• Proceedings of the Technology Innovation Conference
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• 2004.02a
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• pp.202-221
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• 2004

Technology is the most important determination factor on firm`s competitiveness. It helps firms to secure sustainable competitive advantages. Therefore Korean electronics part firms have increased their R&D investment since the 1990s. But their R&D management capabilities seem to be low level. Empirical study was undertook to verify factors that effect on R&D performance with enhancing R&D management capabilities. To accomplish the purpose, data collected valid samples in Seoul and Kyunggi Province. Using SPSSWIN 10.0package, regression analysis was used to verify hypotheses. This study verify that important factors of 4th R&D generation effect on improving R&D performance. Therefore Korean electronics firms must learn advanced firms in developed countries. Based on learning and accumulating R&D management capabilities, Korean electronics part firms should establish their firm-specific R&D management model.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.43 no.5 s.347
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• pp.35-44
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• 2006

Reflective semiconductor optical amplifiers(R-SOAs) were designed with high gain, wide optical bandwidth, high thermal reliability and wide modulation bandwidth in TO-can package for the transmitter of wavelength division multiplexed-passive optical network(WDM-PON) application. Double trench structure and current block layer were introduced in designing the active layer of R-SOA to enable high speed modulation. The injection power requirement and the viable temperature range of WDM-PON system are experimentally analysed in based on Amplified Spontaneous Emission(ASE)-injected R-SOAs. The effect of the different injection spectrum in the gain-saturated R-SOA was experimentally characterized based on the measurements of excessive intensity noise, Q factor, and BER. The proposed spectral pre-composition method reduces the bandwidth of injection source below the AWG bandwidth and thereby avoids spectrum distortion impeding the intensity noise reduction originated from the amplitude squeezing.

• International Journal of Reliability and Applications
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• v.9 no.1
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• pp.53-70
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• 2008

In this paper, we discuss the plethora of uses for the software package R, and focus specifically on its helpful applications in reliability data analyses. Examples are presented; including the R coding protocol, R code, and plots for various statistical as well as reliability analyses. We explore Kaplan-Meier estimates and maximum likelihood estimation for distributions including the Weibull. Finally, we discuss future applications of R, and usages of quantile regression in reliability.

• Knowledge Management Research
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• v.20 no.1
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• pp.1-26
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• 2019

This tutorial introduces procedures and methods for performing structural equation modeling using R. For this, we present the whole process of analyzing the structural equations model from the confirmatory factor analysis to the path diagram generation using the lavaan package, which is relatively well evaluated among the R packages supporting the structural equation modeling, together with the R program codes. Considering that research applying structural equation modeling techniques is the mainstream in a variety of social sciences, including business administration, and that there is growing interest in open source R, this tutorial focuses on researchers who are looking for alternatives to traditional commercial statistical packages and is expected that it will be a useful guidebook for them.

• Journal of the Chungcheong Mathematical Society
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• v.15 no.1
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• pp.87-94
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• 2002

Trot(1999) considered how to calculate the expected area of a random triangle in the unit square $[0,1]{\times}[0,1]$. He used the Mathematica software package for the computational part. In this article, we study various aspects of the probability distribution of a triangle randomly chosen inside the circle of radius r. A simulation activity that can be conducted in statistics and probability classrooms is also considered.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.96.3-96
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• 1998

• Proceedings of the ESK Conference
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• 1996.10a
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• pp.14-20
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• 1996

95년도 한국 교통사고 통계에 의하면 사망자의 73%가 두부(Head), 경부(Neck) 에 손상을 입고 있으며 부상자의 22%는 두부에 20%는 경부에 부상을 입고 있다. 사고 형태로도 여러 사고 형태중 고속도로 혹은 시내주행시 후면 충돌에 의한 사고 가 큰 비중을 차지하고 있다. 본 연구에서는 현재 일반적으로 사용중인 Head Restraint 시스템의 효과와 그 사용방법에 따라서 인체에 미치는 영향을 충돌 모의 실험이 가능한 DYNAMAN Package를 사용하여 고찰하였다. 충돌시험 속도인 30mph 후방 충돌 Test 시 Head Restraunt(H/R)을 사용하지 않을 경우는 Head Injury Criterion(HIC)이 한계치 1000 을 상회하는 것은 경추의신전 한계(extension)를 넘어 사망 혹은 하반신 마비의 가능성이 매우 높으며, H/R을 사용하고 있다고 해도 머리높이까지 충분히 높지 않거나 머리와의 거리가 멀 경우 경추의 신전 한계를 넘어 경부의 손상 가능성을 높여 주고 있다. 그러므로 제작자는 머리 높이까지 충분히 구속이 가능한 H/R을 설계 제작하여야 하겠고, 사용자는 H/R을 적절한 위치까지(머리높이)조절하여 하용하도록 하며 머리와의 거리 또한 되도록 가깝게 위치하도록 H/R 의 각도를 조절하여 경미한 후면 충돌시에도 머리보다 H/R을 넘어 경부에 부상을 입지않도록 게몽되어 계몽되어야 한다.

• Communications of Mathematical Education
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• v.21 no.3
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• pp.541-557
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• 2007

Jang(2007a, b) described the overall explanation about R statistical package and application on probability and statistics education. With referring the contents of the 7th national mathematics curriculum, we suggest the plan for applications of R Commander on probability and statistics education in middle and high school mathematics.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.