• Title/Summary/Keyword: SPICE model

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Comparative Pixel Characteristics of ELA and SMC poly-Si TETs for the Development of Wide-Area/High-Quality TFT-LCD (대화면/고화질 TFT-LCD 개발을 위하여 ELA 및 SMC로 제작된 다결정 실리콘 박막 트랜지스터의 화소 특성 비교)

    • Journal of the Korean Vacuum Society
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    • v.10 no.1
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    • pp.72-80
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    • 2001
  • In this paper, we present a systematic method of extracting the input parameters of poly-Si TFT(Thin-Film Transistor) for Spice simulations. This method has been applied to two different types of poly-Si TFTs such as ELA (Excimer Laser Annealing) and SMC (Silicide Mediated Crystallization) with good fitting results to experimental data. Among the Spice circuit simulators, the PSpice has the GUI(graphic user interface) feature making the composition of complicated circuits easier. We added successfully the poly-Si TFT model of AIM-Spice to the PSpice simulator, and analyzed easily to compare the electrical characteristics of pixels without or with the line RC delay. In the comparative results, the ELA poly-Si TFT is superior to the SMC poly-Si TFT in the charging time and the kickback voltage for the TFT-LCD (Thin Film Transistor-Liquid Crystal Display).

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SPICE Simulation of 3D Sequential Inverter Considering Electrical Coupling (전기적 상호작용을 고려한 3차원 순차적 인버터의 SPICE 시뮬레이션)

  • Ahn, Tae-Jun;Yu, Yun Seop
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2017.05a
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    • pp.200-201
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    • 2017
  • This paper introduces the SPICE simulation results of 3D sequential inverter considering electrical coupling. TCAD data and the SPICE data are compared to verify that the electrical coupling is well considered by using BSIM-IMG for the upper NMOS and LETI-UTSOI model for the lower PMOS. When inter layer dielectric is small, it is confirmed that electrical coupling is well reflected in the top transistor $I_{ds}-V_{gs}$ characteristics according to the change of the bottom transistor gate voltage.

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A Systematic Method for SPICE Simulation of Electrical Characteristics of Poly-Si TFT-LCD Pixel (SPICE를 사용한 다결정 실리콘 TFT-LCD 화소의 전기적 특성 시뮬레이션 방법의 체계화)

  • Son, Myung-Sik;Ryu, Jae-Il;Shim, Seong-Yung;Jang, Jin;Yoo Keon-Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.12
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    • pp.25-35
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    • 2001
  • In order to analyze the electrical characteristics of complicated thin film transistor-liquid crystal display (TFT-LCD) array circuits, it is indispensible to use simulation programs such as PSPICE and AIM-SPICE. In this paper, we present a systematic method of extracting the input parameters of poly-Si TFT for SPICE simulations. This method was applied to two different types of poly-Si TFTs, fabricated by excimer laser annealing and silicide mediated crystallization methods, and yielded good fitting results to experimental data. Among the SPICE simulators, PSPICE has the graphic user interface feature making the composition of complicated circuits easier. We added successfully a poly-Si TFT device model to the PSPICE simulator, and analyzed easily the electrical characteristics of pixels considering the line RC delay. The results of this work would contribute to efficient simulations of poly-Si TFT-LCD arrays.

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New SPICE Modeling for Bias-Dependent Gate-Drain Overlap Capacitance in RF MOSFETs (RF MOSFET의 바이어스 종속 게이트-드레인 오버렙 캐패시턴스의 새로운 SPICE 모델링)

  • Lee, Sangjun;Lee, Seonghearn
    • Journal of the Institute of Electronics and Information Engineers
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    • v.52 no.4
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    • pp.49-55
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    • 2015
  • The inaccuracy of the bias-dependent gate-drain overlap capacitance $C_{gdo}$ simulation in original BSIM4 and BSIM4 macro model using a diode is analyzed in detail. It is found that the accuracy of the macro model is better than of the BSIM4. However, the macro model cannot be used in the linear region. In order to remove the inaccuracy of the conventional models, a new BSIM4 macro model with a physical bias-dependent $C_{gdo}$ equation is proposed and its accuracy is validated in the full bias range.

A Design of Resonant DC Link Inverter for Induction Motor Driver Using SPICE Model (SPICE모델을 이용한 유도전동기 구동용 공진형 직류링크 인버터의 설계연구)

  • 한수빈;정봉만;김규덕;최수현
    • The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.10 no.1
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    • pp.56-65
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    • 1996
  • 유도전동기 구동용 공진형 직류링크 인버터의 공진링크 회로와 제어기 설계를 종합적으로 시도하였으며 기존의 해석적 방법의 설계를 보완하기 위하여 SPICE 시뮬레이션에 기초한 설계를 수행하였다. 공진형 직류링크 인버터의 핵심이 되는 공진 링크단의 설계와 공진링크 초기 전류의 최적제어, 인버터 출력의 제어방식 그리고 클램핑 스위치에 저어방식 등에 대한 설계에 있어서 SPICE 에서의 검증과 조정을 통해 실용적 설계와 동작에 대한 예측실험이 가능함을 제시하였다. 이의 타당성을 증명하기 위해서 실험용 공진형 인버터를 구성하여 동작을 확인하였다.

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SPICE Modeling of Organic Field Effect Transistors (OFETs) (유기 박막 트랜지스터의 스파이스 모형화)

  • Lee, Jae-Woo;Park, Eung-Seok;Park, So-Jeong;Jang, Do-Young;Kim, Kang-Hyun;Kim, Gyu-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.142-143
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    • 2006
  • Organic thin film transistors(OTFTs) were simulated by a SPICE model adopted in the amorphous TFTs(a-Si:H TFTs). The gate voltage-dependent mobilities were assumed to fit the representative current-voltage characteristics. The optimal fitting procedures were suggested to compare the experimental data with the mathematical expressions used in the amorphous TFTs. Each SPICE parameter explains the gate dependent mobilities in OTFTs which might originate from the influence of the hopping conduction.

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Random Forest Model for Silicon-to-SPICE Gap and FinFET Design Attribute Identification

  • Won, Hyosig;Shimazu, Katsuhiro
    • IEIE Transactions on Smart Processing and Computing
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    • v.5 no.5
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    • pp.358-365
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    • 2016
  • We propose a novel application of random forest, a machine learning-based general classification algorithm, to analyze the influence of design attributes on the silicon-to-SPICE (S2S) gap. To improve modeling accuracy, we introduce magnification of learning data as well as randomization for the counting of design attributes to be used for each tree in the forest. From the automatically generated decision trees, we can extract the so-called importance and impact indices, which identify the most significant design attributes determining the S2S gap. We apply the proposed method to actual silicon data, and observe that the identified design attributes show a clear trend in the S2S gap. We finally unveil 10nm key fin-shaped field effect transistor (FinFET) structures that result in a large S2S gap using the measurement data from 10nm test vehicles specialized for model-hardware correlation.

A Modeling of CMOS Inverter for Maximum Power Dissipation Prediction (CMOS 인버터의 최대 전력소모 예측을 위한 모델링)

  • 정영권;김동욱
    • Proceedings of the IEEK Conference
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    • 1998.10a
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    • pp.1057-1060
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    • 1998
  • Power Dissipation and circuit speed become the most importance parameters in VLSI system maximum power dissipation for VLSI system design. We remodeled CMOS inverter according to the operating region, saturation region or linear regin, and calculate maximum power dissipation point of CMOS inverter. The result of proposed maximum power dissipation model compared with those from SPICE simulation which results that the proposed maximum power dissipation model has the error rate within 10% to SPICE simulation.

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Study on the Parameter Optimization of Soft-switching DC/DC Converters with the Response Surface Methodology, a SPICE Model, and a Genetic Algorithm

  • Liu, Shuai;Wei, Li;Zhang, Yicheng;Yao, Yongtao
    • Journal of Power Electronics
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    • v.15 no.2
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    • pp.479-486
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    • 2015
  • The application of soft-switching techniques is increasing in the DC/DC converter area. It is important to design soft-switching parameters to ensure the converter operates properly and efficiently. An optimized design method is presented in this paper. The objective function is the total power loss of a converter, while the variables are soft-switching parameters and the constraints are the electrical requirements for soft-switching. Firstly, a response surface methodology (RSM) model with a high precision is built, and the rough optimized parameters can be obtained with the help of a genetic algorithm (GA) in the solution space determined by the constraints. Secondly, a re-optimization is conducted with a SPICE model and a GA, and accurate optimized parameters can be obtained. Simulation and experiment results show that the proposed method performs well in terms of a wide adaptability, efficiency, and global optimization.

Compact Capacitance Model of L-Shape Tunnel Field-Effect Transistors for Circuit Simulation

  • Yu, Yun Seop;Najam, Faraz
    • Journal of information and communication convergence engineering
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    • v.19 no.4
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    • pp.263-268
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    • 2021
  • Although the compact capacitance model of point tunneling types of tunneling field-effect transistors (TFET) has been proposed, those of line tunneling types of TFETs have not been reported. In this study, a compact capacitance model of an L-shaped TFET (LTFET), a line tunneling type of TFET, is proposed using the previously developed surface potentials and current models of P- and L-type LTFETs. The Verilog-A LTFET model for simulation program with integrated circuit emphasis (SPICE) was also developed to verify the validation of the compact LTFET model including the capacitance model. The SPICE simulation results using the Verilog-A LTFET were compared to those obtained using a technology computer-aided-design (TCAD) device simulator. The current-voltage characteristics and capacitance-voltage characteristics of N and P-LTFETs were consistent for all operational bias. The voltage transfer characteristics and transient response of the inverter circuit comprising N and P-LTFETs in series were verified with the TCAD mixed-mode simulation results.