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A study on structural stability of Backgrinding equipment using finite element analysis  

Wi, Eun-Chan (Department of Mechanical Convergence Engineering, Induk University)
Ko, Min-Sung (Department of Mechanical Convergence Engineering, Induk University)
Kim, Hyun-Jeong (Department of Mechanical Convergence Engineering, Induk University)
Kim, Sung-Chul (AM Technology Co.,Ltd)
Lee, Joo-Hyung (Department of Mechanical Design and Robot Engineering, Seoul National University of Science&Technology)
Baek, Seung-Yub (Department of Mechanical Convergence Engineering, Induk University)
Publication Information
Design & Manufacturing / v.14, no.4, 2020 , pp. 58-64 More about this Journal
Abstract
Lately, the development of the semiconductor industry has led to the miniaturization of electronic devices. Therefore, semiconductor wafers of very thin thickness that can be used in Multi-Chip Packages are required. There is active research on the backgrinding process to reduce the thickness of the wafer. The backgrinding process polishes the backside of the wafer, reducing the thickness of the wafer to tens of ㎛. The equipment that performs the backgrinding process requires ultra-precision. Currently, there is no full auto backgrinding equipment in Korea. Therefore, in this study, ultra-precision backgrinding equipment was designed. In addition, finite element analysis was conducted to verify the equipment design validity. The deflection and structural stability of the backgrinding equipment were analyzed using finite element analysis.
Keywords
Backgrinding; Structural stability; safety factor; Deflection analysis;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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