Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2005.05b
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- Pages.33-36
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- 2005
Properties of Sol-Gel Materials Containing Colloidal Silica Silane
콜로이드 실리카 실란을 함유한 졸겔반응 코팅제 특성연구
-
Kang, Dong-Pil
(Korea Electrotechnology Research Institute)
;
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Ahn, Myeong-Sang
(Korea Electrotechnology Research Institute)
;
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Na, Moon-Kyong
(Korea Electrotechnology Research Institute)
;
- Myung, In-Hye (Korea Electrotechnology Research Institute) ;
-
Kang, Young-Taec
(Korea Electrotechnology Research Institute)
- Published : 2005.05.27
Abstract
Colloidal Silica(CS)/silane sol solutions were prepared in variation with synthesizing parameters such as ratio of CS to silane and reaction time. In the case of LHSA CS/tetramethoxysilane(TMOS)/methyltrimethoxysilane(MTMS) CS/silane sol, coating film had stable contact angle with increasing reaction time excepting for 48hours. Also, the LHSA CS/TMOS/MTMS coating film had more enhanced flat surface with increasing the amount of MTMS and increasing reaction time. In the case of thermal stability, thermal dissociation of LHSA CS/MTMS sol did not occur up to