• 한국진공학회지
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• 제17권5호
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• pp.394-399
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• 2008

산화규소막에 Octadecyltrichlorosilane (OTS)로 자기조립층을 형성하기 전후에 펜타신을 흡착하여 광전자분광기술 및 광전현미경을 이용하여 전자구조 및 분자성장을 비교 관찰하였다. OTS처리한 경우 펜타신과 기판사이의 상호작용이 비교적 약하여 펜타신의 표면 확산이 활발하고 펜타신끼리 서로 뭉쳐서 성장함으로써, 시료와 펜타신의 에너지준위 정렬을 나타내는 HOMO 오프셋 값이 계속적으로 변하는 결과를 가져온다. 이에 반해 산화규소막 위에서는 펜타신이 기판과 비교적 강하게 결합하여 초기부터 에너지준위 정렬값에 크게 기여를 하고 두께가 증가해도 그 변화는 미미하다.

• 한국결정성장학회지
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• 제3권1호
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• pp.1-11
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• 1993

초크랄스키 법에 의한 실리콘 단결정 성장시 액상내의 난류 특성 억제 및 산소, 첨가제 등의 제어를 위해 보통 자기장을 걸어주고 있으며 본 연구에서는 축방향 자기장을 걸어주었을 경우 나타나는 자장의 효과를 수치적으로 계산하였다. 자기력의 증가에 따라 액상내의 유속의 크기는 상당히 억제되었다. 자장의 크기가 증가함에 따라 중심축 부근에서 상승하는 유동의 속도가 감소하기 때문에 S/L 응고계면은 점점 평탄해졌으며, B=0.3 Tesla에서 액상내의 온도 분포는 중심축 부근을 제외하고는 오직 전호 효과로만 계산된 결과와 거의 유사하였다. 또한 고상 및 액상 표면을 통한 열방출량 중 Ar 가스에 의한 열방출량은 3% 미만이었으며 대부분의 열량은 복사를 통해 방출되었다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.128-133
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• 1999

In recent years, LSI devices have become more powerful and lower-priced, caused by a development of various wafer materials and an increase in the diameter of wafers. On the other hand, these have created some serious problems in manufacturing of wafers because materials used as semiconductor substrate are very brittle. In view of this fact, there are some trials to apply shear-mode(or ductile-mode) grinding for efficient manufacturing of semiconductor wafers instead of conventional lapping process. In fact grinding process that has not only more excellent degree of accuracy but also more adaptable to fully automated manufacturing than lapping, is already used in Si machining field. This paper described the elementary studies to establish the grinding technology of wafers. First, we investigated the variation of grinding force and the transition of grinding mode as various grinding conditions. Then, it was inspected that the change of grinding force affected the integrity such as the topography and the roughness of ground surfaces, and led to the chemical defects generation and distribution in damaged layer. The degree of defects was estimated by FT-IR(Fourier Transformed Infrared) Spectroscopy and Auger Electron Spectroscopy

• 한국표면공학회지
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• 제49권1호
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• pp.104-109
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• 2016

Graphite's thermal stability facilitates its widespread use as crucibles and molds in high temperatures processes. However, carbon atoms can be rather easily detached from pores and outer surfaces of the graphite due to the weak molecular force of the c axis of graphites. Detached carbon atoms are known to become a source of dust during fabrication processes, eventually lowering the effective yield of products. As an effort to reduce these problems of dust scattering, we have fabricated SiC composites by employing Si vapor infiltration method into the pores of graphites. In order to understand the diffusion process of the Si vapor infiltration, Si and C atomic percentages of fabricated SiC composites are carefully measured and the diffusion law is used to estimate the diffusion coefficient of Si vapor. A quadratic equation is obtained from the experimental results using the least square method. Diffusion coefficient of Si vapor is estimated using this quadratic equation. The result shows that the diffusion length obtained through the Si vapor infiltration method is about 10.7 times longer than that obtained using liquid Si and clearly demonstrates the usefulness of the present method.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.7-8
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• 2007

We investigated the characteristics of UTB-SOI pMOSFETs with SOI thickness ($T_{SOI}$) ranging from 10 nm to 1 nm and evaluated the dependence of electrical characteristics on the silicon surface orientation. As a result, it is found that the subthreshold characteristics of (100)-surface UTB-SOI pMOSFETs were superior to (110)-surface. However, the hole mobility of (110)-surface were larger than that of (100)-surface. The enhancement of effective hole mobility at the effective field of 0.1 MV/ccm was observed from 3-nm to 5-nm SOI thickness range.

• Applied Science and Convergence Technology
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• 제26권6호
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• pp.208-213
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• 2017

Flexible opto-electronic devices are developed on the insulating layer deposited stainless steel (STS) substrates. The silicon dioxide ($SiO_2$) material as the diffusion barrier of Fe and Cr atoms in addition to the electrical insulation between the electronic device and STS is processed using the plasma enhanced chemical vapor deposition method. Noble silver (Ag) films of approximately 100 nm thickness have been formed on $SiO_2$ deposited STS substrates by E-beam evaporation technique. The films then were annealed at $650^{\circ}C$ for 20 min using the rapid thermal annealing (RTA) technique. It was investigated the variation of the surface morphology due to the interaction between Ag films and $SiO_2$ layers after the RTA treatment. The results showed the movement of Si atoms in silver film from $SiO_2$. In addition, the structural investigation of Ag annealed at $650^{\circ}C$ indicated that the Ag film has the material property of p-type semiconductor and the bandgap of approximately 1 eV. Also, the films annealed at $650^{\circ}C$ showed reflection with sinusoidal oscillations due to optical interference of multiple reflections originated from films and substrate surfaces. Such changes can be attributed to both formation of $SiO_2$ on Ag film surface and agglomeration of silver film between particles due to annealing.

• Structural Engineering and Mechanics
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• 제62권6호
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• pp.771-780
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• 2017

In this study, free vibration and damping behaviors of multilayered symmetric sandwich beams and single layered beams made of Functionally Graded Materials were investigated, experimentally and numerically. The beams were composed of Aluminum and Silicon Carbide powders and they were produced by powder metallurgy. Three beam models were used in the experiments. The first model was isotropic, homogeneous beams produced by using different mixing ratios. In the second model, the pure metal layers were taken in the middle of the beam and the weight fraction of the ceramic powder of each layer was increased towards to the surfaces of the beam in the thickness direction. In the third model, the pure metal layers were taken in the surfaces of the beam and the weight fraction of the ceramic powder of each layer was increased towards to middle of the beam. Then the vibration tests were performed. Consequently, the effects of stacking sequence and mixing ratio on the natural frequencies and damping responses of functionally graded beams were discussed from the results obtained. Furthermore, the results obtained from the tests were supported with a finite-element-based commercial program, and it was found to be in harmony.

• International Journal of Precision Engineering and Manufacturing
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• 제9권1호
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• pp.25-29
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• 2008

We introduce a new fabrication process for antireflective structured surfaces. A 4-inch silicon wafer was dipped in a suspension of 300-nm-diameter silica particles dispersed in a toluene solution. When the wafer was drawn out of the suspension, a hexagonally packed monolayer structure of particles self-assembled on almost the complete wafer surface. Due to the simple process, this could be applied to micro- and nano-patterning. The self-assembled silica particles worked as a mask for the subsequent reactive ion etching. An array of nanometer-sized pits could be fabricated since the regions that correspond to the small gaps between particles were selectively etched off. As etching progressed, the pits became deeper and combined with neighboring pits due to side-etching to produce an array of cone-like structures. We investigated the effect of etching conditions on antireflection properties, and the optimum shape was a nano-cone with height and spacing of 500 nm and 300 nm, respectively. This nano-structured surface was prepared on a $30\;{\times}\;10-mm$ area. The reflectivity of the surface was reduced 97% for wavelengths in the range 400-700 nm.

• 한국정밀공학회지
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• 제26권6호
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• pp.50-58
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• 2009

Micro laser fabrication techniques can potentially be used for the manufacture of microstructures on the thin flat surfaces with large diameter that are frequently used in semiconductor industries. However, the large size of wafers can cause the degraded machining accuracy of the surface because it can be tilted or distorted by geometric errors of machines or the holding fixtures, etc. To overcome these errors the off-line focusing error compensation method is proposed. By using confocal autofocus system, the focusing error profile of machined surface is measured along the pre-determined path and can be compensated at the next machining process by making the corrected motion trajectories. The experimental results for silicon wafers and invar flat surfaces show that the proposed method can compensate the focusing error within the level of below $6.9{\mu}m$ that is the depth of focus required for the laser micromachining process.

• Tribology and Lubricants
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• 제18권1호
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• pp.1-8
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• 2002

Nano adhesion and friction between a $Si_{3}N_{4}$ AFM(atomic force microscope) tip and thin silver films were experimentally studied. Tests were performed to measure the nano adhesion and friction in both AFM and LFM(lateral force microscope) modes in various range of normal loads. Thin silver films deposited by IBAD (ion beam assisted deposition) on Si-wafer (100) and other Si-wafers of different surface roughness were used. Results showed that nano adhesion and friction decreased with the surface roughness. When the Si surfaces were coated by pure silver, the adhesion and friction decreased. But the adhesion and friction were not affected by the thickness of IBAD silver coating. As the normal force increased, the adhesion forces of bare Si-wafer and IBAD silver coating film remained constant, but the friction forces increased linearly. Test results suggested that the friction was mainly governed by the adhesion as long as the load was low.