• Proceedings of the Korean Institute of Intelligent Systems Conference
• /
• 1996.10a
• /
• pp.234-238
• /
• 1996

In this paper, Plasma-Enhanced Chemical Vapor Deposition (PECVD) modeling using Polynomial Neural Networks (PNN) has been introduced. The deposition of SiO2 was characterized via a 25-1 fractional factorial experiment, was used to train PNNs using predicted squared error (PSE). The optimal neural network structure and learning parameters were determined by means of a second fractional factorial experiment. The optimized networks minimized both learning and prediction error. From these PNN process models, the effect of deposition conditions on film properties has been studied. The deposition experiments were carried out in a Plasma Therm 700 series PECVD system. The models obtained will ultimately be used for several other manufacturing applications, including recipe synthesis and process control.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.516-516
• /
• 2013

Flexible Display를 제작하기 위해서는 유기소자를 보호하는 보호막이 필요하다. 유기소자는 산소 및 수분에 매우 취약하기 때문에 장수명을 확보하기 위해서는 추가적인 보호층이 필요하다. 본 논문에서는 이를 위해 Encapsulation 중 한 방법인 Barrier Film을 제작하고 그에 따른 광학적인 특성 및 수분 투습율을 조사하였다. Barrier film의 광학적 분석 방법으로는 XPS, SEM, AFM, Transmittance를 측정하였으며, XPS는 박막내의 화학적인 결합을 알기 위해서 사용되었고, SEM은 박막의 두께 및 박막내의 결함을 파악하고자 하였다. SEM을 통해 증착속도가 32.6 nm/m이라는 것을 관찰할 수 있었다. AFM을 통해 증착된 박막의 표면 거칠기를 파악하였다. Transmittance는 PET 기판을 사용하여 가시광 영역에서 80%이상의 투과도를 나타내었다. PECVD 장비를 사용하여 SiH4, NH3, N2가스를 사용하여 PET 필름 위에 박막을 증착하였으며, 유량을 10~400 sccm 내에서 변화시키고, RF Power는 각각 30~300 W 15분간 증착하였다. 제작된 보호막의 수분투습율은 $2{\times}10{_2}^{-2}g/m^2/day$ 이하의 값을 나타내었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.16 no.1
• /
• pp.11-18
• /
• 2003

In this study we attempted to diagnose the states and properties of plasma generated while depositing SiON thin films using PECVD (Plasma enhanced chemical vapor deposition). The temperature and density of electron gases formed in a PECVD chamber were measured by Langmuir probe method. Their values were also estimated under some assumptions we made in this work. Comparison between experimental and theoretical values of the temperature and density of electron gases was made. The experimental and estimated results revealed that, as RF Power gets higher, the electron density linearly increases, but that the electron temperature does not vary.

• Korean Journal of Materials Research
• /
• v.16 no.4
• /
• pp.225-230
• /
• 2006

Nanoimprint lithography (NIL) is a novel method of fabricating nanometer scale patterns. It is a simple process with low cost, high throughput and resolution. NIL creates patterns by mechanical deformation of an imprint resist and physical contact process. The imprint resist is typically a monomer or polymer formulation that is cured by heat or UV light during the imprinting process. Stiction between the resist and the stamp is resulted from this physical contact process. Stiction issue is more important in the stamps including narrow pattern size and wide area. Therefore, the antistiction layer coating is very effective to prevent this problem and ensure successful NIL. In this paper, an antistiction layer was deposited and characterized by PECVD (plasma enhanced chemical vapor deposition) method for metal stamps. Deposition rates of an antistiction layer on Si and Ni substrates were in proportion to deposited time and 3.4 nm/min and 2.5 nm/min, respectively. A 50 nm thick antistiction layer showed 90% relative transmittance at 365 nm wavelength. Contact angle result showed good hydrophobicity over 105 degree. $CF_2$ and $CF_3$ peaks were founded in ATR-FTIR analysis. The thicknesses and the contact angle of a 50 nm thick antistiction film were slightly changed during chemical resistance test using acetone and sulfuric acid. To evaluate the deposited antistiction layer, a 50 nm thick film was coated on a stainless steel stamp made by wet etching process. A PMMA substrate was successfully imprinting without pattern degradations by the stainless steel stamp with an antistiction layer. The test result shows that antistiction layer coating is very effective for NIL.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.13 no.1
• /
• pp.36-40
• /
• 2003

The diamond-like nanocomposite (DLN) thin films were deposited on Si substrates using $CH_4/(C_2H_5O)_4Si/H_2$/Ar gas mixtures as source gases by the plasma enhanced chemical vapor deposition (PECVD). The chemical structure and microstructure of grown films were investigated and their tribological properties were evaluated by a ball-on-plate type tribometer. The deposited DLN films mainly consisted of diamond-like a-C:H and quartz-like a-Si:O networks. The DLN films had a good agreement with tribological coating applications due to their extremely low friction coefficients and low wear rates.

• Journal of the Korean Vacuum Society
• /
• v.7 no.s1
• /
• pp.190-196
• /
• 1998

Amorphous ternary $Si_xC_yN-z$ thin films were obtained by plasma enhanced chemical vapor deposition(PECVD) using $N_2, SiH_4 \;and \;C_2H_4$ as the reaction sources. The chemical state were characterized by x-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy(FTIR). The optical properties of the thin films were investigated by UV-visible spectrophotometer and ellipsometer, and the optical band gaps of thin films were determined from corresponding transmittance spectra following Tauc equation.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2011.10a
• /
• pp.16.2-16.2
• /
• 2011

Graphene has attracted significant attention due to its unique characteristics and promising nanoelectronic device applications. For practical device applications, it is essential to synthesize high-quality and large-area graphene films. Graphene has been synthesized by eloborated mechanical exfoliation of highly oriented pyrolytic graphite, chemical reduction of exfoliated grahene oxide, thermal decomposition of silicon carbide, and chemical vapor deposition (CVD) on metal substrates such as Ni, Cu, Ru etc. The CVD has advantages over some of other methods in terms of mass production on large-areas substrates and it can be easily separated from the metal substrate and transferred to other desired substrates. Especially, plasma-enhanced CVD (PECVD) can be very efficient to synthesize high-quality graphene. Little information is available on the synthesis of graphene by PECVD even though PECVD has been demonstrated to be successful in synthesizing various carbon nanostructures such as carbon nanotubes and nanosheets. In this study, we synthesized graphene on $Ni/SiO_2/Si$ and Cu plate substrates with CH4 diluted in $Ar/H_2$ (10%) by using an inductively-coupled PECVD (ICPCVD). High-quality graphene was synthesized at as low as $700^{\circ}C$ with 600 W of plasma power while graphene layer was not formed without plasma. The growth rate of graphene was so fast that graphene films fully covered on substrate surface just for few seconds $CH_4$ gas supply. The transferred graphene films on glass substrates has a transmittance at 550 nm is higher 94%, indicating 1~3 monolayers of graphene were formed. FETs based on the grapheme films transferred to $Si/SiO_2$ substrates revealed a p-type. We will further discuss the synthesis of graphene and doped graphene by ICPVCD and their characteristics.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.113-113
• /
• 2012

플라즈마 내에서 발생하는 입자는 플라즈마 내 전기적 및 화학적 특성으로 인해 응집이 적고 균일한 특성을 가진다. 이에 따라 도포성이 좋으며 낮은 응력을 가지는 박막의 형성이 가능하다. 이러한 특성을 가지는 나노입자는 메모리, 고효율 박막형 태양전지 등에 이용될 수 있다. 특히, PECVD (Plasma enhanced chemical vapor deposition) 공정 중 플라즈마가 켜져있는 동안 수소 가스를 펄스형태로 추가 주입하는 방법은 실리콘 이온 사이의 결합을 통한 표면 성장을 일부 방해하여 이를 통해 최종적으로 생성되는 실리콘 입자의 크기제어를 가능하게 한다. 이러한 과정으로 PECVD내에서 생성된 입자의 입경 분포는 기존의 경우 공정 중 포집을 한 후 전자현미경을 이용하였지만 실시간 측정이 불가능한 한계가 있었고, 레이저를 이용한 실시간 측정은 그 측정범위의 한계로 인해 적용에 어려움이 있었다. 이에 따라 본 연구에서는 저압에서 실시간으로 나노입자 크기분포 측정이 가능한 PBMS (particle beam mass spectrometer)를 이용하여 PECVD 내에서 수소가스 펄스를 이용하여 발생되는 실리콘 입자를 공정 변수별로 측정하여 각 변수에 따른 입자 생성 경향을 분석하였다. 실리콘 나노 입자의 측정은 PBMS 장비의 전단 부분을 PECVD 장치 내부에 연결하여 진행하였다. 수소 가스 펄스를 이용한 실리콘 입자 생성의 주요 변수는 RF pulse, $H_2$ pulse, 가스 유량 (Ar, $SiH_4$, $H_2$), Plasma power, 공정 압력 등이 있다. 이와 같이 주어진 변수들의 제어를 통해 생성된 나노입자의 입경분포를 PBMS에서 실시간으로 측정하고, 동일한 조건에서 포집한 입자를 TEM 분석 결과와 비교하였다. 측정 결과 각각의 변수에 대하여 생성되는 입자의 크기분포 경향을 얻을 수 있었으며, 이는 추후 생성 입자의 응용 분야에 적합한 크기 분포 특성을 가지는 실리콘 입자를 제조하기 위한 조건을 정립하는데 중요한 역할을 할 것을 기대할 수 있다.

• Journal of the Korean Solar Energy Society
• /
• v.33 no.2
• /
• pp.11-17
• /
• 2013

Silicon nitride($SiN_x:H$) deposited by radio frequency plasma enhanced chemical vapor deposition(RF-PECVD) is commonly used for anti-reflection coating and passivation in crystalline silicon solar cell fabrication. In this paper, characteristics of the deposited silicon nitride was studied with change of working pressure, deposition temperature, gas ratio of $NH_3$ and $SiH_4$, and RF power during deposition. The deposition rate, refractive index and effective lifetime were analyzed. The (100) p-type silicon wafers with one-side polished, $660-690{\mu}m$, and resistivity $1-10{\Omega}{\cdot}cm$ were used. As a result, when the working pressure increased, the deposition rate of SiNx was increased while the effective life time for the $SiN_x$-deposited wafer was decreased. The result regarding deposition temperature, gas ratio and RF power changes would be explained in detail below. In this paper, the optimized condition in silicon nitride deposition for silicon solar cell was obtained as 1.0 Torr for the working pressure, $400^{\circ}C$ for deposition temperature, 500 W for RF power and 0.88 for $NH_3/SiH_4$ gas ratio. The silicon nitride layer deposited in this condition showed the effective life time of > $1400{\mu}s$ and the surface recombination rate of 25 cm/s. The crystalline silicon solar cell fabricated with this SiNx coating showed 18.1% conversion efficiency.

• Journal of the Korean Ceramic Society
• /
• v.38 no.11
• /
• pp.1037-1041
• /
• 2001

Silicon diosixde thick film using silica optical waveguide cladding was fabricated by Plasma Enhanced Chemical Vapor Deposition (PECVD) method, at a low temperature (32$0^{\circ}C$) and from (SiH$_4$+$N_2$O) gas mixtures. The effects of deposition parameters on properties of SiO$_2$thick films were investigated by variation of $N_2$O/SiH$_4$flow ratio and RF power. As the $N_2$O/SiH$_4$flow ratio decreased, deposition rate increased from 2.9${\mu}{\textrm}{m}$/h to maximum 10.1${\mu}{\textrm}{m}$/h. As the RF power increased from 60 W to 120 W, deposition rate increased (5.2~6.7 ${\mu}{\textrm}{m}$/h) and refractive index approached at thermally grown silicon dioxide (n=1.46).