Study on Joint of Micro Solder Bump for Application of Flexible Electronics |
Ko, Yong-Ho
(Advanced Welding and Joining Technology Center, KITECH)
Kim, Min-Su (Advanced Welding and Joining Technology Center, KITECH) Kim, Taek-Soo (Dept. of Mechanical Engineering, KAIST) Bang, Jung-Hwan (Advanced Welding and Joining Technology Center, KITECH) Lee, Chang-Woo (Advanced Welding and Joining Technology Center, KITECH) |
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