• Title/Summary/Keyword: SiH+

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Analytical Breakdown Voltage for 4H-SiC ${p^+}$ Junction (4H-SiC ${p^+}$접합의 해석적 항복 전압)

  • Jeong, Yong-Seong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.39 no.1
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    • pp.12-17
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    • 2002
  • In this paper, an effective ionization coefficient for 4H-SiC is extracted in the form of c .E$^{m}$ from ionization coefficients of electron and hole. Analytical expressions for critical electric field and breakdown voltage of 4H-SiC p$^{+}$n junction are derived by employing the effective ionization coefficient. The analytic results agree well with the experimental ones reported within 10% in error for the doping concentration in the range of 10$^{15}$ cm$^{-3}$ ~10$^{18}$ cm$^{-3}$ . .

Analytical Model of Breakdown Voltages for 6H-SiC $p^{+}n$ Junction (6H-SiC $p^{+}n$ 접합의 항복 전압을 위한 해석적 모형)

  • Jeong, Yong-Seong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.6
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    • pp.398-403
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    • 2001
  • In this paper, effective ionization coefficient for 6H-SiC is determined. Analytical formulas for the parallel plane breakdown voltage of the 6H-SiC p+n junction are derived by employing the ionization coefficients. The analytical breakdown voltages show good agreement with the numerical results of Dmitriev's[3]and the experimental results of Cree Research[9]over the doping range from 10$^{15}$ cm$^{-3}$ to 10$^{18}$ cm$^{-3}$.

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Changes of Chemical Concentrations during Pulsed Plasma Process of Silane (실란 펄스 플라즈마 공정에서의 화학농도 변화)

  • Kim, Dong-Joo;Kim, Kyo-Seon
    • Journal of Industrial Technology
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    • v.25 no.A
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    • pp.141-149
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    • 2005
  • We investigated numerically the evolutions of several chemical species which are important for film growth and particle generation in the pulsed $SiH_4$ plasmas. During the plasma-on, the $SiH_x$ concentration increases with time mainly by the generation reaction from $SiH_4$, but, during the plasma-off, decreases because of the hydrogen adsorption reaction. During the plasma-on, the concentrations of negative ions increase with time by the polymerization reactions of negative ions and those become almost zero in the sheath regions because of the electrostatic repulsion. During the plasma-off, the concentrations of negative ions decrease with time by the neutralization reactions with positive ions and some negative ions can diffuse toward the sheath regions because there is no electric field inside the reactor. The polymerized negative ions of higher mass can be reduced successfully by using the pulsed plasma process.

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A study on optimization of front TCO for a-Si:H/c-Si heterojunction solar cells (a-Si:H/c-Si 이종접합 태양전지용 전면 투명전도막 최적화 연구)

  • Jeong, Daeyoung;Song, Junyong;Kim, Kyungmin;Park, Joo Hyung;Song, Jinsoo;Lee, Hi-Deok;Lee, JeongChul
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.05a
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    • pp.129.1-129.1
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    • 2011
  • a-Si:H/c-Si 구조의 이종접합 태양전지 전면 투명전도막으로 Indium tin oxide(ITO) 박막의 조건에 따라 태양전지 특성을 연구하였다. ITO 박막은 파우더 타겟으로 마그네트론 스퍼터링 방식으로 성막하였고, 증착 온도(Ts)에 따라 전기적, 광학적 특성을 비교, 분석하였다. 기판 증착 온도가 증가할수록 박막의 저항이 낮아지는 것으로 나타났으며 $350^{\circ}C$ 조건에서 가장 낮은 저항($34.2{\Omega}$/sq)을 보였다. 투과도 또한 기판 증착 온도가 올라갈수록 전반적인 향상을 나타냈다. a-Si:H/c-Si 기판의 MCLT(minority carrier lifetime)는 $350^{\circ}C$에서 최적($359{\mu}s$)의 결과를 나타냈다. 그 이상의 기판 온도에서는 오히려 감소하였는데, 이는 높은 온도에서의 a-Si:H/c-Si 계면의 열손상으로 판단된다.

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Anneal Temperature Effects on Hydrogenated Thin Film Silicon for TFT Applications

  • Ahn, Byeong-Jae;Kim, Do-Young;Yoo, Jin-Su;Junsin Yi
    • Transactions on Electrical and Electronic Materials
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    • v.1 no.2
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    • pp.7-11
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    • 2000
  • a-Si:H and poly-Si TFT(thin film transistor) characteristics were investigated using an inverted staggered type TFT. The TFT an as-grown a-Si:H exhibited a low field effect mobility, transconductance, and high gate threshold voltage. The poly-Si films were achieved by using an isothermal and RTA treatment for glow discharge deposited a-Si:H films. The a-Si:H films were cystallized at the various temperature from 600$^{\circ}C$ to 1000$^{\circ}C$. As anneal temperature was elevated, the TFT exhibited increased g$\sub$m/ and reduced V$\sub$ds/. V$\sub$T/. The poly-Si grain boundary passivation with grain boundary trap types and activation energies as a function of anneal temperature. The poly-si TFT showed an improved I$\sub$nm//I$\sub$off/ ratio of 10$\^$6/, reduced gate threshold voltage, and increased field effect mobility by three orders.

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The role of porous graphite plate for high quality SiC crystal growth by PVT method (고품질 4H-SiC 단결정 성장을 위한 다공성 흑연 판의 역할)

  • Lee, Hee-Jun;Lee, Hee-Tae;Shin, Hee-Won;Park, Mi-Seon;Jang, Yeon-Suk;Lee, Won-Jae;Yeo, Im-Gyu;Eun, Tai-Hee;Kim, Jang-Yul;Chun, Myoung-Chul;Lee, Si-Hyun;Kim, Jung-Gon
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.25 no.2
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    • pp.51-55
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    • 2015
  • The present research is focused on the effect of porous graphite what is influenced on the 4H-SiC crystal growth by PVT method. We expect that it produces more C-rich and a change of temperature gradient for polytype stability of 4H-SiC crystal as adding the porous graphite in the growth cell. The SiC seeds and high purity SiC source materials were placed on opposite side in a sealed graphite crucible which was surrounded by graphite insulator. The growth temperature was around $2100{\sim}2300^{\circ}C$ and the growth pressure was 10~30 Torr of an argon pressure with 5~15 % nitrogen. 2 inch $4^{\circ}$ off-axis 4H-SiC with C-face (000-1) was used as a seed material. The porous graphite plate was inserted on SiC powder source to produce a more C-rich for polytype stability of 4H-SiC crystal and uniform radial temperature gradient. While in case of the conventional crucible, various polytypes such as 6H-, 15R-SiC were observed on SiC wafers, only 4H-SiC polytype was observed on SiC wafers prepared in porous graphite inserted crucible. The defect level such as MP and EP density of SiC crystal grown in the conventional crucible was observed to be higher than that of porous graphite inserted crucible. The better crystal quality of SiC grown using porous graphite plate was also confirmed by rocking curve measurement and Raman spectra analysis.

Thermodynamic analysis of the deposition process of SiC/C functionally gradient materials by CVD technique (CVD법을 이용한 SiC/C경사기능재료 증착공정의 열역학적 해석)

  • 박진호;이준호;신희섭;김유택
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.12 no.2
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    • pp.101-109
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    • 2002
  • A complex chemical equilibrium analysis was performed to study the hot-wall CVD process of the SiC/C functionally gradient materials (FGM). Thermochemical calculations of the Si-C-H-Cl system were carried out, and the effects of process variables(deposition temperature, reactor pressure, C/[Si+C] and H/[Si+C] ratios in the source gas) on the composition of deposited layers and the deposition yield were investigated. The CVD phase diagrams of the SiC/C FGM deposition were obtained, and the optimum process windows were estimated from the results.

Low Temperature Deposition of Microcrystalline Silicon Thin Films for Solar Cells (태양전지용 미세결정 실리콘 박막의 저온 증착)

  • Lee, J.C.;Yoo, J.S.;Kang, K.H.;Kim, S.K.;Yoon, K.H.;Song, J.;Park, I.J.
    • Proceedings of the KIEE Conference
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    • 2002.07c
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    • pp.1555-1558
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    • 2002
  • This paper presents deposition and characterizations of microcrystalline silicon(${\mu}c$-Si:H) films prepared by hot wire chemical vapor deposition at substrate temperature below $300^{\circ}C$. The $SiH_4$ Concentration$[F(SiH_4)/F(SiH_4)+F(H_2)]$ is critical parameter for the formation of Si films with microcrystalline phase. At 6% of silane concentration, deposited intrinsic ${\mu}c$-Si:H films shows sufficiently low dark conductivity and high photo sensitivity for solar cell applications. P-type ${\mu}c$-S:H films deposited by Hot-Wire CVD also shows good electrical properties by varying the rate of $B_2H_6$ to $SiH_4$ gas. The solar cells with structure of Al/nip ${\mu}c$-Si:H/TCO/glass was fabricated with sing1e chamber Hot-Wire CVD. About 3% solar efficiency was obtained and applicability of HWCVD for thin film solar cells was proven in this research.

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Isotope Effects on Vapor Pressure (증기압에 미치는 동위원소 효과)

  • Youngie Oh;Mu Shik Jhon
    • Journal of the Korean Chemical Society
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    • v.21 no.2
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    • pp.75-82
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    • 1977
  • The isotope effect of pure liquid on vapor pressure is examined, and the vapor pressure ratios of two different isotopes are calculated. Based on the Significant Structure Theory of Liquids, the effect of molecular weight and the effect of moments of inertia are dominant in ordinary/trans-$d_2$ ethylene isotopes; the effect of hindered rotational zero-point energy is dominant in trans-$d_2$/cis-$d_2$ ethylene isotopes; and the effect of intermolecular potential difference is found in $CH_3OH/CH_3OD$ isotopes. In the isotopes of $CH_4/CD_4,\;SiH_4/SiD_4\;and\;GeH_4/GeD_4$, the weight effect decrease in the order of $CH_4/CD_4 >SiH_4/SiD_4 >GeH_4/GeD_4$.

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Establishment of Optimal {100} Si Etching Condition for $N_2H_4-H_2O$ Solutions and Application to Electrochemica Etching ($N_2H_4-H_2O$용액의 {100} Si에 대한 최적식각조건의 설정과 전기화학적 식각에의 응용)

  • 주병권;이윤호;김병곤;오명환
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.26 no.11
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    • pp.1686-1690
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    • 1989
  • Using the anisotropic etching characteristics of N2H4-H2O solutions, Si diaphragm was fabricated for the integrated sensors. The optimal composition and temperature of the etching solution in (100) Si etching process was established to be 50mol% N2H4 in H2O at 105\ulcorner\ulcorner for both higher etch rate (=2.6\ulcorner/min) and better surface quality of etched (100) planes. Based on the above optimal etching condition, the electrochemical etch-stop technique was employed to form n-type Si diaphragm having a thickness of 20\ulcorner and the thickness of diapragm could exactly be controlled to 20\ulcorner\ulcorner.

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