• The Journal of Korean Institute of Communications and Information Sciences
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• v.11 no.3
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• pp.172-178
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• 1986

The recent interest in the design of filters is motivatied by the fact that such filter can be fully integrated using standard metal-oxide-semiconductor processing technology. This is due to replacing all the resistors in the active RC filter network by the switched capacitors. The voltage gain of a SC filter depends only on the rations of capacitance and these ratios can be obtained and maintained to high accuracy. Therefore, it is known that a switched capacitor is much better than a resistor in temperature and linearity characteristics. This paper proposed a programmable SC filter and proved the fact that ${omega}_0$ Q and G of this circuit can be controlled by digital signal. Experiments show that SC filter remains the low sensitivities but it can't avoid little influence of parasitic capacitance. As the transfer characteristic of the SC filter is varied with sampling frequency and resistor array, SC filtering technigue can be applied for digital processing, speech analysis and synthesis and so on.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.421-421
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• 2008

Generally, the polymer thick-film resistors for embedded organic or hybrid substrate are patterned by screen printing so that the accuracy of resistor pattern is not good and the tolerance of resistance is too high(${\pm}$20~30%). To reform these demerits, a method using Fodel$^{(R)}$ technology, which is the patterning method using a photosensitive resin to be developable by aqueous alkali-solution as a base polymer for thick-film pastes, was recently incorporated for the patterning of thermosetting thick-film resistor paste. Alkali-solution developable photosensitive resin system has a merit that the precise patterns can be obtained by UV exposure and aqueous development, so the essential point is to get the composition similar to PSR(photo solder resist) used for PCB process. In present research, we made the photopatternable resistor pastes using 8 kinds of epoxy acrylates and a conductive carbonblack (CDX-7055 Ultra), evaluated their developing performance, and then measured the resistance after final curing. To become developable by alkali-solution, epoxy acrylate oligomers with carboxyl group were prepared. Test coupons were fabricated by patterning copper foil on FR-4 CCL board, plating Ni/Au on the patterned copper electrode, applying the resistor paste on the board, exposing the applied paste to UV through Cr mask with resistor patterns, developing the exposed paste with aqueous alkali-solution (1wt% $Na_2CO_3$), drying the patterned paste at $80^{\circ}C$ oven, and then curing it at $200^{\circ}C$ during 1 hour. As a result, some test compositions couldn't be developed according to the kind of oligomer and, in the developed compositions, the measured resistance showed different results depending on the paste compositions though they had the same amount of carbonblack.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.2
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• pp.71-77
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• 2009

A novel phase-locked loop(PLL) architecture with multiple charge pumps for fast locking has been proposed. The proposed PLL has three charge pumps. The effective capacitance and resistance of the loop filter can be scaled up/down according to the locking status by controlling the direction and magnitude of each charge pump current. The fast locking PLL that changes its loop bandwidth through controlling charge pumps depending on locking status has been designed. The capacitor usually occupying the larger portion of the chip is also minimized with the proposed scheme. Therefore, the PLL size of $990{\mu}m\;{\times}\;670{\mu}m$ including resistors and capacitors at the bandwidth of 29.9KHz has been achieved. It has been fabricated with 3.3V $0.35{\mu}m$ CMOS process. The locking time is less than $6{\mu}s$ with the measured phase noise of -90.45dBc/Hz @1MHz at 851.2MHz output frequency.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.4
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• pp.14-23
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• 2011

In this paper, a 7-bit 2GSPS folding/interpolation A/D Converter(ADC) with a Self-Calibrated Vector Generator is proposed. The ADC structure is based on a folding/interpolation architecture whose folding/interpolation rate is 4 and 8, respectively. A cascaded preprocessing block is not only used in order to drive the high input signal frequency, but the resistive interpolation is also used to reduce the power consumption. Based on a novel self-calibrated vector generator, further, offset errors due to device mismatch, parasitic resistors. and parasitic capacitance can be reduced. The chip has been fabricated with a 1.2V 0.13um 1-poly 7-metal CMOS technology. The effective chip area including the calibration circuit is 2.5$mm^2$. SNDR is about 39.49dB when the input frequency is 9MHz at 2GHz sampling frequency. The SNDR is improved by 3dB with the calibration circuit.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.6
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• pp.91-98
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• 2004

This paper proposes a PCB plane model for generic SPICE circuit simulators. The proposed model reflects two frequency-dependent losses, namely skin and dielectric losses. After power/ground plane pair is divided into arrays of unit-cells, each unit-cell is modeled using a transmission line and two loss models. The loss model is composed of a resistor for DC loss, series HL ladder circuit for skin loss and series RC ladder circuit for dielectric loss. To verify the validity of the proposed model, it is compared with SPICE ac analysis using frequency-dependent resistors. Also, we show that the estimation results using the proposed model have a good correlation with that of VNA measurement for the typical PCB stack-up structure of general desktop PCs. With the proposed model, not only ac analysis but also transient analysis can be easily done for circuits including various non-linear/linear devices since the model consists of passive elements onl.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.11 s.102
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• pp.1114-1122
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• 2005

In this paper, the study of a design, fabrication and measurement of the receiver MMIC LNA, mixer for S-band application is described. The LNA is designed by 2-stage common source. The mixer is composed of active LO and RF balun to integrate on a chip and applied a newly proposed bias circuit to compensate the process variations of active devices. The LNA has 15.51 dB-gain and 1.02dB-Noise Figure at 2.1 GHz. The conversion gain of the mixer is -12 dB, IIP3 is approximately 4.25 dBm and port-to-port isolation is over 25 dB. The newly proposed bias circuit is composed of a few FETs and resistors, and can compensate the variation of the threshold voltage by the process variations, temperature changes and etc. The designed chip size is $1.2[mm]\times1.4[mm]$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.768-771
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• 2003

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, electronic equipment (KOMPSAT 2, RDU : Remote Drive Unit) of a satellite consists of aluminum case containing PCB (Printed circuit boards). Each PCB has resistors and IC (Integrated circuits). Noise and vibration of wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation. random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when tile frequency of random vibration meets with natural frequency of PCB. fatigue fracture nay occur in the part of solder joint. The launching environment, thus. needs to be carefully considered when designing the electronic equipment of a satellite. In general. the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM(Finite Element Method) or vibration test. In this study. the natural frequency and dynamic deflection of PCB are measured by FEM, aud the safety of the electronic components of PCB is being evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs from the electronic equipments of a satellite to home electronics.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.27-31
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• 2008

Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

• Journal of Sensor Science and Technology
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• v.20 no.3
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• pp.213-218
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• 2011

The load cell is a force sensor and a transducer that is used to convert a physical force into a electrical signal for weighing equipment. Most conventional load cells are widely used a metal foil strain gauge for sensing element when force being applied spring element in order to converts the deformation to electrical signals. The sensitivity of a load cell is limited by its low gauge factor, hysteresis and creep. But silicon-based sensors perform with higher reliability. This paper presents the basic design and development of the silicon type load cell with an SUS630 diaphragm. The load cell consists of two parts the silicon strain gauge and the SUS630 structure with diaphragm. Structure analysis of load cell was researched by theory to optimize the load cell diaphragm design and to determine the position of peizoresistors on a silicon strain gauge. The piezo-resistors are integrated in the four points of silicon strain gauge processed by ion implantation. The thickness of the silicon strain gauge was polished by CMP under 100 ${\mu}M$. The 10 mm diameter SUS630 diaphragm was designed for loads up to 10 kg with 300 ${\mu}M$ of diaphragm thickness. The load cell was successfully tested, the variation of ${\Delta}$R(%) of four points on the silicon strain gauge is good linearity properties and sensitivity.

• Journal of Science Education
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• v.38 no.2
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• pp.331-343
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• 2014

The types of misconceptions and their consistencies of the elementary school teachers about the characteristics of currents according to the connection methods of batteries in simple electric circuits were investigated. The misconceptions of the elementary school teachers about them could be divided into three types. Among the respondents of the 96 elementary school teachers for this study, the 2 elementary school teachers consistently understood the characteristics of currents on the basis of the misconception type of focusing only the number of batteries connected regardless of the connection methods of batteries, the 8 elementary school teachers did on the basis of the misconception type of confusing the series connection and the parallel connection of batteries, and the 4 elementary school teachers did on the basis of the misconception type of confusing the series and parallel connection of batteries with those of resistors. Also, they consistently applied these misconception types to not only the situations to use the learned concepts but the situations to use the differentiated concepts about the connection methods of batteries.