1 |
홍성호, 오석환 (2002) CMP 폐액의 고액분리에서 웅집제의 영향에 관한 연구, 대한상하수도학희지, 16(2). pp. 183-189
|
2 |
Iler, I. K., (1979) Chemistry of Silica. John Wiley and Son Inc., NY, NY.
|
3 |
산업자원부 (1999) 국제경쟁력 강화를 위한 반도체제조 청정공정 기술개발 전략수립(안)
|
4 |
Semiconductor Industry Association (1997) The national technology roadmap for semiconductors. Semiconductor Industry Association
|
5 |
Small, R.J., Peterson, M.L., Gorman, A.M., and Chan, Z., (1999) Post clean treatments and post CMP solutions for metal and particle removal from VLSI sturucture. Semiconductor Fabtech. 8th Ed.
|
6 |
Chiofalo, V., (1998) Copper metallization and CMP wastewater treatment. Environmental exchange program, US-AEP
|