Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy |
Bae, Jee-Hwan
(School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Shin, Keesam (School of Nano and Advanced Materials Engineering, Changwon National University) Lee, Joon-Hwan (Advanced Materials & Device Lab., Corporate R&D Institute, Samsung Electro-Mechanics Co.) Kim, Mi-Yang (Advanced Materials & Device Lab., Corporate R&D Institute, Samsung Electro-Mechanics Co.) Yang, Cheol-Woong (School of Advanced Materials Science & Engineering, Sungkyunkwan University) |
1 | Song J M, Chuang H Y, and Wen X T (2007a) Thermal and tensile properties of Bi-Ag alloys. Metall. Mater. Trans. A 38, 1371-1375. DOI |
2 | Song J M, Chuang H Y, and Wu Z M (2006) Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates. J. Electron. Mater. 35, 1041-1049. DOI |
3 | Song J M, Chuang H Y, and Wu Z M (2007b) Substrate dissolution and shear properties of the joints between Bi-Ag alloys and Cu substrate for high-temperature soldering applications. J. Electron. Mater. 36, 1516-1523. DOI |
4 | Stadelmann P A (1987) EMS - a software package for electron diffraction analysis and HREM image simulation in materials science. Ultramicroscopy 21, 131-145. DOI |
5 | Suganuma K (2004) Lead-Free Soldering in Electronics (Marcel Dekker, New York). |
6 | Suganuma K, Kim S J, and Kim K S (2009) High-temperature lead-free solders: properties and possibilities. JOM-US. 61, 64-71. |
7 | Takahashi T, Komatsu S, Nishikawa H, and Takemoto T (2010) Improvement of high-temperature performance of Zn-Sn solder joint. J. Electron. Mater. 39, 1241-1247. DOI |
8 | Takaku Y, Felicia L, Ohnuma I, Kainuma R, and Ishida K (2008) Interfacial reaction between Cu substrates and Zn-Al base high-temperature Pbfree solders. J. Electron. Mater. 37, 314-323. DOI |
9 | Takaku Y, Makino K, Watanabe K, Ohnuma I, Kainuma R, Yamada Y, Yagi Y, Nakagawa I, Atsumi T, and Ishida K (2009) Interfacial reaction between Zn-Al-based high-temperature solders and Ni substrate. J. Electron. Mater. 38, 54-60. DOI |
10 | Vianco P T (2002) Solder technology for ultra high temperatures. Weld. J. 81, 51-54. |
11 | Wang C, Chen H, and Li P (2012) Interfacial reactions of high-temperature Zn-Sn solders with Ni substrate. Mater. Chem. Phys. 136, 325-333. DOI |
12 | Aksoz S, Ocak Y, Marasli N, and Keslioglu K (2011) Determination of thermal conductivity and interfacial energy of solid Zn solition in the Zn-Al-Bi eutectic system. Exp. Therm. Fluid. Sci. 35, 395-404. DOI |
13 | Chen S W, Chem P Y, and Wang C H (2006) Lowering of Sn-Sb alloy melting points caused by substrate dissolution. J. Electron. Mater. 35, 1982-1985. DOI |
14 | Chen S W, Zi A, Chen P, Wu H, Chen Y, and Wang C (2008) Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples. Mater. Chem. Phys. 111, 17- 19. DOI |
15 | Cheng F, Gao F, Wang Y, Wu Y, Ma Z, and Yang J (2012) Sn addition on the tensile properties of high temperature Zn-4Al-3Mg solder alloys. Microelectron. Reliab. 52, 579-584. DOI |
16 | El-Daly A A, Fawzy A, Mohamad A Z, and El-Taher A M (2011a) Microstructural evolution and tensile properties of Sn-5Sb solder alloy containing small amount of Ag and Cu. J. Alloy. Compd. 509, 4574-4582. DOI |
17 | El-Daly A A, Mohamad A Z, Fawzy A, and El-Taher A M (2011b) Creep behavior of near-peritectic Sn-5Sb solders containing small amounts of Ag and Cu. Mater. Sci. Eng. A 528, 1055-1062. DOI |
18 | Gancarz T, Pstrus J, Fima P, and Mosinska S (2012) Thermal properties and wetting behavior of high temperature Zn-Al-In solders. J. Mater. Eng. Perform. 21, 599-605. DOI |
19 | Geranmayeh A R and Mahmudi R (2005) Power law identation creep of Sn-5%Sb solder alloy. J. Mater. Sci. 40, 3361-3366. DOI |
20 | Haque A, Lim B H, Haseeb A S M A, and Masjuki H H (2012) Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame. J. Mater. Sci.: Mater. Electron. 23, 115-123. DOI |
21 | Haque A, Won Y S, Haseeb A S M A, and Masjuki H H (2010a) Investigations on Zn-Al-Ge alloys as high temperature die attach material. Electronic System-Integration Technology Conference (ESTC) 3, 1-5. |
22 | Haque A, Won Y S, Lim B H, Haseeb A S M A, and Masjuki H H (2010b) Effect of Ni metallization on interfacial reactions and die attach properties of Zn-Al-Mg-Ga high temperature lead-free solder. International Electronic Manufacturing Technology Conference 34, 1-6. |
23 | Hui W, Siyuan H, Xuming C, and Deping H (2009) Interfacial structure and mechanical properties of aluminium foam joints fluxless-soldered with Zn-Al-Cu base alloy. Acta Metall. Sin. 45, 723-728. |
24 | Iseki T and Takamori M (2012) Development of Bi-based Pb-free solders for high-temperature. J. Jpn. Inst. Electron. Pack. 15, 153-157. DOI |
25 | Kang N H, Na H S, Kim S J, and Kang C Y (2009) Alloy design of Zn-Al-Cu solder for ultra high temperatures. J. Alloy. Compd. 467, 246-250. DOI ScienceOn |
26 | Karakaya I and Thompson W T (1993) The Ag-Bi (silver-bismuth) system. J. Phase Equilib. 14, 525-530. DOI |
27 | Kim S J, Kim K S, Kim S S, Kang C Y, and Suganuma K (2008) Characteristics of Zn-Al-Cu alloys for high temperature solder application. Mater. Trans. 49, 1531-1536. DOI |
28 | Kim S, Kim K S, Kim S S, and Suganuma K (2009b) Interfacial reaction and die attach properties of Zn-Sn high-temperature solders. J. Electron. Mater. 38, 266-272. DOI |
29 | Kim S, Kim K S, Kim S S, Suganuma K, and Izuta G (2009a) Improving the reliability of Si die attachment with Zn-Sn-based high-temperature Pb-free solder using a TiN diffusion barrier. J. Electron. Mater. 38, 2688-2675. DOI |
30 | Lee J E, Kim K S, Suganuma K, Takenaka J, and Hagio K (2005) Interfacial properties of Zn-Sn alloys as high temperature lead-free solder on Cu substrate. Mater. Trans. 46, 2413-2418. DOI |
31 | Mahmudi R and Eslami E (2010) Inpression creep behavior of Zn-Sn hightemperature lead-free solders. J. Electron. Mater. 39, 2495-2502. DOI |
32 | Moser Z, Dutkiewicz J, Gasior W, and Salawa J (1985) The Sn-Zn (tin-zinc) system. Bull. Alloy Phase Diagrams 6, 330-334. DOI |
33 | Murray J L (1983) The Al-Zn (aluminum-zinc) system. Bull. Alloy Phase Diagrams 4, 55-73. DOI |
34 | Okamoto H (2012) Sb-Sn (antimony-tin). J. Pahse Equilib. Diff. 33, 347. DOI |
35 | Santos W L R, Brito C, Quaresma J M V, Spinelli J E, and Garcia A (2014) Platelike cell growth during directional solidification of a Zn-20wt%Sn hightemperature lead-free solder alloy. Mater. Sci. Eng. B 182, 29-36. DOI |
36 | Shi Y, Fang W, Xia Z, Lei Y, Guo F, and Li X (2010) Investigation of rare earthdoped BiAg high-temperature solders. J. Mater. Sci.-Mater. El. 21, 875-881. DOI |
37 | Shimizu T, Ishikawa H, Ohnuma I, and Ishida K (1999) Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use. J. Electron. Mater. 28, 1172-1175. DOI |
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