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http://dx.doi.org/10.4313/JKEM.2019.32.1.6

Evaluation of Bonding Properties of Epoxy Solder Joints by High Temperature Aging Test  

Kang, Min-Soo (Department of Mechanical Engineering, Chung-Ang University)
Kim, Do-Seok (Department of Mechanical Engineering, Chung-Ang University)
Shin, Young-Eui (Department of Mechanical Engineering, Chung-Ang University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.32, no.1, 2019 , pp. 6-12 More about this Journal
Abstract
Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.
Keywords
Epoxy solder; Lead-free solder; Thermal aging; Intermetallic compound layer;
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