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PCB Plane Model Including Frequency-Dependent Losses for Generic Circuit Simulators  

Baek, Jong-Humn (Haedong ITS Tech. Center, Kwangwoon University)
Jeong, Yong-Jin (Haedong ITS Tech. Center, Kwangwoon University)
Kim, Seok-Yoon (Department of computer, Soongsil University)
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Abstract
This paper proposes a PCB plane model for generic SPICE circuit simulators. The proposed model reflects two frequency-dependent losses, namely skin and dielectric losses. After power/ground plane pair is divided into arrays of unit-cells, each unit-cell is modeled using a transmission line and two loss models. The loss model is composed of a resistor for DC loss, series HL ladder circuit for skin loss and series RC ladder circuit for dielectric loss. To verify the validity of the proposed model, it is compared with SPICE ac analysis using frequency-dependent resistors. Also, we show that the estimation results using the proposed model have a good correlation with that of VNA measurement for the typical PCB stack-up structure of general desktop PCs. With the proposed model, not only ac analysis but also transient analysis can be easily done for circuits including various non-linear/linear devices since the model consists of passive elements onl.
Keywords
PCB plane modeling; SPICE simulation; skin effect; dielectric effect; ac los;
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