• Particle and aerosol research
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• v.12 no.4
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• pp.145-150
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• 2016

During the chemical mechanical planarization (CMP) process, slurry that comprises abrasive particles can directly affect the CMP performance and quality. Mainly, the large particles in the slurry can generate the defects on the wafer. Thus, many kinds of filters have been used in the CMP process to remove unwanted over-sized particles. Among these filters, the point-of-use (POU) filter is used just before the slurry is supplied onto the CMP pad. In the CMP research field, analysis of the POU filter has been relatively exceptional, and previous studies have not focused on the standardized filtration efficiency (FE) or filter performance. Furthermore, conventional evaluation methods of filter performance are not appropriate for POU filters, as the POU filter is not a membrane type, but is instead a depth type roll filter. In order to accurately evaluate the POU filter, slurry FE according to particle size was measured in this study. Additionally, a CMP experiment was conducted with filtered slurry to demonstrate the effects of filtered slurry on CMP performance. Depending on the flow rate and the filter retention size, the FE according to particle size was different. When the small and large particles have different FEs, the total filtration efficiency (TFE) can still have a similar value. For this reason, there is a need to measure the FE with respect to the particle size to verify the effects of the POU filter on the CMP process.

• Journal of the Korean Chemical Society
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• v.47 no.6
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• pp.608-613
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• 2003

In order to remove particles on surface of post-oxide CMP wafer, new cleaning solution was prepared by mixing with DHF (Diluted HF), nonionic surfactant PAAE (Polyoxyethylene Alkyl Aryl Ether), DMSO (Dimethylsulfoxide) and D.I.W.. Silicone wafers were intentionally contaminated by silica, alumina and PSL (polystylene latex) which had different zeta potentials in cleaning solution. This cleaning solution under megasonic irradiation could remove particles and metals simultaneously at room temperature in contrast to traditional AMP (mixture of $NH_4OH,\;H_2O_2$ and D.I.W) without any side effects such as increasing of microroughness, metal line corrosion and deposition of organic contaminants. This suggests that this cleaning solution would be useful future application with copper CMP in brush cleaning process as well as traditional post CMP cleaning process.

• Clean Technology
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• v.2 no.2
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• pp.100-125
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• 1996

After recycle of spent materials has been optimised, there remains a proportion of waste which must be dealt with in the most environmentally friendly manner available. For materials such as municipal waste, clinical waste, toxic waste and special wastes such as tyres, incineration is often the most appropriate technology. The study of incineration must take a process system approach covering the following aspects: ${\bullet}$ Collection and blending of waste, ${\bullet}$ The two stage combustion process, ${\bullet}$ Quenching, scrubbing and polishing of the flue gases, ${\bullet}$ Dispersion of the flue gases and disposal of any solid or liquid effluent. The design of furnaces for the burning of a bed of material is being hampered by lack of an accurate mathematical model of the process and some semi-empirical correlations have to be used at present. The prediction of the incinerator gas phase flow is in a more advanced stage of development using computational fluid dynamics (CFD) analysis, although further validation data is still required. Unfortunately, it is not possible to scale down many aspects of waste incineration and tests on full scale incinerators are essencial. Thanks to a close relationship between SUWIC and Sheffield Heat&Power Ltd., an extended research programme has been carried out ar the Bernard Road Incinerator plant in Sheffield. This plant consists of two Municipal(35 MW) and two Clinical (5MW) Waste Incinerators which provide district heating for a large part of city. The heat is distributed as hot water to commercial, domestic ( >5000 dwelling) and industrial buildings through 30km of 14" pipes plus a smaller pipe distribution system. To improve the economics, a 6 MW generator is now being added to the system.

• Journal of the Semiconductor & Display Technology
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• v.22 no.2
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• pp.30-34
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• 2023

Since dishing in the CMP process is a major factor that hinders the uniformity of the semiconductor thin film, many studies have focused this issue to improve the non-uniformity of the film due to dishing. In the metal layer, the dishing mainly occurs in the central part of the metal due to a difference in a selection ratio between the metal and the dielectric, thereby generating a step on the surface of the metal layer. Factors that cause dishing include the shape of the thin film, the chemical reaction of the slurry, thermal deformation, and the rotational speed of the pad and head, and dishing occurs due to complex interactions between them. This study analyzed the stress generated on the metal layer surface in the CMP process using ANSYS software, a commercial structure analysis program. The stress caused by the vertical load applied from the pad was analyzed by changing the area density and line width of the dummy metal. As a result of the analysis, the stress in the active region decreased as the pattern density and line width of the dummy metal increased, and it was verified that it was valid compared with the previous study that studied the dishing according to the dummy pattern density and line width of the metal layer. In conclusion, it was confirmed that there is a relationship between dishing and normal stress.

• Applied Chemistry for Engineering
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• v.28 no.3
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• pp.318-325
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• 2017

Wastewater including ethanolamine used in the second generation of nuclear power plants is filtered out in the ion exchange resin of the condensate polishing plant. In the regeneration process of ion exchange resin, a strong acidic wastewater containing ethanolamine and a lager amount of ionic substances are released. In this study, the process involving UV oxidation part with or without absorbents was developed for treating wastewater released from the ionic exchange resin. The effect of adsorbents on the wastewater treatment was investigated by using UV oxidation system developed by us. As a result, the COD removal efficiency of UV/GAC process with the granular activated carbon (GAC) as an adsorbent was 71.3% at pH 12.8. The removal efficiency was 21.8% higher than that of the wastewater treated using UV oxidation process without any adsorbents at the same condition. The removal of T-N was 88.6% at pH 12.8 when using UV oxidation with the GAC absorbent, which was 18.0% higher than that of using the UV oxidation process without any absorbents. It is thought that ethanolamine adsorbed on the absorbent improved the efficiency of UV oxidation process. Therefore, the UV/GAC adsorption oxidation process can be more effective in treating wastewater containing ethanolamine than that of using the process without any absorbents.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1888-1890
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• 1999

In this work, we have systematically studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in Inter-Metal Dielectric(IMD) CMP. The filter Installation in CMP polisher makes defect reduced after IMD CMP. As a result of formation micro-scratches, it shows that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. We have acknowledged slurry filter lifetime is fixed by the degree of generating defects.

• Tribology and Lubricants
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• v.23 no.6
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• pp.298-300
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• 2007

Frictional characteristics of mesoporous $SiO_2$ thin films were evaluated with different pore sizes. The films were manufactured by sol-gel and self-assembly methods to have a porous structure. The pores on the surface may play as the outlet of wear particle and the storage of lubricant so that the surface interactions could be improved. The pores were exposed on the surface by chemical mechanical polishing (CMP) or plasma-etching after forming the porous films. The ball-on-disk tests with mesoporous $SiO_2$ thin films on glass specimen were conducted at sliding speed of 15 rpm and a load of 0.26 N. The results show considerable dependency of friction on pore size of mesoporous $SiO_2$ thin films. The friction coefficient decreased as increasing the pore size. CMP process was very useful to expose the pores on the surface.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.1
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• pp.127-132
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• 2012

In this paper, the edge effects of proposed structure in active region for high voltage in shallow trench isolation for very large integrated MOSFET were simulated. Shallow trench isolation (STI) is a key process component in CMOS technologies because it provides electrical isolation between transistors and transistors. As a simulation results, shallow trench structure were intended to be electric functions of passive, as device dimensions shrink, the electrical characteristics influence of proposed STI structures on the transistor applications become stronger the potential difference electric field and saturation threshold voltage.

• Journal of Korean Society of Water and Wastewater
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• v.18 no.4
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• pp.486-492
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• 2004

CMP (Chemical mechanical polishing) is inevitable process to overcome $0.2{\mu}m$ wire thickness in semiconductor industry. In this study, effect of pressure to separate used CMP slurry into solid and liquid for recycle and reuse by ultrafiltration was investigated. Also, water quality after the ultrafiltration such as turbidity and TDS was evaluated. The material of membrane used in the study was PVDF. The used CMP contained 0.5% of solid content and then concentrated up to 18% by weight. The used CMP can not be concentrated higher than 18% because of viscosity and abrasion of pump. The tested feed pressures were 22.1, 29.4 and 36.8 psi. The results have shown that operating at 36.8 psi has advantages on operation time and total flux. The specific flux showed some variation at 1 to 15 of concentration factor but no difference after 15 of concentration factor. Mass balance of solid at initial stage of the operation showed some unbalance because of deposition of solid on the membrane, which was main reason to reduce flux. Turbidity was very stable at lower than 0.2NTU for 22.1 and 36.8 psi of feed pressure.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.93-96
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• 2003

Recently, various bulk metallic glasses (BMG's) haying good mechanical and chemical properties were developed. BMG's can easily be deformed in the supercooled liquid region, via viscous flow mechanism. In our previous work, we evaluated the deformation behavior and some other basic properties of Z $r_{41.2}$ $Ti_{13.8}$C $u_{12.5}$N $i_{10}$B $e_{22.5}$ alloy. In this study, we investigated the micro forming of Z $r_{41.2}$ $Ti_{13.8}$C $u_{12.5}$N $i_{10}$B $e_{22.5}$ alloy. The process condition was chosen based on the viscosity data from TMA, and superalloy and Si wafer with micro patterns on the surface were used as forming die. The alloy showed good replication of the patterns. However, some stripe patterns, resembling scratches, appeared on the deformed alloy surface. These scratches can be reduced or eliminated by polishing before forming.ing.ore forming.ing.