• Title/Summary/Keyword: Pad Force

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Statistical Qualitative Analysis on Chemical Mechanical Polishing Process and Equipment Characterization

  • Hong, Sang-Jeen;Hwang, Jong-Ha;Seo, Dong-Sun
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.3
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    • pp.115-118
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    • 2011
  • Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters, such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of $2^{5-1}$ fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.

Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module (자동차 전장모듈용 Sn-Cu-Cr(Ca) 중온 솔더의 접합특성 연구)

  • Bang, Junghwan;Yu, Dong-Yurl;Ko, Yong-Ho;Kim, Jeonghan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.54-58
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    • 2013
  • Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

The Effect of Metal Fibers on the Tribology of Automotive Friction Materials (마찰재에 함유된 금속섬유와 마찰 특성의 연관관계)

  • Ko, Kil-Ju;Cho, Min-Hyung;Jang, Ho
    • Tribology and Lubricants
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    • v.17 no.4
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    • pp.267-275
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    • 2001
  • Friction and wear properties of brake friction materials containing different metal fibers (Al, Cu or Steel fibers) were investigated. Based on a simple experimental formulation, friction materials with the same amount of metal fibers were tested using a pad-on-disk type friction tester. Two different materials (gray cast iron and aluminum metal matrix composite (MMC)) were used for disks rubbing against the friction materials. Results front ambient temperature tests revealed that the friction material containing Cu fibers sliding against gray cast iron disk showed a distinct negative $\mu$-v (friction coefficient vs. sliding velocity) relation implying possible stick-slip generation at low speeds. The negative $\mu$- v relation was not observed when the Cu-containing friction materials were rubbed against the Al-MMC counter surface. Elevated temperature tests showed that the friction level and the intensity of friction force oscillation were strongly affected by the thermal conductivity and melting temperature of metallic ingredients of the friction couple. Friction materials slid against cast iron disks exhibited higher friction coefficients than Al-MMC (metal matrix composite) disks during high temperature tests. On the other hand, high temperature test results suggested that copper fibers in the friction material improved fade resistance and that steel fibers were not compatible with Al-MMC disks showing severe material transfer and erratic friction behavior during sliding at elevated temperatures.

Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package (LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향)

  • Lee, Young-Chul;Kim, Kwang-Seok;Ahn, Ji-Hyuk;Yoon, Jeong-Won;Ko, Min-Kwan;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
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    • v.48 no.11
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    • pp.1035-1040
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    • 2010
  • The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

Isogeometric Analysis of Electrostatic Adhesive Forces in Two-Dimensional Curved Electrodes (2차원 곡면형 전극에서 정전기 흡착력의 아이소-지오메트릭 해석)

  • Oh, Myung-Hoon;Kim, Jae-Hyun;Kim, Hyun-Seok;Cho, Seonho
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.34 no.4
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    • pp.199-204
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    • 2021
  • In this study, an isogoemetric analysis (IGA) method that uses NURBS (Non-Uniform Rational B-Spline) basis functions in computer-aided design (CAD) systems is employed to account for the geometric exactness of curved electrodes constituting an electro-adhesive pad in electrostatic problems. The IGA is advantageous for obtaining precise normal vectors when computing the electro-adhesive forces on curved surfaces. By performing parametric studies using numerical examples, we demonstrate the superior performance of the curved electrodes, which is attributed to the increase in the normal component of the electro-adhesive forces. In addition, concave curved electrodes exhibit better performance than their convex counterparts.

Fabrication of MEMS Test Socket for BGA IC Packages (MEMS 공정을 이용한 BGA IC 패키지용 테스트 소켓의 제작)

  • Kim, Sang-Won;Cho, Chan-Seob;Nam, Jae-Woo;Kim, Bong-Hwan;Lee, Jong-Hyun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.11
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    • pp.1-5
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    • 2010
  • We developed a novel micro-electro mechanical systems (MEMS) test socket using silicon on insulator (SOI) substrate with the cantilever array structure. We designed the round shaped cantilevers with the maximum length of $350{\mu}m$, the maximum width of $200{\mu}m$ and the thickness of $10{\mu}m$ for $650{\mu}m$ pitch for 8 mm x 8 mm area and 121 balls square ball grid array (BGA) packages. The MEMS test socket was fabricated by MEMS technology using metal lift off process and deep reactive ion etching (DRIE) silicon etcher and so on. The MEMS test socket has a simple structure, low production cost, fine pitch, high pin count and rapid prototyping. We verified the performances of the MEMS test sockets such as deflection as a function of the applied force, path resistance between the cantilever and the metal pad and the contact resistance. Fabricated cantilever has 1.3 gf (gram force) at $90{\mu}m$ deflection. Total path resistance was less than $17{\Omega}$. The contact resistance was approximately from 0.7 to $0.75{\Omega}$ for all cantilevers. Therefore the test socket is suitable for BGA integrated circuit (IC) packages tests.

Design and simulation of hydraulic system for launch vehicle holding device (우주발사체 지상고정장치 유압시스템 설계 및 해석)

  • Kim, Dae Rae;Yang, Seong Pil;Lee, Jaejun;Kim, Bum Suk;Lee, Young-Shin
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.44 no.12
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    • pp.1087-1094
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    • 2016
  • The responsibility of the vehicle holding device (VHD) is to hold the launch vehicle while it is stayed on launch pad and release the holding mechanism to allow a lift-off of launch vehicle at a moment of lift-off. During a release of the holding mechanism, in order to prevent the Ka doing a doing a doing mode which is vertical oscillation of entire liquid propellant and very severe for vehicle structure, gradual release of holding force is required. Also, a release operation of all 4 VHD should be synchronized very precisely. In this study, to comply the "gradual release and synchronized operation requirement", concept of VHD hydraulic system using an accumulator, pyro valve and orifice to control speed of hydraulic cylinder is proposed instead of using complicated hydraulic components. Then through multi-body dynamic analysis and computational hydraulic analysis, a size of orifice to meet a target speed of hydraulic cylinder is calculated. Through this study, simple and reliable VHD hydraulic system complying requirements is designed.

Study for Characteristic of Frictional Heat Transfer in Rotating Brake System (회전을 고려한 브레이크 디스크의 마찰열전달 연구)

  • Nam, Jiwoo;Ryou, Hong Sun;Cho, Seong Wook
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.10
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    • pp.817-822
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    • 2017
  • The braking system is one of the most important components in vehicles and machines. It must exert a reliable braking force when they are brought to a halt. Generally, frictional heat is generated by converting kinetic energy into heat energy through friction. As the kinetic energy is converted into heat energy, high temperature heat is generated which affects the mechanical behavior of the braking system. Frictional heat affects the thermal expansion and friction coefficient of the brake system. If the temperature is not controlled, the brake performance will be decreased. Therefore, it is important to predict and control the heat generation of the brake. Various numerical analysis studies have been carried out to predict the frictional heat, but they assumed the existence of boundary conditions in the numerical analysis to simulate the frictional heat, because the simulation of frictional heat is difficult and time consuming. The results were based on the assumption that the frictional heat is different from the actual temperature distribution in a rotating brake system. Therefore, the reliability of the cooling effect or thermal stress using the results of these studies is insufficient. In order to overcome these limitations and establish a simulation procedure to predict the frictional heat, this study directly simulates the frictional heat generation by using a thermal-structure coupling element. In this study, we analyzed the thermo-mechanical behavior of a brake model, in order to investigate the thermal characteristics of brake systems by using the Finite Element method (FEM). This study suggests the necessity to directly simulate the frictional heating and it is hoped that it can provide the necessary information for simulations.

Analytical study to the Brake Lever in Basic Brake System for Railway Vehicle (철도차량용 기초제동장치의 제동레버 강도에 대한 해석적 연구)

  • Park, Su-Myung;Park, Jae-young
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.17 no.8
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    • pp.624-629
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    • 2016
  • A brake lever in a basic railway brake system is an important safety device that delivers braking force from the brake cylinder to the brake pad. The safety guidelines for designing rolling stock only qualitatively describe that the brake lever should have sufficient strength. Each train has a different type of brake lever. One brake lever that was designed with a factor of safety of 1.27 has failed, so the material was changed to increase the strength. Therefore, the stress distribution and weak points of the lever were identified by theoretical analysis. and structural analysis. Different brake lever designs were examined for KTX high-speed trains, which have a split-type structure, as well as for electric locomotives, which use an electric multiple unit (EMU) with a unity-type structure. A fracture test was also done to look at the relationship between the vertical stress and the bending stress during braking. The results were used to find a safety factor to apply to each train and suggest quantitative minimum guidelines. We also looked at changing the unity-type EMU brake lever to the split type under the same conditions and analyzed how much the design change affected the factor of safety.

Effect of Supplementation of Complex Probiotics on Performances, Physio-chemical Properties of Meat and Intestinal Microflora in Broiler (복합생균제의 급여가 육계의 생산성, 육의 이화학적 특성 및 장내 미생물에 미치는 영향)

  • Yu, D.J.;Na, J.C.;Kim, T.H.;Kim, S.H.;Lee, S.J.
    • Journal of Animal Science and Technology
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    • v.46 no.4
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    • pp.593-602
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    • 2004
  • A feeding trial was carried out to investigate the effect of supplemental complex probiotics on performances, physio-chemica1 properties of meat and inetestinal microflora in broiler chicks. Four hundred eighty broiler chickens, one days old with mixed sexes were fed one of four diets containing 0, 0.1, 0.2 and 0.4% complex probiotics for 7 weeks. There were four replicates with thirty chicks per pen. Diet contained ME 3,100, 3,l00kcal/kg, and CP 22.0, 20.0% for starting and finishing period, respectively. Body Weight gain of chicks fed the complex probiotics tended to increase from the frist week and all complex probiotics higher than control from the 4th week. Chickens fed the diets containing 0.2% probiotics had higher(P<0.05) than those fed the other levels from the 4th week to 5th week. Feed conversion also improved significantly(P<0.05) in the supplemental 0.2% probiotics from the 4th week to 5th week. In physio-chemica1 properties of meat, carcass rate increased significantly(P<0.05) in the supplemental 0.4% probiotics compared to that of control at 7 weeks overall means and abdominal fat pad rate increased significantly(P< 0.05) in the supplemental 0.2% probiotics compared to that of control. Cooking loss decreased significantly(P<0.05) in the supplemental all probiotics. But shear force increased significantly(P<0.05) in the supplemental 0.4% probiotics. The number of ileum and cecum Lactobacillus spp. tended to increase in the supplemental complex probiotics at 7 week of age, but was not significantly different. As the result, supplemental complex probiotics increased performance and physio-chemica1 properties of meat and the number of intestinal Lactobacillus of broiler chicks.