• Title/Summary/Keyword: Planar gate

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Analysis of The Electrical Characteristics of Power IGBT According to Design and Process Parameter (설계 및 공정 변수에 따른 600 V급 IGBT의 전기적 특성 분석)

  • Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.5
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    • pp.263-267
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    • 2016
  • In this paper, we analyzed the electrical characteristics of NPT planar and trench gate IGBT after designing these devices according to design and process parameter. To begin with, we have designed NPT planar gate IGBT and carried out simulation with T-CAD. Therefore, we extracted design and process parameter and obtained optimal electrical characteristics. The breakdown voltage was 724 V and The on state voltage drop was 1.746 V. The next was carried out optimal design of trench gate power IGBT. We did this research by same drift thickness and resistivity of planar gate power IGBT. As a result of experiment, we obtain 720 V breakdown voltage, 1.32 V on state voltage drop and 4.077 V threshold voltage. These results were improved performance and fabrication of trench gate power IGBT and planar gate Power IGBT.

A Study Comparison and Analysis of Electrical Characteristics of IGBTs with Variety Gate Structures (다양한 게이트 구조에 따른 IGBT 소자의 전기적 특성 비교 분석 연구)

  • Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.11
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    • pp.681-684
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    • 2016
  • This research was carried out experiments of variety IGBTs for industrial inverter and electric vehicle. The devices for this paper were planar gate IGBT, trench gate IGBT and dual gate IGBT and we designed using same design and process parameters. As a result of experiments, the electrical characteristics of planar gate IGBT were 1,459 V of breakdown voltage, 4.04 V of threshold voltage and 4.7 V of on-state voltage drop. And the electrical characteristics of trench gate IGBT were 1,473 V of breakdown voltage, 4.11 V of threshold voltage and 3.17 V of on-state voltage drop. Lastly, the electrical characteristics of dual gate IGBT were 1,467 V of breakdown voltage, 4.14 V of threshold voltage and 3.08V of on-state voltage drop. We almost knew that the trench gate IGBT was superior to dual gate IGBT in terms of breakdown voltage. On the other hand, the dual gate IGBT was better than the trench gate IGBT in terms of on state voltage drop.

A Study on the Electrical Characteristics with Design Parameters in 1,200 V Trench Gate Field Stop IGBT (1,200 V급 Trench Gate Field Stop IGBT 소자의 전기적 특성 향상 방안에 관한 연구)

  • Geum, Jong-Min;Jung, Eun-Sik;Kang, Ey-Goo;Sung, Man-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.4
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    • pp.253-260
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    • 2012
  • IGBT (insulated gate bipolar transistor) have received wide attention because of their high current conduction and good switching characteristics. To reduce the power loss of IGBT, the on state voltage drop should be lowered and the switching time should be shorted. However, there is Trade-off between the breakdown voltage and the on state voltage drop. To achieving good electrical characteristics, field stop IGBT (FS IGBT) is proposed. In this paper, 1,200 V planar gate non punch-through IGBT (planar gate NPT IGBT), planar gate FS IGBT and trench gate FS IGBT is designed and optimized. The simulation results are compared with each three structures. In results, we optain optimal design parameters and confirm excellence of trench gate FS IGBT. Experimental result by using medici, shows 40% improvement of on state voltage drop.

Performance of Non Punch-Through Trench Gate Field-Stop IGBT for Power Control System and Automotive Application

  • Kang, Ey Goo
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.1
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    • pp.50-55
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    • 2016
  • In this paper, we have analyzed the electrical characteristics of 1200V trench gate field stop IGBT and have compared to NPT planar type IGBT and NPT planar field stop IGBT. As a result of analyzing, we obtained superior electrical characteristics of trench gate field stop IGBT than conventional IGBT. To begin with, the breakdown voltage characteristic was showed 1,460 V and on state voltage drop was showed 0.7 V. We obtained 3.5 V threshold voltage, too. To use these results, we have extracted optimal design and process parameter and designed trench gate field stop IGBT. The designed trench gate IGBT will use to inverter of renewable energy and automotive industry.

The Process and Fabrication of 500 V Unified Trench Gate Power MOSFET (500 V급 Unified Trench Gate Power MOSFET 공정 및 제작에 관한 연구)

  • Kang, Ey-Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.10
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    • pp.720-725
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    • 2013
  • Power MOSFET operate voltage-driven devices, design to control the large power switching device for power supply, converter, motor control, etc. We have analyzed trench process, field limit ring process for fabrication of unified trench gate power MOSFET. And we have analyzed electrical characteristics of fabricated unified trench gate power MOSFET. The optimal trench process was based on SF6. After we carried out SEM measurement, we obtained superior trench gate and field limit ring process. And we compared electrical characteristics of planar and trench gate unified power MOSFET after completing device fabrication. As a result, the both of them was obtained 500 V breakdown voltage. However trench gate unified power MOSFET was shown improved Vth and on state voltage drop characteristics than planar gate unified power MOSFET.

Design of Unified Trench Gate Power MOSFET for Low on Resistance and Chip Efficiency (낮은 온저항과 칩 효율화를 위한 Unified Trench Gate Power MOSFET의 설계에 관한 연구)

  • Kang, Ey-Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.10
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    • pp.713-719
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    • 2013
  • Power MOSFET operate voltage-driven devices, design to control the large power switching device for power supply, converter, motor control, etc. We have optimal designed planar and trench gate power MOSFET for high breakdown voltage and low on resistance. When we have designed $6,580{\mu}m{\times}5,680{\mu}m$ of chip size and 20 A current, on resistance of trench gate power MOSFET was low than planar gate power MOSFET. The on state voltage of trench gate power MOSFET was improved from 4.35 V to 3.7 V. At the same time, we have designed unified field limit ring for trench gate power MOFET. It is Junction Termination Edge type. As a result, we have obtained chip shrink effect and low on resistance because conventional field limit ring was convert to unify.

Analysis of Electrical Characteristics of Dual Gate IGBT for Electrical Vehicle (전기자동차용 이중 게이트 구조를 갖는 전력 IGBT소자의 전기적인 특성 분석)

  • Kang, Ey Goo
    • Journal of IKEEE
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    • v.21 no.1
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    • pp.1-6
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    • 2017
  • IGBT (Insulated Gate Bipolar Transistor) device is a device with excellent current conducting capability, it is widely used as a switching device power supplies, converters, solar inverter, household appliances or the like, designed to handle the large power. This research was proposed 1200 class dual gate IGBT for electrical vehicle. To compare the electrical characteristics, The planar gate IGBT and trench gate IGBT was designd with same design and process parameters. And we carried to compare electrical characteristics about three devices. As a result of analyzing electrical characteristics, The on state voltage drop charateristics of dual gate IGBT was superior to those of planar IGBT and trench IGBT. Therefore, Aspect to Energy Loss, dual gate IGBT was efficiency. The breakdown volgate and threshold voltage of planar, trench and dual gate IGBT were 1460V and 4V.

Experimental fabrication and analysis on the double injection semiconductor switching devices (반도체 DI swiching 소자의 시작과 특성에 관한 실험적 고찰)

  • 성만영;정세진;임경문
    • Electrical & Electronic Materials
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    • v.4 no.2
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    • pp.159-174
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    • 1991
  • 이중주입효과에 의한 고내압 반도체 스위칭소자의 설계 제작에 촛점을 맞추어 Injection Gate구조와 MOS Gate 구조로 시료소자를 제작해 그 특성을 검토하고 Electrical Switching 및 Oxide막에서의 Breakdown현상에 의한 문제점을 해결해 보고자 Optical Gate구조를 제안하여 이 optically Gated Semiconductor Switching 소자의 동작특성을 연구하고 Injection Gate 구조를 제안하여 이 optically Gated Semiconductor Switching 소자의 동작특성을 연구하고 Injection Gate 및 MOS Gate 구조(Planar type, V-Groove type, Injection Gate mode, Optical Gate mode)로 설계제작된 소자와 특성을 비교 분석하였다.

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Study on the Driving property of planar gate light source (전계방출 광원용 플라나 게이트의 구동 특성 연구)

  • Kim, Kwang-Bok;Yang, Dong-Wook;Kim, Tae-Hyeon;Kim, Dae-Jun
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2008.05a
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    • pp.148-150
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    • 2008
  • In this paper, we report the improved driving methode using planar-gate for field emission light source. Due to the cold cathode in field emission device, it has advantage for driving system in terms of high speed pulse driving with narrow duty ratio. This paper shows that our driving method offers the stable and reliable driving system without rapid electric field variation for field emission light source.

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Study on Industrial Inverters for Driving High-efficiency High-voltage Field-stop IGBT Optimization Design (산업용 인버터 구동을 위한 고효율 고내압 Field-stop IGBT 최적화 설계에 관한 연구)

  • Lee, Myung Hwan;Kim, Bum June;Jung, Eun Sik;Jung, Hun Suk;Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.4
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    • pp.257-263
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    • 2013
  • In this paper, Solar, Wind, fuel cell used in a Power conversion devices and industrial inverter motor to increase the efficiency of energy consumption, which is a core part of high-efficiency, high-voltage Trench Gate Field Stop IGBT was studied. For this purpose Planar type NPT IGBT and Planar type Field Stop IGBT have designed a basic structure designed to Trench Gate Field Stop IGBT based on the completed structure by analyzing the energy consumption of electrical characteristics, efficiency is a key part, high-efficiency and high-voltage inverter for industry regarding the optimization design for Trench Gate Field Stop IGBT.