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http://dx.doi.org/10.4313/JKEM.2012.25.10.849

Enhancement of Light Extraction in White LED by Double Molding  

Jang, Min-Suk (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector)
Kim, Wan-Ho (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector)
Kang, Young-Rea (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector)
Kim, Ki-Hyun (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector)
Song, Sang-Bin (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector)
Kim, Jin-Hyuk (School of Materials Science & Engineering, Chonnam University)
Kim, Jae-Pil (Korea Photonics Technology Institute, New Lighting Solution R&DB Sector)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.25, no.10, 2012 , pp. 849-856 More about this Journal
Abstract
Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.
Keywords
High thixotropy silicone; Vacuum printing encapsulation system; LED; Double encapsulation;
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