Abstract
CMP (Chemical mechanical polishing) is inevitable process to overcome $0.2{\mu}m$ wire thickness in semiconductor industry. In this study, effect of pressure to separate used CMP slurry into solid and liquid for recycle and reuse by ultrafiltration was investigated. Also, water quality after the ultrafiltration such as turbidity and TDS was evaluated. The material of membrane used in the study was PVDF. The used CMP contained 0.5% of solid content and then concentrated up to 18% by weight. The used CMP can not be concentrated higher than 18% because of viscosity and abrasion of pump. The tested feed pressures were 22.1, 29.4 and 36.8 psi. The results have shown that operating at 36.8 psi has advantages on operation time and total flux. The specific flux showed some variation at 1 to 15 of concentration factor but no difference after 15 of concentration factor. Mass balance of solid at initial stage of the operation showed some unbalance because of deposition of solid on the membrane, which was main reason to reduce flux. Turbidity was very stable at lower than 0.2NTU for 22.1 and 36.8 psi of feed pressure.
