Fabrication and Reliability Test of Device Embedded Flexible Module |
Kim, Dae Gon
(Micro Device Solution Team, Samsung Techwin Co., Ltd.)
Hong, Sung Taik (Micro Device Solution Team, Samsung Techwin Co., Ltd.) Kim, Deok Heung (Micro Device Solution Team, Samsung Techwin Co., Ltd.) Hong, Won Sik (Components and Materials Physics Research Center, Korea Electronics Technology Institute) Lee, Chang-Woo (Advanced Welding & Joining Technology Center, Korea Institute of Industrial Technology) |
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