1 |
S. W. Jung, M. S. Kang, Y. J. Jeon, D. S. Kim, and Y. E. Shin, J. Korean Inst. Electr. Electron. Mater. Eng., 29, 152 (2016). [DOI: https://doi.org/10.4313/JKEM.2016.29.3.152]
DOI
|
2 |
Y. J. Jeon, S. I. Son, D. S. Kim, and Y. E. Shin, J. Korean Inst. Electr. Electron. Mater. Eng., 23, 611 (2010). [DOI: https://doi.org/10.4313/JKEM.2010.23.8.611]
DOI
|
3 |
A. S. Shin, D. Y. Ok, G. H. Jeong, M. J. Kim, C. S. Park, J. H. Kong, and C. H. Heo, J. Korean Inst. Electr. Electron. Mater. Eng., 23, 481 (2010). [DOI: https://doi.org/10.4313/JKEM.2010.23.6.481]
DOI
|
4 |
E. G. Chang, N. H. Kim, N. K. Kim, and J. C. Eom, J. Korean Inst. Electr. Electron. Mater. Eng., 17, 267 (2004). [DOI: https://doi.org/10.4313/JKEM.2004.17.3.267]
DOI
|
5 |
M. N. Ervina Efzan and I. Siti Norfarhani, Trans. Electr. Electron. Mater., 16, 112 (2015). [DOI: https://doi.org/10.4313/TEEM.2015.16.3.112]
DOI
|
6 |
P. L. Tu, Y. C. Chan, and J.K.L. Lai, IEEE Trans. Compon., Packag., Manuf. Technol., Part B, 20, 87 (1997). [DOI: https://doi.org/10.1109/96.554534]
DOI
|
7 |
X. Ma, Y. Qian, and F. Yoshida, J. Alloys Compd., 334, 224 (2002). [DOI: https://doi.org/10.1016/S0925-8388(01)01747-9]
DOI
|
8 |
M. S. Kang, Y. J. Jeon, D. S. Kim, and Y. E. Shin, Int. J. Precis. Eng. Manuf., 17, 445 (2016). [DOI: https://doi.org/10.1007/s12541-016-0055-3]
DOI
|
9 |
M. S. Kang, Y. J. Jeon, D. S. Kim, and Y. E. Shin, Int. J. Precis. Eng. Manuf., 16, 2483 (2015). [DOI: https://doi.org/10.1007/s12541-015-0319-3]
DOI
|
10 |
K. Y. Kim, H. Jeong, W. R. Myung, and S. B. Jung, J. Weld. Joining, 36, 14 (2018). [DOI: https://doi.org/10.5781/JWJ.2018.36.2.3]
DOI
|
11 |
B. S. Yim, Y. Kwon, S. H. Oh, J. Kim, Y. E. Shin, S. H. Lee, and J. M. Kim, Microelectron. Reliab., 52, 1165 (2012). [DOI: https://doi.org/10.1016/j.microrel.2011.12.004]
DOI
|
12 |
Y. G. Sung, W. R. Myung, H. Jeong, M. K. Ko, J. Moon, and S. B. Jung, J. Electron. Mater., 47, 4165 (2018). [DOI: https://doi.org/10.1007/s11664-018-6224-7]
DOI
|
13 |
X. Deng, R. S. Sidhu, P. Johnson, and N. Chawla, Metall. Mater. Trans. A, 36, 55 (2005). [DOI: https://doi.org/10.1007/s11661-005-0138-8]
DOI
|
14 |
I. E. Anderson and J. L. Harringa, J. Electron. Mater., 33, 1485 (2004). [DOI: https://doi.org/10.1007/s11664-004-0090-1]
DOI
|
15 |
M. Yang, M. Li, L. Wang, Y. Fu, J. Kim, and L. Weng, J. Electron. Mater., 40, 176 (2011). [DOI: https://doi.org/10.1007/s11664-010-1430-y]
DOI
|
16 |
I. Cho, J. H. Ahn, J. W. Yoon, Y. E. Shin, and S. B. Jung, J. Mater. Sci.: Mater. Electron., 23, 1515 (2012). [DOI: https://doi.org/10.1007/s10854-012-0621-0]
DOI
|
17 |
A. Sharma, Y. J. Jang, J. B. Kim, and J. P. Jung, J. Alloys Compd., 704, 795 (2017). [DOI: https://doi.org/10.1016/j.jallcom.2017.02.036]
DOI
|