• Title/Summary/Keyword: Schottky junction

검색결과 79건 처리시간 0.031초

코발트 실리사이드 접합을 사용하는 0.15${\mu}{\textrm}{m}$ CMOS Technology에서 얕은 접합에서의 누설 전류 특성 분석과 실리사이드에 의해 발생된 Schottky Contact 면적의 유도 (Characterization of Reverse Leakage Current Mechanism of Shallow Junction and Extraction of Silicidation Induced Schottky Contact Area for 0.15 ${\mu}{\textrm}{m}$ CMOS Technology Utilizing Cobalt Silicide)

  • 강근구;장명준;이원창;이희덕
    • 대한전자공학회논문지SD
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    • 제39권10호
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    • pp.25-34
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    • 2002
  • 본 논문에서는 코발트 실리사이드가 형성된 얕은 p+-n과 n+-p 접합의 전류-전압 특성을 분석하여 silicidation에 의해 형성된 Schottky contact 면적을 구하였다. 역방향 바이어스 영역에서는 Poole-Frenkel barrier lowering 효과가 지배적으로 나타나서 Schottky contact 효과를 파악하기가 어려웠다. 그러나 Schottky contact의 형성은 순방향 바이어스 영역에서 n+-p 접합의 전류-전압 (I-V) 동작에 영향을 미치는 것으로 확인되었다. 실리사이드가 형성된 n+-p 다이오드의 누설전류 증가는 실리사이드가 형성될 때 p-substrate또는 depletion area로 코발트가 침투퇴어 Schottky contact을 형성하거나 trap들을 발생시켰기 때문이다. 분석결과 perimeter intensive diode인 경우에는 silicide가 junction area까지 침투하였으며, area intensive junction인 경우에는 silicide가 비록 공핍층이나 p-substrate까지 침투하지는 않았더라도 공핍층 근처까지 침투하여 trap들을 발생시켜 누설전류를 증가시킴을 확인하였다. 반면 p+-n 다이오드의 경우 Schottky contact이발생하지 않았고 따라서 누설전류도 증가하지 않았다. n+-p 다이오드에서 실리사이드에 의해 형성된 Schottky contact 면적은 순방향 바이어스와 역방향 바이어스의 전류 전압특성을 동시에 제시하여 유도할 수 있었고 전체 접합면적의 0.01%보다 작게 분석되었다.

Influences of Trap States at Metal/Semiconductor Interface on Metallic Source/Drain Schottky-Barrier MOSFET

  • Cho, Won-Ju
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제7권2호
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    • pp.82-87
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    • 2007
  • The electrical properties of metallic junction diodes and metallic source/drain (S/D) Schottky barrier metal-oxide-semiconductor field-effect transistor (SB-MOSFET) were simulated. By using the abrupt metallic junction at the S/D region, the short-channel effects in nano-scaled MOSFET devices can be effectively suppressed. Particularly, the effects of trap states at the metal-silicide/silicon interface of S/D junction were simulated by taking into account the tail distributions and the Gaussian distributions at the silicon band edge and at the silicon midgap, respectively. As a result of device simulation, the reduction of interfacial trap states with Gaussian distribution is more important than that of interfacial trap states with tail distribution for improving the metallic junction diodes and SB-MOSFET. It is that a forming gas annealing after silicide formation significantly improved the electrical properties of metallic junction devices.

Ni과 Ag 금속을 이용한 N-type Si Schottky Junction 광전소자 (N-type Si Schottky Junction Photoelectric Device Using Nickel and Silver)

  • 서철원;홍승혁;윤주형;김준동
    • 한국전기전자재료학회논문지
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    • 제27권6호
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    • pp.389-393
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    • 2014
  • A thin metal-embedding Schottky device was fabricated for an efficient photoelectric device. Semitransparent thick of 10 nm metal layers were deposited by sputtering of Ag and Ni on a Si substrate. The (111) N-type Si wafers with one-side polished, 450~500 ${\mu}m$ and resistivity $1{\sim}20{\Omega}{\cdot}cm$ were used. High rectifying ratio about 100 from Ni-Schottky device was achieved. This design would provide an effective scheme for high-performing photoelectric devices.

Bi-directional Two Terminal Switching Device with Metal/P/N+or Metal/N/P+ Junction

  • Kil, Gyu-Hyun;Lee, Sung-Hyun;Yang, Hyung-Jun;Lee, Jung-Min;Song, Yun-Heub
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.386-386
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    • 2012
  • We studied a bilateral switching device for spin transfer torque (STT-MRAM) based on 3D device simulation. Metal/P/N+or Metal/N/P+ junction device with $30{\times}30nm2$ area which is composed of one side schottky junction at Metal/P/N+ and Metal/N/P+ provides sufficient bidirectional current flow to write data by a drain induced barrier lowering (DIBL). In this work, Junction device confirmed that write current is more than 30 uA at 2 V, It is also has high on-off ratio over 105 under read operation. Junction device has good process feasibility because metal material of junction device could have been replaced by bottom layer of MTJ. Therefore, additional process to fabricate two outer terminals is not need. so, it provides simple fabrication procedures. it is expected that Metal/P/N+ or Metal/N/P+ structure with one side schottky junction will be a promising switch device for beyond 30 nm STT-MRAM.

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Stability Assessment of Lead Sulfide Colloidal Quantum Dot Based Schottky Solar Cell

  • Song, Jung-Hoon;Kim, Jun-Kwan;An, Hye-Jin;Choi, Hye-Kyoung;Jeong, So-Hee
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.413-413
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    • 2012
  • Lead sulfide (PbS) Colloidal quantum dots (CQDs) are promising material for the photovoltaic device due to its various outstanding properties such as tunable band-gap, solution processability, and infrared absorption. More importantly, PbS CQDs have large exciton Bohr radius of 20 nm due to the uniquely large dielectric constants that result in the strong quantum confinement. To exploit desirable properties in photovoltaic device, it is essential to fabricate a device exhibiting stable performance. Unfortunately, the performance of PbS NQDs based Schottky solar cell is considerably degraded according to the exposure in the air. The air-exposed degradation originates on the oxidation of interface between PbS NQDS layer and metal electrode. Therefore, it is necessary to enhance the stability of Schottky junction device by inserting a passivation layer. We investigate the effect of insertion of passivation layer on the performance of Schottky junction solar cells using PbS NQDs with band-gap of 1.3 eV. Schottky solar cell is the simple photovoltaic device with junction between semiconducting layer and metal electrode which a significant built-in-potential is established due to the workfunction difference between two materials. Although the device without passivation layer significantly degraded in several hours, considerable enhancement of stability can be obtained by inserting the very thin LiF layer (<1 nm) as a passivation layer. In this study, LiF layer is inserted between PbS NQDs layer and metal as an interface passivation layer. From the results, we can conclude that employment of very thin LiF layer is effective to enhance the stability of Schottky junction solar cells. We believe that this passivation layer is applicable not only to the PbS NQDs based solar cell, but also the various NQDs materials in order to enhance the stability of the device.

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반도체 접합계면이 가스이온화에 따라 극성이 달라지는 원인 (Dependance of Ionic Polarity in Semiconductor Junction Interface)

  • 오데레사
    • 한국산학기술학회논문지
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    • 제19권6호
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    • pp.709-714
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    • 2018
  • 반도체소자의 접합특성에 따라서 분극의 특성이 달라지는 원인을 조사하였다. 반도체소자의 접합특성은 최종적인 반도체소자의 효율과 관련되기 때문에 중요한 요소이며, 효율을 높이기 위해서는 반도체접합 특성을 이해하는 것은 매우 중요하다. 다양한 성질의 접합을 얻기위하여 n형의 실리콘 위에 절연물질인 carbon doped silicon oxide (SiOC) 박막을 증착하였으며, 아르곤 (Ar) 유량에 따라서 반도체기판의 특성이 달라지는 것을 확인하였다. 전도체인 tin doped zinc oxide (ZTO) 박막을 절연체인 SiOC 위에 증착하여 소자의 전도성을 살펴보았다. SiOC 박막의 특성은 플라즈마에 의하여 이온화현상이 일어날 때 Ar 유량에 따라서 이온화되는 경향이 달라지면서 반도체 계면에서의 공핍현상이 달라졌으며, 공핍층 형성이 많이 일어나는 곳에서 쇼키접합 특성이 잘 형성되는 것을 확인하였다. 아르곤 가스의 유량이 많은 경우 이온화 반응이 많이 일어나고 따라서 접합면에서 전자 홀쌍의 재결합반응에 의하여 전하들이 없어지게 되면 절연특성이 좋아지고 공핍층의 전위장벽이 증가되며, 쇼키접합의 형성이 유리해졌다. 쇼키접합이 잘 이루어지는 SiOC 박막에서 ZTO를 증착하였을 때 SiOC와 ZTO 사이의 계면에서 전하들이 재결합되면서 전기적으로 안정된 ZTO 박막을 형성하고, ZTO의 전도성이 증가되었다. 두께가 얇은 반도체소자에서 흐르는 낮은 전류를 감지하기 위해서는 쇼키접합이 이루어져야 하며, 낮은 전류만으로도 전기신호의 품질이 우수해지고 또한 채널층인 ZTO 박막에서의 전류의 발생도 많아지는 것을 확인하였다.

High-Performance Schottky Junction for Self-Powered, Ultrafast, Broadband Alternating Current Photodetector

  • Lim, Jaeseong;Kumar, Mohit;Seo, Hyungtak
    • 한국재료학회지
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    • 제32권8호
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    • pp.333-338
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    • 2022
  • In this work, we developed silver nanowires and a silicon based Schottky junction and demonstrated ultrafast broadband photosensing behavior. The current device had a response speed that was ultrafast, with a rising time of 36 ㎲ and a falling time of 382 ㎲, and it had a high level of repeatability across a broad spectrum of wavelengths (λ = 365 to 940 nm). Furthermore, it exhibited excellent responsivity of 60 mA/W and a significant detectivity of 3.5 × 1012 Jones at a λ = 940 nm with an intensity of 0.2 mW cm-2 under zero bias operating voltage, which reflects a boost of 50 %, by using the AC PV effect. This excellent broadband performance was caused by the photon-induced alternative photocurrent effect, which changed the way the optoelectronics work. This innovative approach will open a second door to the potential design of a broadband ultrafast device for use in cutting-edge optoelectronics.

스퍼터링 방법으로 증착한 SiO2와 V2O5박막의 전류특성과 계면분석 (Interface Characteristics and Electrical Properties of SiO2 and V2O5 Thin Films Deposited by the Sputtering)

  • 이향강;오데레사
    • 반도체디스플레이기술학회지
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    • 제17권4호
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    • pp.66-69
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    • 2018
  • This study was researched the electrical properties of semiconductor devices such as ITO, $SiO_2$, $V_2O_5$ thin films. The films of ITO, $SiO_2$, $V_2O_5$ were deposited by the rf magnetron sputtering system with mixed gases of oxygen and argon to generate the plasma. All samples were cleaned before deposition and prepared the metal electrodes to research the current-voltage properties. The electrical characteristics of semiconductors depends on the interface's properties at the junction. There are two kinds of junctions such as ohmic and schottky contacts in the semiconductors. In this study, the ITO thin film was shown the ohmic contact properties as the linear current-voltage curves, and the electrical characteristics of $SiO_2$ and $V_2O_5$ films were shown the non-linear current-voltage curves as the schottky contacts. It was confirmed that the electronic system with schottky contacts enhanced the electronic flow owing to the increment of efficiency and increased the conductivity. The schottky contact was only defined special characteristics at the semiconductor and the interface depletion layer at the junction made the schottky contact which has the effect of leakage current cutoff. Consequently the semiconductor device with shottky contact increased the electronic current flow, in spite of depletion of carriers.

Al2O3/Si/Al2O3구조를 이용한 실리콘태양전지 제작 및 특성 (Fabrication and Properties of Silicon Solar Cells using Al2O3/Si/Al2O3 Structures)

  • 김광호
    • 반도체디스플레이기술학회지
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    • 제14권4호
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    • pp.45-49
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    • 2015
  • Using a combined CVD and ALD equipment system, multi-layer quantum well structures of $Al_2O_3/a-Si/Al_2O_3$ were fabricated on silicon Schottky junction devices and implemented to quantum well solar cells, in which the 1~1.5 nm thicknesses of the aluminum oxide films and the a-Si thin film layers were deposited at $300^{\circ}C$ and $450^{\circ}C$, respectively. Fabricated solar cell was operated by tunneling phenomena through the inserted quantum well structure being generated electrons on the silicon surface. Efficiency of the fabricated solar cell inserted with multi-quantum well of 41 layers has been increased by about 10 times that of the solar cell of pure Schottky junction solar cell.

어븀-실리사이드/p-형 실리콘 접합에서 쇼트키 장벽 높이 변화 (Change of Schottky barrier height in Er-silicide/p-silicon junction)

  • 이솔;전승호;고창훈;한문섭;장문규;이성재;박경완
    • 한국진공학회지
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    • 제16권3호
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    • pp.197-204
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    • 2007
  • p-형 실리콘 기판 위에 수 ${\AA}$ 두께의 어븀 금속을 증착하고, 후열처리 과정을 통하여 어븀-실리사이드/p-형 실리콘 접합을 형성하였다. 초고진공 자외선 광전자 분광 실험을 통하여 증착한 어븀의 두께에 따라 어븀-실리사이드의 일함수가 4.1 eV까지 급하게 감소하는 것을 관찰하였으며, X-ray 회절 실험에 의하여 형성된 어븀 실리사이드가 주로 $Er_5Si_3$상으로 구성되어 있음을 밝혔다. 또한, 어븀-실리사이드/p-형 실리콘 접합에 알루미늄 전극을 부착하여 쇼트키 다이오드를 제작하고, 전류전압 곡선을 측정하여 쇼트키 장벽의 높이를 산출하였다. 산출된 쇼트키 장벽의 높이는 $0.44{\sim}0.78eV$이었으며 어븀 두께 변화에 따른 상관 관계를 찾기 어려웠다. 그리고 이상적인 쇼트키 접합을 가정하고 이미 측정한 일함수로부터 산출한 쇼트키 장벽의 높이는 전류-전압 곡선으로부터 산출한 값에 크게 벗어났으며, 이는 어븀-실리사이드가 주로 $Er_5Si_3$ 상으로 구성되어 있고, $Er_5Si_3/p-$형 실리콘 계면에 존재하는 고밀도의 계면 상태에 기인한 것으로 사료된다.