• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.11
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• pp.20-25
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• 2007

In this paper, It was reported the dielectric constant in organic inorganic hybrid silica material such as SiOC film modeling of bond structure by annealing in organic properties. The organic inorganic hybrid silica material were deposited using bis-trimethylsilymethane (BTMSM, [(CH3)3Si]2CH2) and oxygen gas precursor by a plasma chemical vapor deposition (CVD). The organic inorganic hybrid silica material have three types according to the deposition condition. The dielectric constant of the films were performed MIS(Al/Si-O-C film/p-Si) structure. The C 1s spectra in organin inorganic silica materials with the flow rate ratio of O2/BTMSM=1.5 was organometallic carbon with the peak 282.9 eV by XPS. It means that organometallic carbon component is the cross-link bonding structure with good stability. The dielectric constant was the lowest at annealed films with cross-link bonding structure.

• Journal of the Korean Ceramic Society
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• v.46 no.1
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• pp.10-15
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• 2009

We have fabricated silicon-rich silica thin films via RF magnetron sputtering using a SiO target. Thickness evolution and microstructure change of such $SiO_x$ (1$SiO_x$ thin films turned out to be mainly responsible for the increase of refractive index.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.33-36
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• 2005

Colloidal Silica(CS)/silane sol solutions were prepared in variation with synthesizing parameters such as ratio of CS to silane and reaction time. In the case of LHSA CS/tetramethoxysilane(TMOS)/methyltrimethoxysilane(MTMS) CS/silane sol, coating film had stable contact angle with increasing reaction time excepting for 48hours. Also, the LHSA CS/TMOS/MTMS coating film had more enhanced flat surface with increasing the amount of MTMS and increasing reaction time. In the case of thermal stability, thermal dissociation of LHSA CS/MTMS sol did not occur up to $550^{\circ}C$.

• Journal of Integrative Natural Science
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• v.3 no.4
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• pp.219-225
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• 2010

On the surface of mesoporous silica thin films (MSTF) which were fabricated by sol-gel approach there are existences of water and three different silanol types including chained, germinal and isolated silanol. Their amounts changes as a function of aging time of used sol solution, as confirmed by FT-IR. The adsorbed water generates ionic carriers such as H+ and OH- and passivates the Si dangling bonds at the interface of silicon wafer-MSTF. The ionic carriers can not only transport across the thickness of thin film to enhance the leakage current but also diffuse toward the silicon wafer-MSTF interface to depassivate Si dangling bonds. On the other hand, chained silanols or germinal silanols promote the moisture adsorption of MSTF and tend to form strongly hydrogen bonded systems with adsorbed water molecules resulting in very high dielectric constant. Isolated silanol, on the contrary, affects less on electrical properties of thin film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.675-678
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• 2000

Using the principle of the cross capacitor, a precise system for measuring the electric constants of liquids has been developed. The four electrodes of the cross capacitor were formed around fused-silica tube by plating a gold film. The effect of a non-uniform tube wall ok the measured permittivity was investigated As the individual characteristics of the tubes were determined to be constant, the pure dielectric constants extracted from any effect of the fused-silica material could be precisely derived with uncertainty of less than ${\pm}$ 0.02∼0.05 %.

• Applied Chemistry for Engineering
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• v.30 no.1
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• pp.68-73
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• 2019

We prepared hydrophobic silica particles by a sol-gel process from tetraethyl orthosilicate (TEOS), followed by coupling the reaction with octyltrimethoxysilane (OTMS) or hexadecyltrimethoxysilane (HDTMS) under various reaction conditions. We confirmed the extent of silica surface modification with organic compounds by SEM-EDS, thermogravimetry and elemental analysis. The silica particles obtained after the hydrolysis reaction of TEOS in ethanol at $50^{\circ}C$ for 24 h and the coupling reaction with OTMS for 2 h at the same temperature displayed the optimum performance in terms of the dispersity in an organic solvent and the surface roughness of films composited with epoxy resins. The oxygen permeability of the composite film with modified-silica was 12% lower than that of using the film without modified-silica.

• Bulletin of the Korean Chemical Society
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• v.35 no.11
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• pp.3336-3338
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• 2014

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.272-277
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• 2004

The primary aim of this study is to investigate new semi-abrasive free slurry including acid colloidal silica and hydrogen peroxide for copper chemical-mechanical planarization (CMP). In general, slurry for copper CMP consists of colloidal silica as an abrasive, organic acid as a complex-forming agent, hydrogen peroxide as an oxidizing agent, a film forming agent, a pH control agent and several additives. We developed new semi-abrasive free slurry (SAFS) including below 0.5％ acid colloidal silica. We evaluated additives as stabilizers for hydrogen peroxide as well as accelerators in tantalum nitride CMP process. We also estimated dispersion stability and Zeta potential of the acid colloidal silica with additives. The extent of enhancement in tantalum nitride CMP was verified through anelectrochemical test. This approach may be useful for the application of single and first step copper CMP slurry with one package system.

• Korean Journal of Materials Research
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• v.9 no.4
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• pp.414-418
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• 1999

Typical metal oxide thin films having optical and electrical properties are widely used as inorganic functional materials. Liquid phase deposition(LPD) method, a new low temperature process, has been developed for the several advantages of no vacuum system, low cost, high throughput, and low processing temperature(<$50^{\circ}C$). Silica powder was added to 40wt% hydrofluoro-silicic acid($H_2$SiF\ulcorner) to obtain an immersing solution of silica-saturated hydrofluorosilicic acid solution. Boric acid solution was continuously added in the range from 0 to 0.05M to prepare supersaturated hydrofluorosilicic acid solution. LPD $SiL_2$film was formed with the variation of added amount of $H_2$O. The SiO$_2$thin film could be prepared from hydrofluorosilicic acid by LPD method. The thickness of LPD $_SiO2$film was influenced by the boric acid concentration and added amount of $H_2$O. Silicon in thin film existed as SiF\ulcorner by Raman spectrum.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1212-1215
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• 2004

Diffraction modes of holographic grating were fabricated with polyurethane acrylates(PUA). Two types of silica (AEROSIL 200 and AEROSIL R812) were added to reduce the shrinkage of polymer matrix. It was founded that shrinkage of PUA composite film was reduced with the addition of silica. HPDLC based PUA/silica composite also showed high diffraction efficiency. The morphology of the resultant gratings was analyzed by using scanning electron microscopy(SEM) and Tg of the polymer matrix by dynamic mechanical thermal analysis(DMTA).