• Journal of Electrical Engineering and Technology
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• 제4권4호
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• pp.559-565
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• 2009

Power dissipation during scan testing is becoming an important concern as design sizes and gate densities increase. The high switching activity of combinational circuits is an unnecessary operation in scan shift mode. In this paper, we present a novel architecture to reduce test power dissipation in combinational logic by blocking signal transitions at the logic inputs during scan shifting. We propose a unique architecture that uses dmuxed scan flip-flop (DSF) and transmission gate as an alternative to muxed scan flip-flop. The proposed method does not have problems with auto test pattern generation (ATPG) techniques such as test application time and computational complexity. Moreover, our elegant method improves performance degradation and large overhead in terms of area with blocking logic techniques. Experimental results on ITC99 benchmarks show that the proposed architecture can achieve an average improvement of 30.31% in switching activity compared to conventional scan methods. Additionally, the results of simulation with DSF indicate that the powerdelay product (PDP) and area overhead are improved by 28.9% and 15.6%, respectively, compared to existing blocking logic method.

• Journal of Communications and Networks
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• 제17권4호
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• pp.351-361
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• 2015

In this paper, a new decoding scheme is proposed to improve the error correcting performance of low-density parity-check (LDPC) codes in high signal-to-noise ratio (SNR) region by using post-processing. It behaves as follows: First, a conventional LDPC decoding is applied to received LDPC codewords one by one. Then, we count the number of word errors in a predetermined number of decoded codewords. If there is no word error, nothing needs to be done and we can move to the next group of codewords with no delay. Otherwise, we perform a proper post-processing which produces a new soft-valued codeword (this will be fully explained in the main body of this paper) and then apply the conventional LDPC decoding to it again to recover the unsuccessfully decoded codewords. For the proposed decoding scheme, we adopt a simple product code structure which contains LDPC codes and simple algebraic codes as its horizontal and vertical codes, respectively. The decoding capability of the proposed decoding scheme is defined and analyzed using the parity-check matrices of vertical codes and, especially, the combined-decodability is derived for the case of single parity-check (SPC) codes and Hamming codes used as vertical codes. It is also shown that the proposed decoding scheme achieves much better error correcting capability in high SNR region with little additional decoding complexity, compared with the conventional LDPC decoding scheme.

• International Journal of Advanced Culture Technology
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• 제8권3호
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• pp.90-100
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• 2020

Our overall society circulates in line with the economical situations characterized by production and consumption and companies play the role of providing products and services, thus taking very significant responsibilities for the socioeconomical and cultural aspects in society. Therefore, when designers attempt to think of a way to enable companies and society to share their values and propose specific concepts and visualize outcomes, it is very critical to be able to understand economical philosophy and management strategies that interconnect companies with society and seek out proper design approaches. Recently, the world's enterprise and management culture tend to connect products and services provided by companies through chains of social values. Based on the abovementioned shift in the management paradigm, the researcher investigates and analyzes actual cases of attempts by Samsung Electronics to achieve its social impacts and studies actual roles and approaches of in-house designers with creativity and insights of humanity with regard to these attempts. Each case is selected from various fields such as the company's products and service development, business systems, culture, and external strategies and the ultimate goal is to learn about actual insights and approaches of designers to make contributions to the company's management with social impacts. Especially, humanity and creative thinking of many designers working in the manufacturing industry can have significant contributions to achieving its management with social impacts and effects of sustainable management.

• Journal of Welding and Joining
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• 제31권3호
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Corrosion Science and Technology
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• 제17권4호
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• pp.176-182
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• 2018

Corrosion of the Cu alloy with 10wt% Ni in stagnant seawater with residual free chlorine was investigated. Despite that fact that Cu alloys are widely used for seawater applications due to their stubborn resistance to chloride attack, not much is known as to how the residual free chlorine in seawater affects corrosion of Cu and its alloys. In this work, immersion tests were conducted in the presence of different levels of chlorine for 90-10 Cu-Ni samples, one of the most frequently used Cu alloys for seawater application, mostly in shipbuilding. The results revealed no evidence for accelerated corrosion of the Cu-Ni alloy even in the presence of 5 ppm residual chlorine in seawater, signifying that the Cu-Ni alloy can be more tolerant to residual chlorine that has been commonly cited by the shipbuilding industry. However, comparison of polarization behavior of the alloy samples in the presence of different electrolytes with different concentrations of residual chlorine suggests that higher concentration of chlorine could increase the corrosion rate of the Cu-Ni alloy. Furthermore, it is suggested that microorganisms in the seawater could increase the corrosion rate of the Cu-Ni alloy by encouraging exfoliation of the corrosion product off the metal surface.

• Applied Microscopy
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• 제45권2호
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• pp.89-94
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• 2015

This article briefly reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.

• Asian Journal of Innovation and Policy
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• 제9권3호
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• pp.360-393
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• 2020

The space industry is a comprehensive and technology-intensive industry involving different converging technologies. However, most of the companies in Korea's space industry are small and medium-sized enterprises (SMEs) and need to strengthen global capacity to export their products. However, the link between the destination country and the product remains insufficient. Consequently, the purpose of this study is to propose an export roadmap for space products to provide SMEs with export opportunities and strategic guidelines. For this, technology roadmap and portfolio analysis are applied to this purpose. This study is expected to be helpful to SMEs and government agencies.

• 대한인간공학회지
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• 제26권3호
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• pp.111-115
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• 2007

Design equations for anthropometric product design are developed by considering the geometrical relationships of design dimensions and anthropometric dimensions. The present study applied the design structure matrix (DSM) method to the development of design equations for a computer workstation, and compared design values from the design equations with corresponding design values of ergonomic recommendations and existing products. The relationships between design dimensions (e.g., legroom and worktable) were analyzed by a DSM, and then the application order of design equations (e.g., seatpan, backrest, armrest, legroom, and worktable in descending order) was determined. Next, design equations were developed by analyzing the geometric relationships between computer workstation design dimensions and anthropometric dimensions. Finally, design values for a computer workstation were determined by considering a standard posture defined and representative human models (5th, 50th, 95th %ile). The design values calculated using the design equations were similar with those of ergonomic recommendations found in literature and two commercial products measured in the study; however, some design values (e.g., seatpan height) were different due to discrepancy in standard posture. The DSM method would be utilized to systematically analyze the relationships between design dimensions for anthropometric product design.

• 한국실내디자인학회논문집
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• 제23권4호
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• pp.190-200
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• 2014

The domestic distribution environment of electronic goods has been placing more emphasis on securing each company's own interests and maintaining the existing customers as the most important purpose of marketing due to the change in consumption environment, the excessive cutthroat competition between retailers, the saturated number of branches for each company, weak revenue structure and declining competitiveness. In addition, the target of marketing has been shifted to specific consumers and the concept of a consumer is sub-divided into a "user" of a product and a "shopper" who buys a product. The purpose thereof is to increase the in-store purchase rate by analyzing the psychology and behavior of a shopper who actually visits a store for purchasing a product. Thus, the purpose of this study is to identify the correlation between the buying behavior of a shopper and product display based on "Digital Plaza" among the domestic electronic goods brand shops, which is selling products at various prices. This study is meaningful since it is utilized as data to plan store display for promoting purchase.

• 대한환경공학회지
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• 제39권9호
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• pp.527-533
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• 2017

제조공정이 기술 집약적인 반면 제품 수명이 짧아 다량으로 버려지는 스마트폰의 환경영향에 관심이 커지고 있다. 이 연구에서는 전과정평가 기법을 기반으로 스마트폰의 다양한 환경영향을 정량적으로 분석, 평가하였다. ISO 14040 시리즈 표준에 의거한 전과정평가를 수행하였고, 스마트폰의 제조전, 제조, 유통, 사용 및 폐기를 포함하는 전과정 단계를 시스템경계에 포함하였다. 평가한 10개 환경영향범주 모두에서 제조전단계가 가장 큰 환경영향을 나타내었다. 지구온난화 영향은 제조전단계, 유통단계, 사용단계, 제조단계, 폐기단계경우 각각 52.6%, 23.9%, 15.7%, 7.0% 및 0.8% 이었다. 스마트폰 제조전단계의 부품별 환경영향은 PCB, 배터리, 디스플레이 모듈 순이었다. 따라서 스마트폰의 전과정 환경영향 저감을 위해서는 스마트폰 소형/경량화를 통해 자원사용량을 줄이고, 자원순환성을 높일 수 있는 친환경 소재를 적용하여 제조전단계의 환경영향을 줄이려는 노력이 필요하다.