• 대한산업공학회지
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• 제28권4호
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• pp.415-424
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• 2002

Semiconductor manufacturing has been emerged as a highly competitive but profitable business. Accordingly it becomes very important for semiconductor manufacturing companies to meet customer demands at the right time, in order to keep the leading edge in the world market. However, due-date oriented production is very difficult task because of the complex job flows with highly resource conflicts in fabrication shop called FAB. Due to its cyclic manufacturing feature of products, to be completed, a semiconductor product is processed repeatedly as many times as the number of the product manufacturing cycles in FAB, and FAB processes of individual manufacturing cycles are composed with similar but not identical unit processes. In this paper, we propose a production scheduling and control scheme that is designed specifically for semiconductor scheduling environment (FAB). The proposed scheme consists of three modules: simulation module, cycle due-date estimation module, and dispatching module. The fundamental idea of the scheduler is to introduce the due-date for each cycle of job, with which the complex job flows in FAB can be controlled through a simple scheduling rule such as the minimum slack rule, such that the customer due-dates are maximally satisfied. Through detailed simulation, the performance of a cycle due-date based scheduler has been verified.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.192-193
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• 2006

The wet coating process could easily be made from large area film with printing paste mixed with semiconductor and binder material at room temperature. Semiconductor film fabricated about 25mm thickness was evaluated by field emissions-canning electron microscopy (FE-SEM). X-ray performance data such as dark current, sensitivity and signal to noise ratio (SNR) were evaluated. The $Hgl_2$ semiconductor was shown in much lower dark current than the others, but the best sensitivity. In this paper, reactivity and combination character of semiconductor and binder material that affect electrical and X-ray detection properties would prove out though experimental results.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.72-75
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• 2023

Carbon neutrality has been emerged as important mission for all the manufacturing industry to reduce energy usage and carbon emission equivalent. Korean semiconductor and display manufacturing industries are also in huge interest by minimize the energy usage as well as to find a less global warming product gases in both etch and cleaning. In addition, Korean government is also investing long term research and development plan for the safe environment in various ways. In this paper, we revisit previous research activities on carbon emission equivalent and current research activities performed in semiconductor process diagnosis research center at Myongji University with respect to the reduction of NF3 usage for the PECVD chamber cleaning, and we present the analytical result of the exhaust gas with residual gas analysis in both 6 inches and 12 inches PECVD equipment. The presented result can be a reference study of the development of new substitution gas in near future to compare the cleaning rate of the silicon oxide deposition chamber.

• 한국표면공학회지
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• 제57권3호
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• pp.208-213
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• 2024

With the development of industry, miniaturization and densification of semiconductor components are rapidly progressing. Particularly, as demand surges across various sectors, efficiency in productivity has emerged as a crucial issue in semiconductor component manufacturing. Maximizing semiconductor productivity requires real-time monitoring of semiconductor processes and continuous reflection of the results to stabilize processes. However, various unexpected variables and errors in judgment that occur during the process can cause significant losses in semiconductor productivity. Therefore, while the development of a reliable manufacturing system is important, the importance of developing sensor technology that can complement this and accurately monitor the process is also growing. In this study, conducted a basic research on the concept of diagnostic sensors for thickness based on the physical changes of thin films due to etching. It observed changes in resistance corresponding to variations in thin film thickness as etching processes progressed, and conducted research on the correlation between these physical changes and thickness variations. Furthermore, to assess the reliability of thin film thickness measurement sensors, it conducted multiple measurements and comparative analyses of physical changes in thin films according to various thicknesses.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.139-144
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• 2011

CMP process is an essential element in the semiconductor product processes in Chemical Mechanical Polishing. Taken as a whole, CMP is one process, but concretely, it is a detail process which consists of polishing, cleaning, and so on. Especially, the polishing and cleaning are key points in the whole process. Polishing rate is the most important factor and is related with deposition of slurry in the polishing process. Each outlet velocities is the most important factors in cleaning process. And when the velocities are more uniform, the cleaning becomes more effective. In this research, based on these factors, we performed a numerical analysis for effective polishing and cleaning which can be applied to industrial field. Consequently, we figured out that more than one opened nozzle is more effective than one opened nozzle at the polishing pad in case of this research. And we confirmed that the revised models have the uniform velocity distribution more than the previous model of the cleaning nozzle.

• 전기학회논문지
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• 제67권3호
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• pp.474-478
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• 2018

The use of metals such as aluminum and titanium and the related industrial facilities have been continuously increasing to meet the requirements of the improvement of high-tech products due to the development of industry, and explosion of metal dust. Semiconductor process Metal dust is essential, but research is insufficient. The purpose of this study is to identify risk by analyzing the quantitative risk such as maximum explosion pressure and minimum explosion concentration applied international test standard in order to select the semiconductor process facilities handling dust and to predict possible risk of accidents.

• 반도체디스플레이기술학회지
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• 제14권1호
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• pp.45-49
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• 2015

Process gases with vapor or liquid phase as well as gas phase may experience alteration in itself or be contaminated in the fluid pipe to the process chamber. And thus it result in as particles or defects on the substrates in semiconductor, LCD, LED manufacturing. Purifiers and filters are used for control of contamination. However, none of detection device is available in the delivery line. In this paper, we propose simple device with lighting and sensing in order to predict contamination of the fluid or the tube wall. For some general purpose gases, it showed constant voltage output regardless of the flow rates. But, the smoke and the moisture in the air lowered the figure due to its concentration. Numerical values for several solid and liquid media were obtained. And, the operating temperature tendency was investigated.

• JSTS:Journal of Semiconductor Technology and Science
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• 제12권3호
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• pp.370-376
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• 2012

In this work, design considerations for high-performance silicon photodetector are thoroughly investi- gated. Besides the critical dimensions of device, guidelines for process architecture are suggested. Abiding by those criteria for improving both direct-current (DC) and alternating-current (AC) perfor- mances, a high-speed low-operation power silicon photodetector based on p-i-n structure for optical interconnect has been designed by device simulation. An $f_{-3dB}$ of 80 GHz at an operating voltage of 1 V was obtained.

• 한국생산제조학회지
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• 제22권3호
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• pp.356-363
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• 2013

Mechanical molding press which is used for transformation process during semiconductor manufacturing process has structural deformations by pressure. If these deformations have over limit range, life of the press itself can be reduced and it will be exerted on a bad effect for quality of the semiconductor. In this research, the main plates and links of a press are analyzed in relation to the structural deformations caused by pressure excluding thermal deformations. After modifying the modeling, the analysis is performed again to determine optimal design of the press, and this design is introduced to ensure that most of the stresses on the main plates are within safe allowable limits. As a result, an optimal design method for the structure is investigated to produce the desired pressure even when the size of the main structure is minimized.

• Korean Chemical Engineering Research
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• 제46권3호
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• pp.571-580
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• 2008

반도체 제조 공정 중에 광범위하게 사용되고 있는 많은 프로세스 공정들이 있음에도 화학공학 측면에서 반도체 산업이 어떤 상황이며 실질적으로 어떤 문제들을 가지고 있는가에 대한 학문적 접근은 다루어지지 못했다. 본 연구에서는 반도체 산업 중 반도체의 공급 사슬망 관리(Supply Chain Management) 부분을 집중적으로 분석하여 공정 시스템공학이나 화학공학에서 어떻게 기여할 수 있을까에 대해 살펴보고자 한다. 반도체 관련 기업에서의 근무 경험과 연구결과를 바탕으로 관련 사례와 자료들을 통해 주요 개념들을 소개하고 향후 발전 방향을 제안하였다.