• Earthquakes and Structures
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• 제11권4호
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• pp.649-664
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• 2016

A seismic damaged bridge may be hit again by a strong aftershock or another earthquake in a short interval before the repair work has been done. However, discussions about the impact of the unrepaired damages on the residual earthquake resistance of a steel bridge are very scarce at present. In this paper, nonlinear time-history analysis of a steel arch bridge was performed using multi-scale hybrid model. Two strong historical records of main shock-aftershock sequences were taken as the input ground motions during the dynamic analysis. The strain response, local deformation and the accumulation of plasticity of the bridge with and without unrepaired seismic damage were compared. Moreover, the effect of earthquake sequence on crack initiation caused by low-cycle fatigue of the steel bridge was investigated. The results show that seismic damage has little impact on the overall structural displacement response during the aftershock. The residual local deformation, strain response and the cumulative equivalent plastic strain are affected to some extent by the unrepaired damage. Low-cycle fatigue of the steel arch bridge is not induced by the earthquake sequences. Damage indexes of low-cycle fatigue predicted based on different theories are not exactly the same.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.35-41
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• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• Asian Pacific Journal of Cancer Prevention
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• 제13권5호
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• pp.2185-2191
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• 2012

Background: Prevalence of Barrett's esophagus (BE) in Luoyang, China, has not been reported, and its pathogenesis is controversial. The aim of this study was therefore to investigate the prevalence of BE and its underlying factors in the city of Luoyang. Method: This was a prospective study in one center. Many patients were analyzed using endoscopy who showed upper gastrointestinal symptoms between August 2006 and June 2007. In addition, the effect of apoptosis-related proteins and heat shock proteins upon BE's pathogenesis were also investigated by an immunohistochemical protocol. Results: Prevalence of BE was at 4.55% and the mean age of those affected was about 10 years older than for esophagitis. Typical reflux symptoms were significantly lower than with esophagitis, whereas signs of caspase-3 and HSP105 elevation were significantly higher. Expression of TERT, HSP70 and $HSP90{\alpha}$ in BE cases was significantly lower than in esophagitis. However, there was no statistical difference between the two groups in expression of HSP27. Conclusions: The prevalence of BE is high in Luoyang, which could result from esophagitis despite typical reflux symptoms being relatively uncommon. Initiation and development of BE might be the result of accelerated proliferation, apoptosis and differentiation of original cells to intestinal epithelium.

• 한국세라믹학회지
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• 제46권2호
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• pp.211-218
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• 2009

For the Y5V characteristic MLCC which is very prone to crack, it is important to to find out the basic cause of the crack. After finding out the crack origin, the materials and processes should be developed to remove the crack. The microstructures of the cracks were investigated using the fractographic method for the various types of cracks such as an exterior crack, a cyclic thermal shock crack, and an piezo-electric crack. It was found out that the crack origin was the pore at the end of the Ni inner electrode after bake-out. Even though the three dimensional crack shapes were different, the crack origins were seemed to be similar. The exterior crack could grow from the origin with the aids of residual and applied stress. FEM (finite element method) analysis was used to calculate the stress distribution of residual and applied stress. And the concept of fracture mechanics was applied for the explanation of the crack initiation and propagation from the stresses concentration.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2010년도 제34회 춘계학술대회논문집
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• pp.129-132
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• 2010

둔감추진기관 개발은 돌발적인 기폭 가능성과 이에 따른 막대한 피해를 최소화함으로써 사고로부터 인명과 장비의 생존성보장을 규정짓는데 중요한 목적이 있다. 열이나 기계적 충격으로 인한 격렬한 반응과 이어지는 반응의 확률을 최소로 줄이고 적재탄, 양산중이나 수송 저장중인 추진기관의 동조폭발로 주위환경에 치명적인 영향을 끼치는 격렬한 연쇄반응을 줄여야 한다. 이에 따라 반응형태도 과압, 파편비산, 열유속과 같은 결과에 평가의 기초를 두고 있다.

• 대한기계학회논문집B
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• 제38권6호
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• pp.525-538
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• 2014

무기체계 개발에서 예상치 못한 고속의 총탄 충격을 받았을 때 반응 시스템의 폭발 반응을 예측하는 것은 안정성 확보를 위하여 매우 중요하다. 본 연구에서는 LX-17(92.5% TATB, 7.5% Kel-F)과 AP 기반의 고체 추진제(88% AP, 12% HTPB)가 충전된 반응 시스템에 한계 속도로 충돌하는 총탄 충격을 가했을 경우 발생하는 폭굉 현상 및 파괴 거동을 I&G 모델이 적용된 2차원 하이드로 수치해석을 통해 규명하고자 하였다. 해석 결과, LX-17의 경우 충격-폭굉 천이 현상(SDT)이 주요한 메커니즘으로 작용한 반면 고체 추진제는 상대적으로 안정한 모습을 보였다. 즉, 시스템의 파괴는 내부 압력의 급격한 증가와 격렬한 화학반응을 동반하는 고에너지 물질의 폭굉 현상이 그 원인이며, 폭발등급이 낮은 경우에는 고속 충돌에도 발화되지 않아 커버가 완전 파쇄에 이르지 않는 것으로 관찰되었다.

• 대한기계학회논문집B
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• 제34권1호
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• pp.67-71
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• 2010

1 GW/$cm^2$ 이상의 고강도의 레이저 빔을 얇은 금속 호일의 한 점에 집중시키면, 레이저 삭마현상에 의해 발생된 충격파가 금속 호일 안으로 전파하게 된다. 이 충격파는 금속 호일의 반대 면에서 팽창파로 반사되고, 그 과정에서 금속 호일에 급격한 변형이 일어난다. 이 때, 금속 호일의 반대 면에 미세한 마이크로 단위 크기의 입자들을 코팅하면, 금속의 순간적인 변형으로 인해 입자들이 큰 운동량을 얻으며 가속되어 빠른 속도로 튕겨져 나가게 되는데 이것이 바이오리스틱 약물 전달의 원리이다. 이번 연구에서는 바이오리스틱 시스템의 제어성, 안정성, 효율을 향상시키고자 컨파인 조건을 변화시키며, 인체의 연한 조직을 모사하는 3% 젤라틴 용액으로의 침투 모습을 파악하였다. 사용한 컨파인 매질은 BK7 유리, 물, 그리고 초음파젤(RHAPAPHRM Co. Ltd)이다. 실험결과, 컨파인 매질과 그 두께를 조절함으로써 마이크로 입자들의 침투 양상을 제어할 수 있음을 확인하였다.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.49-55
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• 2011

전자기기에서의 고장 중 대부분은 작동 중 발생하는 열과 충격에 기인한다. 이 열과 충격은 PCB(Printed Board) 부품의 접합부 계면에 균열을 야기 시키고, 이 균열은 금속간 화합물(Intermetallic Compound: IMC)의 형성과 밀접한 관계를 가진다. 본 연구에서는 Sn-Ag-Cu계의 Ag함량을 변화한 Sn-1.0Ag-0.5Cu와 Sn-1.2Ag-0.5Cu 및 Sn-3.0Ag-0.5Cu의 3가지 조성의 솔더로 접합한 소재를 대상으로 1000시간 까지 등온시효(Isothermal Aging) 하였다. 등온시효 동 안 솔더(Solder)의 계면에 발생하는 IMC(Intermetallic Compound) 성장이 관찰되었으며, solder 접합부의 기계적 특성은 굽힘충격 시험법을 이용하여 평가되었다. 그 결과 시효처리 전에는 Ag 함량이 낮은 solder의 굽힘충격 특성이 우수하게 나타났으나, 시효처리 후에는 반대의 결과를 나타내었다. 이 결과는 IMC layer 주변에 생성된 미세한 $Ag_3Sn$ 및 조대한 $Cu_6Sn_5$와 관련되어, 미세한 $Ag_3Sn$이 충격을 완화한 것으로 나타나 이에 따라 굽힘충격 특성에 차이가 나타남을 알 수 있었다.

• International Journal of Industrial Entomology and Biomaterials
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• 제15권1호
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• pp.75-78
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• 2007

To define the molecular mechanism of initiation and termination of diapause during the embryogenesis of silkworm, Bombyx mori, mRNA transcripts from diapausing eggs and diapause activated eggs were compared with differential expression using cDNA array. Among those clones, mRNA transcript from hsp20.8A, which was expressed at a high level in diapausing eggs that had been incubated at $25^{\circ}C$ for 30 days after oviposition, whereas, in the eggs exposed to $15^{\circ}C$ for 30 days, $5^{\circ}C$ for 60 days, the expression of mRNA decreased. On the other hand, the expression of mRNA during embryogenesis observed abundantly at 4 to 6 days after heat-HCl treatment and later at 9 to 10 days after just before hatching. This result was suggested for us that hsp20.8A was expressed in response to embryogenesis as well as physical stress.

• International Journal of Industrial Entomology and Biomaterials
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• 제1권2호
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• pp.171-175
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• 2000

Determined sequences of 384 randomly selected clones in a PCR-based cDNA library of Antheraea yamamai could identify expressed sequence tags (ESTs) of highly expressed gene. One EST (fibroin) appeared 15 times, one EST (40S ribosomal protein S18) twelve times, one EST (ribosomal protein S24a) eleven times, ten times (ribosomal protein S8), nine times (60S ribosomal protein L10A), seven times (60S ribosomal protein S15A, S17, S17 and seroin), six times (ribosomal protein S8), five times (ribosomal protein S24, mariner transposase and P8 protein), four times (serpin 2), three times (heat shock protein 70 and poly A binding protein), and the remaining 6 ESTs twice (amylase, KIAA1006, elongation factor-1, transposon mag, translation initiation factor 4C, QM protein, transposase). Therefore, the 94 EST make it possible to identify 24 redundant clones that are candidates for highly expressed genes in posterior silk gland of this insect. The 24 redundant EST clones were identified in GenBank, but none of them was related to A. yamamai, suggesting that there are many unidentified genes which are highly expressed in the A. yamamai genome.