |
I.T. Poku et al., Metall. Trans. A19A. 675 (1988)
|
13 |
A.C.Tan : Tin and Solder Plating in the semiconductor Industry, Chapman & Hall. London. 1993, 23
|
14 |
J. Glazer. J. Elec. Mater.. 23-8 (1994), 673
|
15 |
W.J. Tomlinson et al .. J. Mater. Sci. 22 (1987). 1835
DOI
ScienceOn
|
16 |
J. S. Hwang : environment-frendliy electronics: Lead-free technology Electrochemical publications ltd. 2001
|
17 |
Akio Hirose et al., Material transaction, 42-5 (2001), 794
DOI
ScienceOn
|