• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.865-870
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• 2003

A motion controller has been used variously in industry such as semiconductor manufacture equipment, industrial robot, assembly/conveyor line applications and CNC equipment. There are several types of controller in motion control. One of these is a PC-based motion controller such as PCI or ISA, and another is stand-alone motion controller. The PC bus-based motion controller is popular because of improving bus architectures and GUI (Graphic User Interface) that offer convenience of use to user. There are some problems in this. The PC bus-based solution allows for only one of the form factors, so it has a poor flexibility. The overall system package size is bigger than other motion control system. And also, additional axes of control require additional slot, however the number of slots is limited. Furthermore, unwieldy and many wirings come to connect plants or I/O. The stand-alone motion controller has also this limit of axes of control and wiring problems. To resolve these problems, controller must have capability of operating as stand-alone devices that resides outside the computer and it needs network capability to communicate to each motion device. In this paper, a network-based stand-alone motion system is proposed. This system integrates PC and motion controller into one stand-alone motion system, and uses CAN (Controller Area Network) as network protocol. Single board computer that is type of 3.5" FDD form factor is used to reduce the system size and cost. It works with Windows XP Embedded as operating system. This motion system operates by itself or serves as master motion controller that communicates to slave motion controller. The Slave motion controllers can easily connect to master motion system through CAN-network.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.2
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• pp.263-272
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• 2013

Printed electronics creates electrically functional devices by printing on variety of substrates. Printing typically uses common printing equipment or other low-cost equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography and inkjet. Compared to conventional manufacturing of microelectronics, printed electronics is characterized by simpler and more cost-effective fabrication of high and low volume products. Now there is huge effort towards printing many other more functional components, from displays to transistors to photovoltaic cells, using the full range of printing technologies - from inkjet to roll to roll analogue print techniques. The market for printed electronics will rise from $1.99 billion in 2010 to $55.10 billion in 2020. In 2030, this industry could be $300 billion - larger than the silicon semiconductor industry - from lighting to displays[8].

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.17 no.6
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• pp.130-137
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• 2003

Because of falling-off in power quality by harmonics, obstacles like lowering of capability, noise, vibration of power facilities and so on are occurred. Also generation of harmonics is inevitable and the point at harmonics is seriously gathering strength because energy saving installation using semiconductor circuit as countermeasures to enhance energy efficiency will be broadly spread and the use of energy conversion equipment like motor speed control contrivance, energy keeping installation and so on will increase, in the future. In order to eliminate harmonics obstacle, precision measurement and analysis on voltage, current, power factor, the each ingredient of harmonic order, the percentage of total harmonic distortion, and so forth are needed. In this paper, we developed low-cost measurement system to measure and analyze power quality connected with harmonics and verified it's performance by measuring and analyzing power quality in the three-phase and four-wire system.

• Journal of Advanced Navigation Technology
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• v.19 no.5
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• pp.433-439
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• 2015

Recently, Interest in power the quality was increased because of increasing the use of sensitive load equipment into an electrical disturbance such as computer, Electricity, Electronics, Telecommunications and semiconductor device. In addition, To enhance power quality, the instantaneous voltage drop occurred in precision load equipment is a need for proper compensation. In order to solve the problem, The developed dynamic voltage restorer (DVR) using an electric double layer capacitor (EDLC) has been applied. In this paper, We will do study to apply hybrid capacitors that have high energy density to the same size compared to the EDLC to DVR. Also, As a emergency luminaires of emergency power supply that we can support more than 10 years of life was confirmed the applicability of hybrid capacitor.

• The Journal of the Korea Contents Association
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• v.20 no.9
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• pp.249-260
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• 2020

This research examined Israel's economic trends, trades, and cooperation with Korea prior to the entry into force of the Free Trade Agreement (FTA) between Korea and Israel. Also, this research assessed opportunities and ways to expand the above more easily. Israel has a high level of technology in basic materials and information technology (IT). Meanwhile, Korea mainly exports automobiles and wireless communication equipment to Israel and imports semiconductor-related equipment and aviation components from Israel. Moreover, since the two countries signed a trade agreement in August 2019, they expect to expand trade with each other. As such, in order to promote multilateral trade and cooperation between the two countries, it is necessary to expand joint development opportunities through mutual collaboration on basic industries and smart mobility that Korea is in need. Further, Korean construction and materials companies related to the SOC industry in Israel should accelerate their local advances. In addition, more of the governmental support should be provided to foster regional experts and to offer various information to the companies entering the country.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.68-68
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• 2011

As feature size is smaller, new technology are needed in semiconductor factory such as gap-fill technology for sub 100nm, development of ALD equipment for Cu barrier/seed, oxide trench etcher technology for 25 nm and beyond, development of high throughput Cu CMP equipment for 30nm and development of poly etcher for 25 nm and so on. We are focus on gap-fill technology for sub-30nm. There are many problems, which are leaning, over-hang, void, micro-pore, delaminate, thickness limitation, squeeze-in, squeeze-out and thinning phenomenon in sub-30 nm gap fill. New gap-fill processes, which are viscous oxide-SOD (spin on dielectric), O3-TEOS, NF3 Based HDP and Flowable oxide have been attempting to overcome these problems. Some groups investigated SOD process. Because gap-fill performance of SOD is best and process parameter is simple. Nevertheless these advantages, SOD processes have some problems. First, material cost is high. Second, density of SOD is too low. Therefore annealing and curing process certainly necessary to get hard density film. On the other hand, film density by Flowable oxide process is higher than film density by SOD process. Therefore, we are focus on Flowable oxide. In this work, dielectric film were deposited by PECVD with TSA(Trisilylamine - N(SiH3)3) and NH3. To get flow-ability, the effect of plasma treatment was investigated as function of O2 plasma power. QMS (quadruple mass spectrometry) and FTIR was used to analysis mechanism. Gap-filling performance and flow ability was confirmed by various patterns.

• Fire Science and Engineering
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• v.13 no.3
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• pp.19-26
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• 1999

$CO_2$ extinguishing system is the most $\phi$pular among the gas extinguishing system. $CO_2$ is usually stored with liquified state. But, it gasifies at the tip of nozzle when $CO_2$ was released through the pipe and head. A ro$\alpha$n temperature is very low when $CO_2$ was released. So electrical instrument, magnetic storage equipment and memory semiconductor are electrically or physically injured by cooling effect in a few minutes. So, we intend to find out temperature profile and electrical damage in compartment area, and supply basic d data for research and making standards and code through the full scale experiment. As result of experiment on the damage due to cooling effect from $CO_2$ extinguishing system, i instantaneous discharging temperature. was $-82.5^{\circ}C$ in average. An average temp. in the compartment after discharging $CO_2$ was $-40^{\circ}C$.

• Design & Manufacturing
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• v.14 no.3
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• pp.63-70
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• 2020

As the consumer market in the VR(virtual reality) and the head-up display industry grows, the demand for 5-axis machines and grooving machines using on a ultra-precision machining increasing. In this paper, ultra-precision diamond tools satisfying the cutting edge width of 500 nm were developed through the process research of a focused ion beam. The material used in the experiment was a single-crystal diamond tool (SCD), and the equipment for machining the SCD used a focused ion beam. In order to reduce the influence of the Gaussian beam emitted from the focused ion beam, the lift-off process technology used in the semiconductor process was used. 2.9 ㎛ of Pt was coated on the surface of the diamond tool. The sub-micron tool with a cutting edge of 492.19 nm was manufactured through focused ion beam machining technology. Toshiba ULG-100C(H3) equipment was used to process fine-pattern using the manufactured ultra-precision diamond tool. The ultra-precision machining experiment was conducted according to the machining direction, and fine burrs were generated in the pattern in the forward direction. However, no burr occurred during reverse machining. The width of the processed pattern was 480 nm and the price of the pitch was confirmed to be 1 ㎛ As a result of machining.

• The Transactions of the Korean Institute of Power Electronics
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• v.14 no.1
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• pp.8-14
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• 2009

A lamp which is currently employed to LCD(Liquid Crystal Display) Backlight is almost CCFL(Cold Cathod Fluorescent Lamp) and EEFL(External Electrode Fluorescent Lamp). However, the use of these lamps is being restricted as RoHS(the Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) regulation is gradually reinforced. According to this situation, the manufacturing of a lamp which doesn't use mercury is unescapable. Moreover, LCD TV has a defect which take place Motion Blur phenomenon due to response time of LC(Liquid Crystal), and Hold-type characteristic which only exists in LCD differently to CRT, PDP. In this paper, an inverter is proposed to drive a plane light source lamp which is not containing mercury. Driving circuit of proposed inverter is simple because the number of semiconductor device and magnetic device is reduced by using forward topology. Also, Motion Blur phenomenon is decreased by dividing the plane light source lamp to six block along vertical direction, and scanning. Finally, we proved usefulness of proposed inverter through experiment.

• Journal of Industrial Convergence
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• v.19 no.3
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• pp.1-12
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• 2021

Even though there have been so much practical interests in industry, the relevant empirical researches are not sufficient. In this study, we try to identify the problems of matrix organization structure in the semiconductor industry and make suggestions for improvements. Also, we try to find out whether there are differences in the perceptions of the problems among ranks and teams. This study was conducted to the researchers in the matrix organization structure of the H-corp. research institute. The problems we found are as follows. The researchers agreed that the matrix organization structure is appropriate when highly professional members for the development of next-generation semiconductors are participated in the projects. They showed strong wills to participate and succeed in projects. However, the researchers felt that the equipments and manpowers were not enough and too much tasks and workloads were assigned to both the managers and members Also, in an open ended question, the researchers pointed out the problems of the matrix organization structure such as 'weak project manager's authority', 'communication and teamwork issues', 'non-obvious work priorities', 'compensation and benefit system', 'lack of research manpower and equipment'. From the strengths and weaknesses of the matrix organization structure of the semiconductor industry, we provide some suggestions for improvements.