• 한국안전학회지
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• 제38권3호
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• pp.27-34
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• 2023

With the technological development of the semiconductor industry, the roles of electrical and thermal energy supply and control of semiconductor equipment in ultrafine processes have become very important. However, instances of electrical fires in the chiller heater, which is used for cooling in the semiconductor manufacturing process, are increasing. A fire occurs in combustibles due to high heat at the connection part of the chiller heater, that is, when the number of electrical wires in the connection part is reduced or when the wires are completely disconnected. In this study, the temperature characteristics were compared and analyzed through experiments and 3D simulations. The number of electrical wires, which is the connection part of the chiller heater, was reduced by 90%, 50%, 30%, 10%, and 5%, and the wires were completely disconnected. When the number of electrical wires was reduced by 5%, heat of up to 80℃ was generated, which is a relatively high temperature but insufficient to cause a fire in combustibles. Complete disconnection occurred due to the vibration of the motor and other components, and sparks and arcs were generated, resulting in a rapid increase in temperature to up to 680℃. When completely disconnected, the temperature increase was sufficient to cause a fire in the combustibles covering the terminal block. Therefore, in this study, the causes of electrical fires in chiller heaters were investigated and preventive measures were proposed by analyzing abnormal signals and thermal characteristics caused by the electrical wiring being reduced and completely disconnected.

• 대한산업공학회지
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• 제33권2호
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• pp.166-173
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• 2007

In this paper, we propose a model-based approach to estimating production parameters of semiconductor FAB equipment. For FAB scheduling, for example, we need to know equipment's production parameters such as flow time, tact time, setup time, and down time. However, these data are not available, and they have to be estimated from material move data such as loading times and unloading times that are automatically collected in modern automated semiconductor FAB. The proposed estimation method may be regarded as a Bayes estimation method because we use additional information about the production parameters. Namely, it is assumed that the technical ranges of production parameters are known. The proposed estimation method has been applied to a LCD FAB, and found to be valid and useful.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2390-2392
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• 1998

In this paper, we discuss the development of monitoring system with data process equipment which transfers data from Remote Terminal Unit(RTU) to monitoring computer. The RTUs sense temperature, pressure and PLC(Programmable Logic Controller) nodes conditions of scrubber in semiconductor manufacture processing. The data Process equipment is connected every RTU and a monitoring computer through serial communication. This equipment receives informations from RTU, process data, and transfers them to monitoring computer. To avoid congestion in data communication, task scheduling algorithm used RT O/S(Real-Time Operating System) is embedded in ROM which is a part of data Process equipment.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.143-148
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• 2019

Numerous pipe lines can be found on various plant-based industrial sites. These pipelines should be periodically checked for defects. Most of these pipelines are internally inaccessible and difficult to visually inspect. Therefore, the inspection is being carried out with the help of non-contact inspection equipment such as ultrasonic flaw detection equipment. The use of ultrasonic flaw detection equipment can raise time and efficiency issues. In order to solve this problem, we will study the basic technology necessary for the development of automated inspection system equipped with ultrasonic measuring equipment and verify the validity through the fabrication of the demonstration device.

• 반도체디스플레이기술학회지
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• 제12권2호
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• pp.39-43
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• 2013

The semiconductor equipments generate necessary data through communication networks for the effective manufacturing processes and automation of semiconductor equipments. For transferring data between semiconductor equipments and sending data to monitor equipments, several standards for communication protocols have been proposed. Communication networks in semiconductor manufacturing systems will transmit a lot of data traffic, which can be vulnerable in data delay and network failure. Therefore, it is required that data traffic need to be distributed. To accomplish this objective, we recommend the use of a redundant and valuable communication path which is constructed by a wireless sensor network. In this paper, the directed diffusion method for wireless sensor networking is suggested for networking semiconductor equipments. It is shown that how the directed diffusion is employed to connect semiconductor equipments. Also, we show how to implement the SECS of semiconductor equipments communication protocols based on the directed diffusion.

• 반도체디스플레이기술학회지
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• 제12권2호
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• pp.67-72
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• 2013

Temperature is a critical parameter in yield improvement for wafer manufacturing. In chemical vapor deposition (CVD) equipment, crack defect in ceramic heater leads to yield reduction, however, there is no suitable ceramic heater fault detection system for conventional CVD equipment. This paper proposes a short-time zero-crossing rate based fault detection method for the ceramic heater in CVD equipment. The proposed method measures the output signal ($V_{pp}$) of RF filter and extracts the zero-crossing rate (ZCR) as feature vector. The extracted feature vectors have a discriminant power and Gaussian mixture model (GMM) based fault detection method can detect fault in ceramic heater. Experimental results, carried out by measured signals provided by a CVD equipment manufacturer, indicate that the proposed method detects effectively faults in various process conditions.

• Design & Manufacturing
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• 제14권4호
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• pp.58-64
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• 2020

Lately, the development of the semiconductor industry has led to the miniaturization of electronic devices. Therefore, semiconductor wafers of very thin thickness that can be used in Multi-Chip Packages are required. There is active research on the backgrinding process to reduce the thickness of the wafer. The backgrinding process polishes the backside of the wafer, reducing the thickness of the wafer to tens of ㎛. The equipment that performs the backgrinding process requires ultra-precision. Currently, there is no full auto backgrinding equipment in Korea. Therefore, in this study, ultra-precision backgrinding equipment was designed. In addition, finite element analysis was conducted to verify the equipment design validity. The deflection and structural stability of the backgrinding equipment were analyzed using finite element analysis.

• 반도체디스플레이기술학회지
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• 제20권3호
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• pp.152-156
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• 2021

Cartesian robot is used in semiconductor manufacturing. Friction between steel band and mover wears the steel band. The emission of wear particle from steel band contaminates semiconductor equipment. At the manufacturing site, the steel band is replaced periodically to minimize the generation of wear particle. But this is not a good way to minimize the generation of wear particle, because it is hard to specify the moment of replacement. We suggested the methodology to minimize the generation of wear particle using TRIZ technique. Also we made prototype robot which the solution is applied, and the performance of the solution was verified through experiments. As a result of verification, it was confirmed that the solution significantly reduced the generation of wear particle compared to the standard way.

• 반도체디스플레이기술학회지
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• 제21권3호
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• pp.101-104
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• 2022

Mist-CVD is known to have advantages of low cost and high productivity compared to ALD and PECVD methods. It is capable of reacting to the substrate by misting an aqueous solution using ultrasonic waves under vacuum-free conditions of atmospheric pressure. In particular, Ga₂O₃ is regarded as advanced power semiconductor material because of its high quality of transmittance, and excellent electrical conductivity through N-type doping. In this study, Computational Fluid Dynamics were used to predict the uniformity of the thin film on a large-area substrate. And also the deposition pattern and uniformity were analyzed using the flow velocity and particle tracking method. The uniformity was confirmed by quantifying the deposition cross section with an FIB-SEM, and the consistency of the uniformity prediction was secured through the analysis of the CFD distribution. With the analysis and experimental results, the match rate of deposition area was 80.14% and the match rate of deposition thickness was 55.32%. As the experimental and analysis results were consistent, it was confirmed that it is possible to predict the deposition thickness uniformity of Mist-CVD.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2005년도 추계 학술대회
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• pp.183-187
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• 2005

Thin films of diblock copolymers may be suitable for semiconductor device applications since they enable patterning of ordered domains with dimensions below photolithographic resolution over wafer-scale area. We obtained nanometer-scale cylindrical structure of dibock copolymer of polystyrene-block-poly(methylmethacrylate), PS-b-PMMA, also demonstrate pattern transfer of the nanoporous polymer using both reactive ion etching. The size of fabricated naonoholes were about 10 nm. Fabricated nanopattern surface was observed by field emission scanning electron microscope (FESEM).