• 제목/요약/키워드: Semi-conductor test

검색결과 30건 처리시간 0.023초

패턴 생성기의 PLD 회로설계에 관한 연구 (A Study on the PLD Circuit Design of Pattern Generator)

  • 노영동;김준식
    • 조명전기설비학회논문지
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    • 제18권6호
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    • pp.45-54
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    • 2004
  • 일반적으로 반도체 소자의 집적도가 증가함에 따라 기능적 오류 검사 시간이 급격하게 증가하며, 이러한 문제를 해결하기 위해 제조공정에서 패턴 발생기의 사용은 필수적이다. 본 논문에서는 반도체 소자의 기능적 오류를 검사 하기 위한 패턴 발생기의 PLD(Programmable Logic Device) 회로를 설계하였다. 이러한 모든 사항은 시뮬레이션을 통하여 회로의 동작과 기능을 검증하였으며, 만족할만한 결과를 얻었다.

반도체 칩 테스트용 챔버 형상에 따른 유동 균일성에 대한 수치적 연구 (A Numerical Study on the Flow Uniformity according to Chamber Shapes Used for Test of the Semi-Conductor Chip)

  • 이대규;마상범;김성;김정열;강채동;김진혁
    • 한국수소및신에너지학회논문집
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    • 제31권5호
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    • pp.480-488
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    • 2020
  • This study was conducted to improve the flow uniformity inside the chip tester through changing the flow path formation according to the inlet and outlet position of chamber. The internal flow and velocity distributions of the modified chamber models (Cases 1-3) were compared with the reference chamber model through three-dimensional Reynolds-averaged Navier-Stokes equations with k-ε turbulence model. The modified chamber models showed the superior flow uniformity characteristics compared to the reference chamber model. To investigate the flow uniformity in the chip tester, the standard deviation of the velocity was defined and compared. Through the internal flow analysis and assesment of the standard deviation, Case 2 among the test cases including the reference model showed the best flow uniformity generally.

반도체 제조 설비용 전해 연마된 STS316L 용접강관의 표면 성질 - 전해 조건과 표면 성상의 관계를 중심으로 - (Surface Properties of Electrolytic-Polished 316L Stainless Steel Welding Tube for Semi-Conductor Fab. - As the Relation of Electrolysis Conditions with Surface Characteristics -)

  • 김기호;조보연
    • 한국표면공학회지
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    • 제41권1호
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    • pp.38-42
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    • 2008
  • 316L stainless steel welding tube was electrolytically polished and the inner surface characteristics of the tube were tested. Electro-polishing variables such as current, voltage, concentration of electrolyte and electropolishing time were changed to seek for optimum condition. These makes a optimum conditions for the electro-polishing as 4000 A, 9 V, 1.7 specific gravity of electrolyte, and 30 minute of electro-polishing time. It makes the surface roughness as Ra < $0.25{\mu}m$. XPS test resulted as the ratio of CrO/FeO equals or more to 3/1. AES test resulted as the thickness of CrO film of $38{\AA}$. DTA test resulted as the tube did not react with $N_2,\;H_2\;and\;O_2$ gas below 1073K. As summarize above results, the electro- polished 316L stainless steel welding tube satisfied the conditions to apply as a pipeline for semi- conductor production facility and clean room.

반도체장비용 오링의 종합 신뢰성 평가기술에 관한 연구 (A Study on the Reliability Evaluation System for O-ring of Semiconductor Equipments)

  • 김동수;김광영;최병오;박화영
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.613-617
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    • 2001
  • The test items like as endurance, air leakage and oil endurance test is requested for reliability evaluation about O-ring which is a kind of core machinery accessories of semi-conduct manufacturing equipment. For verification of these, we design and manufactured a test system for endurance, air leakage and oil endurance of O-ring for semi-conduct manufacturing equipment, and also performed the test for two kinds of O-ring, as it were Viton and Kalretz. The characteristics of this test equipment consist in realization of the test conditions of semi-conduct manufacturing equipment and satisfying the test method. The test conditions are cut gas, vacuum grade, temperature and revolution numbers in the endurance test system, vacuum grade and temperature in the air leakage test system, temperature and time in the oil endurance test system. The separating test results for wearing which is an oil endurance test item, the wearing index of domestic produced Viton O-ring is higher than foreign product by 2%, wearing rate of Kalretz O-ring better than Viton O-ring by 17%, and particles existed in various place. The test result of air leakage which is measured through the RGA sensor used Helium, the vacuum grade was $10^-3$Torr. And the test result of oil endurance, the volume change rate was 7~15%. Hereafter, we intend to analysis the reliability test evaluation and to utilize for domestic manufacturing companies by establishing data base and developing reliability softwares.

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기계설계분야 중견 엔지니어의 일과 학습에 관한 내러티브 연구 - 엔지니어의 직무관련 학습의 맥락과 공학교육에 대한 시사점 찾기 (A narrative research on the job and the job-related learning of a mechanical engineer - an exemplary study on the characteristic of job-related learning of engineer in work place and it's implication on engineering education)

  • 임세영
    • 대한공업교육학회지
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    • 제38권2호
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    • pp.1-26
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    • 2013
  • 이 연구는 기계설계 분야의 중견엔지니어 한 사람을 중심으로 그가 수행하는 구체적인 과업은 무엇이며 그와 관련하여 이루어지는 학습은 무엇인지, 일터에서 이루어지는 직무관련 학습의 맥락은 무엇인지 내러티브 연구방법에 의해 탐구하였으며, 이것이 공학교육에 주는 시사점을 논의하였다. 연구결과 연구참여자는 취업 후 수입대체를 위한 초창기 반도체 검사장비 개발을 위해 독립적으로 개발할 장비에 관한 기초지식을 습득하고 장비의 개념설계를 하였으며, 볼 타입 반도체 검사장비개발 동료들과 함께 장비의 구체설계를 하였고, 근무하던 회사의 폐업 후 잔류 엔지니어들과 함께 창업, 인터뷰 당시 이 기업의 경영자로 일하였다. 그가 엔지니어로서 수행한 주요 실무는 공학적 문제해결이었으며, 비형식적 학습의 과정이었다. 그는 실무수행 과정에서 프로젝트 관리, 자기주도적 과업수행, 기능분석, 추론과 검증, 긴밀한 협동, 대화와 토론, 시행착오, 암묵적 경험지식의 체계화, 총체적 사고, 환경변화의 지각과 기술수요 예측, 인간관계와 업무의 조화, 리더십 등을 경험하였다. 이를 바탕으로 공학교육이 프로젝트 학습, 자기주도적 학습, 대화와 토론 능력 교육을 위한 협동학습, 성찰학습, 실무적 경험을 이론화하는 학습, 인간관계와 리더십 교육 등을 강화해야 한다는 시사점을 얻었다.

반도전 재료를 이용한 Resistivity grading 방식의 XLPE절연 전력케이블용 시험단말에 관한 연구 (A study on the application of testing termination for XLPE Power Cable by Resistivity Grading Method Using Semi-conductive material)

  • 이창영;신두성;;김동욱;박완기
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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    • pp.1105-1107
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    • 1999
  • The purpose of termination for high voltage tests of XLPE power cable is to prevent flashover during the breakdown test of specimen as well as to withstand the specified voltage between its conductor and screen without failure. For easier treatment and simpler construction of testing termination, resistivity grading method using semi-conductive material was employed. Based on the fundamental theory, its failure characteristics by changing the resistivity of semi-conductive material on the insulation surface was investigated. With two layers construction by difference resistivity on their surfaces, much improved result than that of one resistivity was obtained through the experiment for MV cable.

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도체 수밀형 전력케이블의 가교잔사 가스에 의한 직선접속재 부풀음 현상 방지 대책 (The solution for preventing the expansion of cable joint caused by methane($CH_4$) gas to Water proof type of power cable)

  • 김종원;이기수;백흠수;최봉남;박희철
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 하계학술대회 논문집 C
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    • pp.2020-2022
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    • 2000
  • The cross-linked polyethylene(herein after XLPE) insulated power cable emit the methane($CH_4$)gas in the course of chemical cross-linking process. The general stranded conductor easily discharge this methane gas through the gap of each stranded wires. But the special stranded conductor that filled with semi-conducting rubber compound to prevent water penetration which is applied to water proof type of cable(22.9kV CN/CV-W), disturb the methane gas emission. The pre-mold type cable joint shall be expanded gradually by emit of gas left in XLPE insulation. For example, sometimes the corona problem outbreak on a new power distribution line, resulted from the gap between the sleeve and semi-conductive layer of cable joint. If above mentioned problem especially happened on the way of operating. We have to shut down the line and try to discharge the methane gas in cable joint. In this point, we would like to explain the mechanism of methane gas & cable joint and our test result briefly. At last, we are pleased to introduce the solution for preventing reoccurrence of this problem.

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포토에칭법에 의한 Digitron용 Grid제조에 관한 연구 (The Fabrication of Digitron Grid by Photoetching Process)

  • 김만;이종권
    • 한국표면공학회지
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    • 제29권1호
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    • pp.60-72
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    • 1996
  • A photoetching process is widely used for small and high precision parts in machinery, electronic and semi-conductor industries. One of the high precision parts, grid is very important part of digitron which use electron display, and it is fabricated by only photoetching process because of high precision. In this study, to develop high precision digitron grid, characteristics of etching solution were investigated with electrochemical test, that was potentiodynamic test and immersion test in the ferric chloride solution and added some additives. Based on the electrochemical etching test, grid was fabricated by continuous photoetching process at various etching condition. From the result of measured line width and etching depth under-cut and etching factor were calculated. For the fabrication of 25$\mu\textrm{m}$ line width, optimal etching condition was etching temperature 40~$45^{\circ}C$, spray pressure 1.5kg/$\textrm{cm}^2$ and etching time 3~4min.

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반도체 초정밀장비의 진동허용규제치를 고려한 지지구조의 동특성 개선에 관한 연구 (A Study on the Structural Dynamic Modification of Sub-structure of Clean Room Considering Vibration Criteria)

  • 손성완;이홍기;백재호
    • 반도체디스플레이기술학회지
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    • 제2권2호
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    • pp.25-30
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    • 2003
  • In the case of a vibration sensitive equipment, it require a vibration free environment to provide its proper function. Especially, lithography and inspection device, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved Giga Class semi conductor wafers. This high technology equipments require very strict environmental vibration criteria in proportion to the accuracy of the manufacturing. In this paper, the dynamic analysis and modal test were performed to evaluate the dynamic properties of the constructing clean room structure. Based on these results, a structural dynamic modification(SDM) were required to satisfiy the vibration allowable limit for pression machine. Therefore, in order to improve the dynamic stiffness of clean room structure, the VSD system which can control the force applied on structure, were adopted and its utility were proved from dynamic test results of the improved structure after a modification work.

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전자산업 청정실의 작업환경 및 유해물질농도 평가 (Assessment of hazardous substances and workenvironment for cleanrooms of microelectronic industry)

  • 정은교;박현희;신정아;장재길
    • 한국산업보건학회지
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    • 제19권3호
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    • pp.280-287
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    • 2009
  • High-tech microelectronics industry is known as one of the most chemical-intensive industries. In Korea, Microelectronics industry occupied 38% of export and 16% of working employees work in microelectronics industry. But, chemical information and health hazards of high-tech microelectronics manufacturing are poorly understood because of rapid development and its penchant for secrecy. We need to investigate on chemical use and exposure control. We Site-visits to 6 high-tech microelectronics manufacturing company which have cleanroom work using over 1,000kg organic solvents (5 semi-conductor chips and its related parts company, 1 liquid crystal display (LCD)). We reviewed their data on chemical use and ventilation system, and measured TVOCs (Total Volatile Organic Compounds) and carbon dioxide concentration. All cleanroom air passed through hepa filters to acheive low particle levels and only 1 cleanroom uses carbon filters to minimize the organic solvents exposures In TVOC screening test, Cleanroom for semi-conductor chips and its related parts company with laminar down flow system (e.g. class 1~100) showed nondetectable level of TVOCs concentration, but Cleanroom for liquid crystal display (LCD) with conventional flow system (e.g. class 1,000~10,000) showed 327 ppm as TVOCs. Acetone concentration in cleanroom for Jig cleaning, LC Injection, Sealing processes were 18.488ppm (n=14), 49.762 ppm (n=15), 8.656 ppm (n=14) as arithmetric mean. Acetone concentration in cleanroom for LCD inspection process was 40ppm (n=55) as geometric mean, where the range was 7.8~128.7ppm and weakly correlated with ventilation rate efficiency(r=0.44, p<0.05). To control organic solvents in cleanrooms, chemical and carbon filters should be installed with hepa filters. Even though their volatile organic compounds concentration was not exceed to occupational exposure limits, considering of entrance limited cleanroom environment, long-term period exposure effects and adverse health effects of cleanroom worker need further reseach.