Browse > Article
http://dx.doi.org/10.4313/TEEM.2016.17.1.50

Performance of Non Punch-Through Trench Gate Field-Stop IGBT for Power Control System and Automotive Application  

Kang, Ey Goo (Department of Energy Semiconductor Engineering, Far East University)
Publication Information
Transactions on Electrical and Electronic Materials / v.17, no.1, 2016 , pp. 50-55 More about this Journal
Abstract
In this paper, we have analyzed the electrical characteristics of 1200V trench gate field stop IGBT and have compared to NPT planar type IGBT and NPT planar field stop IGBT. As a result of analyzing, we obtained superior electrical characteristics of trench gate field stop IGBT than conventional IGBT. To begin with, the breakdown voltage characteristic was showed 1,460 V and on state voltage drop was showed 0.7 V. We obtained 3.5 V threshold voltage, too. To use these results, we have extracted optimal design and process parameter and designed trench gate field stop IGBT. The designed trench gate IGBT will use to inverter of renewable energy and automotive industry.
Keywords
IGBT; Trench; Planar; Field-stop; NPT; Power Devices; High Efficiency; High Breakdown Voltage; On-state Voltage drop;
Citations & Related Records
연도 인용수 순위
  • Reference
1 S. Colak, B. Singer, and E. Stupp, IEEE Electron Device Letters., EDL_1, 51, (1980). [DOI: http://dx.doi.org/10.1109/EDL.1980.25226]   DOI
2 G. Majumdar and T. Minato, Power Conversion Conference proceedings, 355 (2007). [DOI: http://dx.doi.org/10.1109/pccon.2007.372992]   DOI
3 B. J. Baliga, Power Semiconductor Devices, (PWS Publishing Company, Boston, 1996)
4 B. Q. Tang, Y. M. Gao, and J. S. Luo, Solid-Stage Electronics, 41, 1821 (1997). [DOI: http://dx.doi.org/10.1016/S0038-1101(97)00151-2]   DOI
5 S. M. Sze and G. Gibbons, Solid-State Electronics, 9, 831, (1966). [DOI: http://dx.doi.org/10.1016/0038-1101(66)90033-5]   DOI
6 S. M. Sze, Kwok. K. Ng, "Physics of semiconductor devices", John Wiley & Sons, 2007
7 A. G. Chynoweth, Physical Review, 109, 1537 (1958). [DOI: http://dx.doi.org/10.1103/PhysRev.109.1537]   DOI
8 D. C. Sheridan, G. Niu, J. N. Merrett, J. D. Cressler, C. Ellis, and C. C. Tin, Solid-State Electronics, 44, 1367 (2000). [DOI: http://dx.doi.org/10.1016/S0038-1101(00)00081-2]   DOI
9 G. Charitat, M. A. Bouanane, P. Rossel, Power Semiconductor Devices and ICs, 1992. ISPSD '92. Proceedings of the 4th International Symposium, 213 (1992). [DOI: http://dx.doi.org/10.1109/ISPSD.1992.991268]   DOI
10 J. A. Appels, et al, Philips J. Res., 35, 1 (1980)
11 D Jaume, G. Charitat, J. M. Reynes, and P. Rossel, IEEE Trans. Electron Devices, 38, 1681 (1991). [DOI: http://dx.doi.org/10.1109/16.85167]   DOI
12 T. Matsushita, T. Mihara, H. Yamoto, H. Hayashi, M. Okayama, and Y. kawana, Jap J. Appl. Phys. Suppl., 15, 35 (1976 ). [DOI: http://dx.doi.org/10.7567/JJAPS.15S1.35]   DOI