1 |
I. Novak, 'Measuring Milliohms and PicoHenrys in Power Distribution Networks,' Design Con 2000
|
2 |
Brian Young, Digital Signal Integrity Modeling and Simulation with Interconnects and Packages, Prentice-Hall, 2000, ch. 1
|
3 |
G. A. Hjellen, 'Including Dielectric Loss in Printed Circuit Models for Improved EMI/EMC Predictions,' IEEE Transactions on Electromagnetic Compatibility, Vol. 39, No. 3, pp. 236-246, August 1997
DOI
ScienceOn
|
4 |
B. Sen, R. Wheeler, ' Skin Effects Models for Transmission Line Structures using Generic SPICE Circuit Simulators,' Proc. IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 128-131,Oct. 1998
DOI
|
5 |
J. Kim, M. Swaminathan, ' Modeling of Multilayered Power Distribution Planes Using Transmission Matrix Method,' Vol.25, No. 2, pp. 189-198 May 2002
DOI
ScienceOn
|
6 |
L. Smith, R. Raymond, and T. Roy, 'Power Plane Spice models and Simulated Performance for Materials and Geometries,' IEEE Transactions Advanced Packaging, Vol. 24, pp. 277-287, Aug. 2001
DOI
ScienceOn
|
7 |
L. Smith, R. E. Raymond, D.W.Forehand, T.J.Pelc, T.Roy, 'Power Distribution System Design Methodology and Capacitor Selection for Modern CMOS Technology,'IEEE Transactions on Advanced Packaging, Vol.22, No. 3, pp. 284-291, August 1999
DOI
|
8 |
T.Hubing, J.Drewniak, T.Van Doren, D.Hockanson, 'Power Bus Decoupling on Multilayer Printed Circuit Boards,' IEEE Transactions on Electronmagnetic Compatibility, Vol. 37, No. 2, pp. 155-166, May 1995
DOI
ScienceOn
|