Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1999.07d
- /
- Pages.1888-1890
- /
- 1999
A Study of the reduction of Microscratch using Filter in oxide chemical Mechanical Polishing(CMP) Process
Oxide CMP 공정에서 Slurry Filter을 사용한 Microscratch 감소에 관한 연구
- Kim, Sang-Yong (Dept. of Electrical Engineering, Chung-Ang University) ;
- Seo, Yong-Jin (School of Electrical and Electronic Engineering, Daebul University) ;
- Kim, Tae-Hyung (Dept. of Electrical Engineering, Yeojoo Institute of Technology College) ;
- Lee, Woo-Sun (School of Electrical and Electronic Engineering, Cho-Sun University) ;
- Chung, Hun-Sang (School of Electrical and Electronic Engineering, Cho-Sun University) ;
-
Kim, Chang-Il
(Dept. of Electrical Engineering, Chung-Ang University)
;
-
Chang, Eui-Goo
(Dept. of Electrical Engineering, Chung-Ang University)
- 김상용 (중앙대학교 전기공학과) ;
- 서용진 (대불대학교 전기전자공학부) ;
- 김태형 (여주대학 전기과) ;
- 이우선 (조선대학교 전기공학과) ;
- 정헌상 (조선대학교 전기공학과) ;
-
김창일
(중앙대학교 전기공학과)
;
-
장의구
(중앙대학교 전기공학과)
- Published : 1999.07.19
Abstract
In this work, we have systematically studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in Inter-Metal Dielectric(IMD) CMP. The filter Installation in CMP polisher makes defect reduced after IMD CMP. As a result of formation micro-scratches, it shows that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. We have acknowledged slurry filter lifetime is fixed by the degree of generating defects.
Keywords