• 한국정밀공학회지
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• 제19권8호
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• pp.172-179
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• 2002

In this paper, an efficient reverse engineering method for free-formed surfaces is proposed based on the integration of a repetitive digitizing method and vision system. In recent reverse engineering process, the equi-interval digitization method is being used since the surface information is not known. If more accurate results are required, the number of measuring point should be increased appropriately. Thus, such measuring process tends to result in too dense data including useless information, and cause excessive measuring time. This problem can be improved by applying repetitive digitizing method and image process technique, which is proposed in this paper. The proposed methods are validated through appropriate simulation and experiments.

• 한국경영과학회:학술대회논문집
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• 한국경영과학회/대한산업공학회 1999년도 춘계공동학술대회:정보화시대의 지식경영
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• pp.156-156
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• 1999

• 한국CDE학회지
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• 제5권3호
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• pp.48-50
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• 1999

• JSTS:Journal of Semiconductor Technology and Science
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• 제12권3호
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• pp.353-359
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• 2012

A highly efficient charge pump that minimizes the reverse charge sharing current (in short, reverse current) is proposed. The charge pump employs auxiliary capacitors and diode-connected MOSFET along with an early clock to drive the charge transfer switches; this new method provides better isolation between stages. As a result, the amount of reverse current is reduced greatly and the clock driver can be designed with reduced transition slope. As a proof of the concept, a 1.1V-to-9.8 V charge pump was designed in a $0.35{\mu}m$ 18 V CMOS technology. The proposed architecture shows 1.6 V ~ 3.5 V higher output voltage compared with the previously reported architecture.

• Bulletin of the Korean Chemical Society
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• 제25권6호
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• pp.873-877
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• 2004

The relationship between the behaviors of c.c.lipase back-extraction and their percolation phenomena by using AOT reverse micellar systems (RVMS) has been studied by the addition of a small amount of additives to organic phase such as thiols and nonionic-surfactants focusing on micelle-micelle interactions. The values of ${\beta}_t$ defined by the variation of percolation processes and back-extraction behaviors of c.c.lipase have a good linear correlation. The hydrophobicity of additive molecules suppressing the cluster formation of reverse micelles (high values of ${\beta}_t$) improved the back-extraction behavior of c.c.lipase. The back-extraction fraction and its rate of c.c.clipase are increased with decreasing of the value of hydrophilic lipophilic balance (HLB) and increasing of the hydrophobicity per additive molecules added to reverse micellar systems (RVSM) in the same additives concentration.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2010년도 정기 학술대회
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• pp.268-271
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• 2010

In this paper, forward and reverse analysis is introduced in order to estimate the elastic-plastic properties from a power-law hardening bulk specimen materials with one simple spherical indentation impression test. In order to verify the reliability of the reverse analysis, we have simulated about a large range of materials that essentially cover all engineering materials, using ABAQUS(6.91) program. Then, we could obtained the fitting functions and plastic parameters from the numerical analysis results. Next, through the procedure of reverse analysis we can obtain the yield stress and power-law exponent. Finally, obtain good agreement between the result from reverse analysis and initial input data from experiment.

• Asia pacific journal of information systems
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• 제9권1호
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• pp.115-142
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• 1999

Legacy applications are valuable assets that should be integrated into next generation business systems. To gain this advantage, progressive companies can reverse engineer the legacy business operations. This paper presents a form-driven object-oriented reverse engineering(FORE) methodology by the use of business forms to recover semantics of legacy applications. They retain the user-oriented contents of business and thus are easily understandable. Our form driven object-oriented reverse engineering methodology consists of five phases: form and usage analysis, form object slicing, object structure modeling, scenario design, and model integration. Knowledge about form structure and user interaction with legacy applications is used to capture the design semantics. An object model, which consists of an object structure model and scenario results from such form knowledge. The resulting object model is more likely to help reverse engineers understand and reuse legacy systems.

• 한국정밀공학회지
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• 제19권6호
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• pp.160-165
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• 2002

A study on digital processes of injection mold in reverse engineering are presented. Reverse engineering is useful fur several cases, where user has no geometry information of object. Laser scanner is used to obtaining 3D coordinates of object. Sequences to process cloud data are described; sampling to reduce number of points, sorting to adjust the point order, and fitting to curve and surface, and so on. Split slide structure of mold is used fur undercut part and high viscosity material. Flow of injection molding are analysed to correct cooling channel and simulate molding conditions. NC tool paths are generated to carve core and cavity. The processes are performed in digital data for reduction of lead time and consecutive geometry data.

• Transactions on Electrical and Electronic Materials
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• 제14권6호
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• pp.304-307
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• 2013

Reverse engineering of semiconductor devices utilizes delayering processes, in order to identify how the interconnection lines are stacked over transistor gates. Cu metal has been used in recent fabrication technologies, and de-processes becomes more difficult with the shrinking device dimensions. In this article, reverse engineering technologies to reveal the Cu interconnection lines and Cu via-plugs embedded in dielectric layers are investigated. Stacked dielectric layers are removed by $CF_4$ plasma etching, then the exposed planar Cu metal lines and via-plugs are selectively delineated by wet chemical solution, instead of the commonly used plasma-based dry etch. As a result, we have been successful in extracting the layouts of multiple layers within a system IC, and this technique can be applicable to other logic IC, analog IC, and CMOS IC, etc.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.426-429
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• 2001

Many various products are manufactured which have sculptured surfaces recently. Constructing surface of these models is required technique called reverse engineering. In reverse engineering, a product which has sculptured surfaces is measured and we create surface model to acquire complete model data of object. Measured point data needs preprocess and sampling. Next a set of point data in a plane fit section curve. At last, surface is generated by fitting to section curves. Here we uses sweep surface. Sweep surface is compatible fitting CAD model to drawing. This paper discusses converting approximation of NURBS surface as a standard surface.