• 대한전자공학회논문지SD
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• 제40권10호
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• pp.24-31
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• 2003

Super-steep retrograded channel (SSR)을 갖는 bulk MOSFET, fully-depleted SOI, double-gate MOSFET 구조에 대하여 단채널 효과를 비교 분석하였다. Evanescent-mode를 이용하여, 각 소자 구조에 대한 characteristics scaling-length (λ)를 추출할 수 있는 수식을 유도하고 추출된 λ의 정확도를 소자 시뮬레이션 결과와 비교하여 검증하였다. 70 nm CMOS 기술에 사용 가능하도록 단채널 효과를 효과적으로 제어하기 위해서는 최소 게이트 길이가 5λ 이상이어야 하며 SSR 소자의 공핍층 두께는 약 30 nm 정도로 스케일링되어야 한다. High-κ 절연막은 equivalent SiO2 두께를 매우 작게 유지하지 않을 경우 절연막을 통한 드레인 전계의 침투 때문에 소자를 스케일링하는데 제한을 갖는다.

• 전자공학회논문지
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• 제50권1호
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• pp.180-184
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• 2013

이 논문에서는 (SOI) CMOS 공정을 이용한 저전력 안테나 스위치 컨트롤러 IC가 설계되었다. 제안 된 컨트롤러는 전력 수용능력과 고조파 왜곡 성능을 향상시키기 위하여 입력 신호에 따라 안테나 스위치를 구성하는 FET소자의 게이트 단자와 바디 단자에 +VDD, GND 그리고 -VDD에 해당하는 3 가지 상태의 로직 레벨을 제공한다. 또한, 입력-결합 전류제한 링 발진기와 하드웨어 효율적인 레벨 시프터를 적용함으로서 전력소모와 하드웨어 복잡도를 크게 감소시켰다. 제안 된 회로는 +2.5 V 전원을 공급받으며 송신 모드에서 135 ${\mu}A$를 소모하며 10 ${\mu}s$의 빠른 start-up 시간을 달성하였고, 전체 면적은 $1.3mm{\times}0.5mm$로 설계되었다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 학술대회지
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• pp.482-485
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• 2004

We fabricated a hybrid bulk/fully depleted silicon on insulator (FDSOI) complementary metal oxide semiconductor (CMOS) active pixel image sensor. The active pixel is comprised of reset and source follower transistors on the SOI seed wafer, while the pinned photodiode and readout gate and floating diffusion are fabricated on the SOI handle wafer after the removal of the buried oxide. The source of dark current is eliminated by hybrid bulk/FDSOI pixel structure between localized oxidation of silicon (LOCOS) and photodiode(PD). By using the low noise hybrid pixel structure, dark currents qm be suppressed significantly. The pinned photodiode can also be optimized for quantum efficiency and reduce the noise of dark current. The spectral response of the pinned photodiode on the SOI handle wafer is very flat between 400 nm and 700 nm and the dark current that is higher than desired is about 10 nA/cm2 at a $V_{DD}$ of 2 V.

• 센서학회지
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• 제11권5호
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• pp.294-300
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• 2002

In this study, we fabricated thermopile infrared sensor with floating membrane structure. Floating membrane was formed by SOI(Silicon On Insulator) structure. In SOI structure, silicon dioxide layer between top silicon layer and bottom silicon substrate was etched by HF solution, then membrane was floated over substrate. After membrane was floated, thermopile pattern was formed on membrane. By insertion of SOI technology, we could obtain thermal isolation structure easily and passivation process for sensor pattern protection was not required during fabrication process. Then, the amplifier circuit for thermopile sensor was fabricated by using $1.5{\mu}m$ CMOS process. The voltage gain of fabricated amplifier was about two hundred.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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• pp.249-252
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• 2000

A new Smart rower IC's based on the Partial SOI technology was designed for such applications as mobile communication systems, high-speed HDD systems etc. A new methodology of integrating a 0.8${\mu}{\textrm}{m}$ BiCMOS compatible Smart Power technology, high voltage bipolar device, high speed SAVEN bipolar device, LDD NMOSFET and a new LDMOSFET based on the Partial SOI technology is presented in this paper. The high voltage bipolar device has a breakdown voltage of 40V for the output stage of analog circuit. The optimized Partial SOI LDMOSFET has an off-state breakdown voltage of 75 V and a specific on- resistance of 0.249mΩ.$\textrm{cm}^2$ with the drift region length of 3.5${\mu}{\textrm}{m}$. The high-speed SAVEN bipolar device shows cut-off frequency of about 21㎓. The simulator DIOS and DESSIS has been used to get these results.

• 전자공학회논문지
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• 제53권9호
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• pp.49-53
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• 2016

RF 채널 분포효과를 위한 전압 종속 외부 게이트 커패시턴스가 사용된 High resistivity(HR) silicon-on-insulator(SOI) RF accumulation-mode MOS 버랙터의 대신호 모델이 새롭게 개발되었다. 이 모델의 전압 종속 파라미터들은 정확한 S-파라미터 optimization을 사용하여 추출되었고, 이를 피팅하여 empirical 모델 방정식을 구축하였다. 이러한 새로운 대신호 RF 모델은 넓은 전압영역에서 측정된 Y11-파라미터 데이터와 20 GHz까지 잘 일치함으로써 정확도가 검증되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.180-183
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• 2003

The monolayer of oxygen atoms sandwitched between the adjacent nanocrystalline silicon layers was formed by ultra high vacuum-chemical vapor deposition (UHV-CVD). This multi-layer Si-O structure forms a new type of superlattice, semiconductor-atomic superattice (SAS). According to the experimental results, high-resolution cross-sectional transmission electron microscopy (HRTEM) shows epitaxial system. Also, the current-voltage (I-V) measurement results show the stable and good insulating behavior with high breakdown voltage. It is apparent that the system may form an epitaxially grown insulating layer as possible replacement of silicon-on-insulator (SOI), a scheme investigated as future generation of high efficient and high density CMOS on SOI.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권1호
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• pp.8-22
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• 2014

In the past few decades, CMOS logic technologies and devices have been successfully developed with the steady miniaturization of the feature size. At the sub-30-nm CMOS technology nodes, one of the main hurdles for continuously and successfully scaling down CMOS devices is the parametric failure caused by random variations such as line edge roughness (LER), random dopant fluctuation (RDF), and work-function variation (WFV). The characteristics of each random variation source and its effect on advanced device structures such as multigate and ultra-thin-body devices (vs. conventional planar bulk MOSFET) are discussed in detail. Further, suggested are suppression methods for the LER-, RDF-, and WFV-induced threshold voltage (VTH) variations in advanced CMOS logic technologies including the double-patterning and double-etching (2P2E) technique and in advanced device structures including the fully depleted silicon-on-insulator (FD-SOI) MOSFET and FinFET/tri-gate MOSFET at the sub-30-nm nodes. The segmented-channel MOSFET (SegFET) and junctionless transistor (JLT) that can suppress the random variations and the SegFET-/JLT-based static random access memory (SRAM) cell that enhance the read and write margins at a time, though generally with a trade-off between the read and the write margins, are introduced.

• ETRI Journal
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• 제26권6호
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• pp.575-582
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• 2004

Fully-depleted silicon-on-insulator (FD-SOI) devices with a 15 nm SOI layer thickness and 60 nm gate lengths for analog applications have been investigated. The Si selective epitaxial growth (SEG) process was well optimized. Both the single- raised (SR) and double-raised (DR) source/drain (S/D) processes have been studied to reduce parasitic series resistance and improve device performance. For the DR S/D process, the saturation currents of both NMOS and PMOS are improved by 8 and 18%, respectively, compared with the SR S/D process. The self-heating effect is evaluated for both body contact and body floating SOI devices. The body contact transistor shows a reduced self-heating ratio, compared with the body floating transistor. The static noise margin of an SOI device with a $1.1\;{\mu}m^2$ 6T-SRAM cell is 190 mV, and the ring oscillator speed is improved by 25 % compared with bulk devices. The DR S/D process shows a higher open loop voltage gain than the SR S/D process. A 15 nm ultra-thin body (UTB) SOI device with a DR S/D process shows the same level of noise characteristics at both the body contact and body floating transistors. Also, we observed that noise characteristics of a 15 nm UTB SOI device are comparable to those of bulk Si devices.

• ETRI Journal
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• 제35권4호
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• pp.638-643
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• 2013

This paper presents a 5-bit digital step attenuator (DSA) using a commercial 0.18-${\mu}m$ silicon-on-insulator (SOI) process for the wideband phased array antenna. Both low insertion loss and low root mean square (RMS) phase error and amplitude error are achieved employing two attenuation topologies of the switched path attenuator and the switched T-type attenuator. The attenuation coverage of 31 dB with a least significant bit of 1 dB is achieved at DC to 20 GHz. The RMS phase error and amplitude error are less than $2.5^{\circ}$ and less than 0.5 dB, respectively. The measured insertion loss of the reference state is less than 5.5 dB at 10 GHz. The input return loss and output return loss are each less than 12 dB at DC to 20 GHz. The current consumption is nearly zero with a voltage supply of 1.8 V. The chip size is $0.93mm{\times}0.68mm$, including pads. To the best of the authors' knowledge, this is the first demonstration of a low phase error DC-to-20-GHz SOI DSA.