Journal of Hydrogen and New Energy (한국수소및신에너지학회논문집)

The Korean Hydrogen and New Energy Society (한국수소및신에너지학회)
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A Numerical Study on the Flow Uniformity according to Chamber Shapes Used for Test of the Semi-Conductor Chip

반도체 칩 테스트용 챔버 형상에 따른 유동 균일성에 대한 수치적 연구

  • LEE, DAEGYU (Mechanical Engineering, Graduate School of Jeonbuk National University) ;
  • MA, SANG-BUM (Clean Energy R&D Department, Korea Institute of Industrial Technology) ;
  • KIM, SUNG (Clean Energy R&D Department, Korea Institute of Industrial Technology) ;
  • KIM, JEONG-YEOL (Clean Energy R&D Department, Korea Institute of Industrial Technology) ;
  • KANG, CHAEDONG (Mechanical Engineering, Jeonbuk National University) ;
  • KIM, JIN-HYUK (Clean Energy R&D Department, Korea Institute of Industrial Technology)
  • 이대규 (전북대학교 대학원 기계공학과) ;
  • 마상범 (한국생산기술연구원 청정에너지시스템연구부문) ;
  • 김성 (한국생산기술연구원 청정에너지시스템연구부문) ;
  • 김정열 (한국생산기술연구원 청정에너지시스템연구부문) ;
  • 강채동 (전북대학교 기계공학과) ;
  • 김진혁 (한국생산기술연구원 청정에너지시스템연구부문)
  • Received : 2020.09.07
  • Accepted : 2020.10.30
  • Published : 2020.10.30
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Abstract

This study was conducted to improve the flow uniformity inside the chip tester through changing the flow path formation according to the inlet and outlet position of chamber. The internal flow and velocity distributions of the modified chamber models (Cases 1-3) were compared with the reference chamber model through three-dimensional Reynolds-averaged Navier-Stokes equations with k-ε turbulence model. The modified chamber models showed the superior flow uniformity characteristics compared to the reference chamber model. To investigate the flow uniformity in the chip tester, the standard deviation of the velocity was defined and compared. Through the internal flow analysis and assesment of the standard deviation, Case 2 among the test cases including the reference model showed the best flow uniformity generally.

Keywords

References

  1. P. V. Zant and D. K. Van, "Microchip fabrication", 5th Ed., Mcgraw-Hill, USA, 2004.
  2. K. J. Lee, K. S. Jeong, and S. M. Park, "Improvement of the uniformity of temperature distribution inside semiconductor test equipment chamber", J Korea Acad Industr Coop Soc, Vol. 11, No. 10, 2010, pp. 3626-3632, doi: https://doi.org/10.5762/KAIS.2010.11.10.3626.
  3. M. Sweetland and J. H. Lienhard, "Rapid IR heating of electronic components in the testing cycle", Proceedings of 35th National Heat Tranfer Conference, ASME, 2001.
  4. K. Fukumoto, "Constant temperature chamber in a handler for semiconductor device testing apparatus", U.S. Patent No. 5,859,540, 1999. Retrieved from https://patentimages.storage.googleapis.com/bf/8c/87/5bbe7cf72af88f/US5859540.pdf.
  5. A. C. Pfahnl, J. H. Lienhard, and D. J. Watson, "Method and apparatus for temperature control of a semiconductor electrical-test constractor assembly", U. S. Patent No. 6,091,062, 2000. Retrieved from https://patentimages.storage.googleapis.com/e8/e6/33/c7252ea4ac8486/US6091062.pdf.
  6. C. Y. Ahn, T. S. Kim, and J. B. Kim, "Thermal management of Ni/MH battery pack on HEV bus", KSAE 2011 Annual Autumn Conference & Exhibition, 2011, pp. 2915-2919.
  7. H. I. Kim, Y. S. Cho, S. Y. Chae, and D. Y. Jung, "A numerical study on cooling performance improvement of cycler for the vehicle lithium polymer battery", KSME Autumn Conference, 2011, pp. 1542-1547. Retrieved from https://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE02041889.
  8. "ANSYS CFX-19.1, ANSYS CFX-solver theroy guide", ANSYS Inc., 2018. Retrieved from http://read.pudn.com/downloads500/ebook/2077964/cfx_thry.pdf.
  9. Z. Yang and T. H. Shih, "New time scale based k-${\varepsilon}$ model for near-wall turbulence", AIAA Journal, Vol. 31, No. 7, 1993, pp. 1191-1198, doi: https://doi.org/10.2514/3.11752.
  10. P. J. Roache, "Verification of codes and calculations", AIAA Journal, Vol. 36, No. 5, 1998, pp. 696-702, doi: https://doi.org/10.2514/2.457.
  11. I. Celik and O. Karatekin, "Numerical experiments on application of richardson extrapolation with nonuniform grids", J. Fluids. En. Sep., Vol. 119, No. 9, 1997, pp. 584-590, doi: https://doi.org/10.1115/1.2819284.
  12. C. H. Jeong and J. S. Lee, "Thermal-fluid analysis with flow loss coefficient on the inlet and exhaust duct of wheel-loader", Trans. Korean Soc. Mech. Eng. C, Vol. 5, No. 2, 2017, pp. 97-104, doi: https://doi.org/10.3795/KSME-C.2017.5.2.097.
  13. I. S. Jung, J. H. Park, J. H. Bae, and S. Kang, "Porous modeling for the prediction of pressure drop through a perforated strainer", J. Korean Soc. Mar. Eng., Vol. 37, No. 4, 2013, pp. 358-367, doi: https://doi.org/10.5916/jkosme.2013.37.4.358.
  14. M, Kaviany, "Principles of heat transfer in porous media", Springer-Verlag, USA, 1995.