• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2005년도 춘계종합학술대회
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• pp.1042-1045
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• 2005

주기적인 구조를 갖는 Si (100) 기판을 이용하여 ZnO 박막을 graphoepitaxy 법으로 성장시키기 위한 가능성을 알아 보았다. photolithography에 의해 주기적 구조를 형성시켰으며, ZnO박막은 RF-sputter 법으로 증착하여 시료를 제작 하였다. 제작된 시료는 700$^{\circ}C$${\sim}$900$^{\circ}C$의 수증기 분위기에서 2시간동안 열처리 하여 열처리 온도에 대한 결정성의 변화를 고찰 하였다. 시료의 결정성은 Atomic Force Microscopy (AFM), PL(Photoluminescence)를 통해, 표면과 광학적 특성의 변화를 고찰하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.1585-1587
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• 2004

이중 에피층 구조를 가지는 SOI(Silicon-On-Insulator) LIGBT(Lateral Insulated Gate Bipolar Transistor)의 에피층 두께 변화에 따른 항복전압 특성을 분석하였다. 제안된 소자는 전하보상효과를 얻기 위해 n/p-epi의 이중 에피층 구조를 사용하였으며, 에피층 전체에 걸쳐서 전류가 흐를 수 있도록 하기 위해 trenched anode구조를 채택하였다. 본 논문에서는 n/p-epi층의 농도를 고정시킨 후 각각의 epi층의 두께를 변화시켜가며 simulation을 수행하였을 때 항복전압의 변화 및 표면과 epi층에서의 전계분포변화를 분석하였다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권3호
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• pp.133-140
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• 2004

The origin of the phenomena, obstructing circuit performance in the RF operating regime, as well as their modeling will be discussed. The applied surface-potential-based modeling allows self-consistent description of all phenomena important for accurate circuit simulation, as demonstrated with the MOSFET model HiSIM.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권4호
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• pp.198-204
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• 2009

Inductive peaking using T-coils has been widely used in broadband I/O interfaces. In this paper, we analyze technical effects and limitations of the T-coil, and discuss several methods that can overcome these restrictions and improve the practicality of the T-coil. In particular we also propose and verify a circuit topology which can further extend bandwidth beyond the limit that conventional T-coil can achieve, and transfer 20 Gb/s data without noticeable distortion.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.285-287
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• 2009

When the laser diode is operated with continuous current, the light intensity from the laser diode deceases with time due to the temperature rise in the active layer. The phenomena, which is often called as DROOP, should be minimized in order to be used as a light source for the laser beam printer. We experimently examined the influences of the laser parameters such as threshold current, differential quantum efficiency on droop. It was found that decreasing the differential quantum efficiency of the laser diode is the effective way to minimize droop.

• 대한전기학회논문지
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• 제41권9호
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• pp.1013-1020
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• 1992

The conductivity variation of a high resistivity bulk silicon semiconductor, whose electrodes were deposited with aluminum vapor, was studied experimentally by measuring the X-ray intensity and current flow, which was developed by X-ray radiation while applying a pulse voltage to the silicon, in a load resistor connected to the semiconductor. The current flow observed immediately as the X-ray radiated, and when the X-ray decreased. It was found from the observation of switching current for the X-ray intensity and the voltage applied in the semiconductor that the switching current of the semiconductor increased as the intensity of the X-ray and the applied voltage increased. In case of lower applied voltage, the switching current for higher applied voltage depended on the intensity of the X-ray radiated due to the saturation of electron and hole.

• 전기학회논문지
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• 제56권9호
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• pp.1638-1642
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• 2007

This paper investigated the destruction effect of the semiconductors by impact of high power electromagnetic wave. The experiments is employed as an open-ended waveguide to study the destruction effects on semiconductor using a 2.45 GHz 600 W Magnetron as a high power electromagnetic wave. The semiconductors are located at a distance of $31cm\sim40cm$ from the open-ended waveguide and are composed of a LED drive circuit for visual discernment. Also the chip condition of semiconductor is observed by SEM(Scanning Electron Microscope) analysis. The semiconductor are damaged by high power electromagnetic wave at about 860 V/m. The SEM analysis of the destructed devices showed onchipwire and bondwire destructions. Based on the result, semiconductor devices should have plan to protect the semiconductor devices form high power electromagnetic wave. And the database from this experiment provides the basis for future investigation.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제16회 학술발표회 논문개요집
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• pp.79-80
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• 1998

• 반도체디스플레이기술학회지
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• 제2권3호
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• pp.1-6
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• 2003

In the rapid changes of the semiconductor manufacturing technologies for early 21st century, it may be safely said that a kernel of terms is the size increase of Si wafer and the size decrease of semiconductor devices. As the size of Si wafers increases and semiconductor device is miniaturized, the units of cleaning processes increase. A present cleaning technology is based upon RCA cleaning which consumes vast chemicals and ultra pure water (UPW) and is the high temperature process. Therefore, this technology gives rise to environmental issue. To resolve this matter, candidates of advanced cleaning processes have been studied. One of them is to apply the electrolyzed water. In this work, electrolyzed water cleaning was compared with various chemical cleaning, using Si wafer surfaces by changing cleaning temperature and cleaning time, and especially, concentrating upon the contact angle. It was observed that contact angle on surface treated with Electrolyzed water cleaning was $4.4^{\circ}$ without RCA cleaning. Amine series additive of high pKa (negative logarithm of the acidity constant) was used to observe the property changes of cathode water.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1323-1324
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• 2008

We developed the Hyper-thermal Neutral Beam (HNB) sputtering process as a plasma damage free process for ITO top anode deposition on inverted Top emission OLED (ITOLED). For examining the effect of the HNB sputtering system, Inverted Bottom emission OLEDs (IBOLED) with ITO top anode electrode were fabricated; the characteristics of IBOLED using HNB sputtering process shows significant suppression of plasma induced damage.