• Journal of Information Display
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• v.7 no.3
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• pp.27-30
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• 2006

This paper presents a comprehensive study on threshold voltage $(V_{th})$ control of organic thin-film transistors (OTFTs) with dual-gate structure. The fabrication of dual-gate pentacene OTFTs using plasma-enhanced atomic layer deposited (PEALD) 150 nm thick $Al_{2}O_{3}$ as a bottom gate dielectric and 300 nm thick parylene or PEALD 200 nm thick $Al_{2}O_{3}$ as both a top gate dielectric and a passivation layer was investigated. The $V_{th}$ of OTFT with 300 nm thick parylene as a top gate dielectric was changed from 4.7 V to 1.3 V and that with PEALD 200 nm thick $Al_{2}O_{3}$ as a top gate dielectric was changed from 1.95 V to -9.8 V when the voltage bias of top gate electrode was changed from -10 V to 10 V. The change of $V_{th}$ of OTFT with dual-gate structure was successfully investigated by an analysis of electrostatic potential.

• Journal of Navigation and Port Research
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• v.30 no.4
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• pp.277-283
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• 2006

It is a world trend to construct large terminal and develop automated container terminal to attract Super Post-Panamax and provide service which is based on differentiation. In fact, there is insufficient research for automatization of terminal gate since the automatization of current constructed container terminal is only focused on increasing productivity and unmanned system through the automatization of quay, yard, etc. In this paper, we have investigated advantage/disadvantage of existing gate operation systems and compared each gate operation system in the aspect of raising terminal image and the productivity. For the specific study, we have used data from actual terminal gate operation and RFID model business sponsored by MOMAF (Ministry of Maritime Affairs and Fisheries). As a result, this paper carried out an efficient gate operation system and it has been expected that it will be performed as groundwork of automated gate operation system which is for design of container terminal and improvement of gate operation system.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1103-1106
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• 2006

We have presented a comprehensive study on threshold voltage $(V_{th})$ control of organic thin-film transistors (OTFTs) with dual-gate structure. The fabrication of dual-gate pentacene OTFTs using plasma-enhanced atomic layer deposited (PEALD) 150 nm thick $Al_2O_3$ as a bottom gate dielectric and 300 nm thick parylene or PEALD 200 nm thick $Al_2O_3$ as both a top gate dielectric and a passivation layer is reported. The $V_{th}$ of OTFT with 300 nm thick parylene as a top gate dielectric is changed from 4.7 V to 1.3 V and that with PEALD 200 nm thick $Al_2O_3$ as a top gate dielectric is changed from 1.95 V to -9.8 V when the voltage bias of top gate electrode is changed from -10 V to 10 V. The change of $V_{th}$ of OTFT with dual-gate structure has been successfully understood by an analysis of electrostatic potential.

• ETRI Journal
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• v.45 no.1
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• pp.171-179
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• 2023

We have developed an InAlAs/InGaAs metamorphic high electron mobility transistor device fabrication process where the gate length can be tuned within the range of 0.13㎛-0.16㎛ to suit the intended application. The core processes are a two-step electron-beam lithography process using a three-layer resist and gate recess etching process using citric acid. An electron-beam lithography process was developed to fabricate a T-shaped gate electrode with a fine gate foot and a relatively large gate head. This was realized through the use of three-layered resist and two-step electron beam exposure and development. Citric acid-based gate recess etching is a wet etching, so it is very important to secure etching uniformity and process reproducibility. The device layout was designed by considering the electrochemical reaction involved in recess etching, and a reproducible gate recess etching process was developed by finding optimized etching conditions. Using the developed gate electrode process technology, we were able to successfully manufacture various monolithic microwave integrated circuits, including low noise amplifiers that can be used in the 28 GHz to 94 GHz frequency range.

• Proceedings of the Materials Research Society of Korea Conference
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• 1993.05a
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• pp.37-38
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• 1993

• ETRI Journal
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• v.35 no.6
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• pp.1164-1167
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• 2013

We correlate the failure in miniature X-ray tubes with the field emission gate leakage current of gated carbon nanotube emitters. The miniature X-ray tube, even with a small gate leakage current, exhibits an induced voltage on the gate electrode by the anode bias voltage, resulting in a very unstable operation and finally a failure. The induced gate voltage is apparently caused by charging at the insulating spacer of the miniature X-ray tube through the gate leakage current of the field emission. The gate leakage current could be a criterion for the successful fabrication of miniature X-ray tubes.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.18 no.5
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• pp.42-47
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• 2004

This research has improved the problem of discharge AND gate PDP proposed before. The polarity of the DC discharge which composes AND gate is reversely designed and the cross talk problem to the adjacent scanning electrode has been improved. The AND gate proposed before operated by using non-linearity of the discharge by the space charge. In this research, new discharge NOT logic in which it was used that an applied voltage changed with the discharge circuit was added to AND gate. AND gate came to operate more stably. A selective address was able to be discharged with four horizontal scanning electrodes from the experiment result. The operation margin of the AND gate discharge obtained 34V and of the address discharge obtained 70V.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.17-19
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• 2004

The electrical properties of gate oxides grown in two different processes, which are in 10% nitrous oxide($N_2O$) and in dry oxygen, have been experimentally investigated and compared. It has been observed that the $SiC-SiO_2$ interface-trap density(Dit) measured in nitrided gate oxide has been tremendously reduced, compared to the density obtained from gate oxide grown in dry oxygen. The beneficial effects of nitridation on gate oxides also have been demonstrated in the values of total near interface-trap density and of forward-bias breakdown field. The reasons of these improvements have been explained.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.11
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• pp.226-232
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• 2020

The Stage-Gate is a market-oriented model that aims to launch new products on the market. Therefore, it can be appropriately introduced and applied to the operation and management of NSSCP, which is undergoing demonstration projects for Daegu and Siheung. In addition, smart cities have the characteristics of convergence and complex among various innovative technologies. When the Stage-Gate is introduced, the performance can be managed centering on the outcomes for each research institution. Therefore, the NSSCP is applying the Stage-Gate for the first time among national R&D projects to improve the quality of the research results and to demonstrate and commercialize them successfully. This paper reviews the operation results of the 1st and 2nd years when the State-Gate was introduced and analyzes the opinions of an R&D management agency, research institutes, and gate reviewers to present the supplementary and improvements for applying to the evaluation process for the next year. When operating the Stage-Gate by optimizing the situation for each project and being wary of inefficiencies caused by the rigid operation, it is expected that flexible evaluation for each outcome will be possible according to the convergence characteristics of smart cities.

• ETRI Journal
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• v.27 no.3
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• pp.304-311
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• 2005

We report on the fabrication of an AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (PHEMT) using a dielectric-defined process. This process was utilized to fabricate $0.12\;{\mu}m\;{\times}\;100 {\mu}m$ T-gate PHEMTs. A two-step etch process was performed to define the gate footprint in the $SiN_x$. The $SiN_x$ was etched either by dry etching alone or using a combination of wet and dry etching. The gate recessing was done in three steps: a wet etching for removal of the damaged surface layer, a dry etching for the narrow recess, and wet etching. A structure for the top of the T-gate consisting of a wide head part and a narrow lower layer part has been employed, taking advantage of the large cross-sectional area of the gate and its mechanically stable structure. From s-parameter data of up to 50 GHz, an extrapolated cut-off frequency of as high as 104 GHz was obtained. When comparing sample C (combination of wet and dry etching for the $SiN_x$) with sample A (dry etching for the $SiN_x$), we observed an 62.5% increase of the cut-off frequency. This is believed to be due to considerable decreases of the gate-source and gate-drain capacitances. This improvement in RF performance can be understood in terms of the decrease in parasitic capacitances, which is due to the use of the dielectric and the gate recess etching method.