Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module
![]() |
Bang, Junghwan
(Micro-Joining Center in Korea Institute of Industrial Technology)
Yu, Dong-Yurl (Micro-Joining Center in Korea Institute of Industrial Technology) Ko, Yong-Ho (Micro-Joining Center in Korea Institute of Industrial Technology) Kim, Jeonghan (Micro-Joining Center in Korea Institute of Industrial Technology) Lee, Chang-Woo (Micro-Joining Center in Korea Institute of Industrial Technology) |
1 | Yong-Hob Ko, Sehoon Yoo and Chang-Woo Lee : Evaluation on Reliability of High Temperature Leadfree Solder for Automotive Electronics, Journal of Microelectronics & Packaging Society, 17-4 (2010), 35-40 |
2 | Sanghun Jin, Namhyun Kang, Kyung-mox Cho, Changwoo Lee, Wonsik Hong : Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering, Journal of KWJS. 30-2 (2012), 65-69 (in Korean) 과학기술학회마을 DOI ScienceOn |
3 | Yu-Jae Jeon, Do-Seok Kim, Young-Eui Shin : A Study on the Fracture Mode Characteristics of Automotive Application Component Lead-free Solder Joints, Journal of KSAE, 19-6 (2011), 90-96 과학기술학회마을 |
4 | S. I. Son, Y. E. Shin, Y. J. Jeon : A Study on Tensile Characteristic of QFP Lead-free Joint for Automotive Electrical Parts, Korean Society of Precision Engineering, (2010), 1103-1104 |
5 | Guobiao Su, Yongjiu Han, Chunyan Wang, Hongbin Wang and Xicheng Wei : Effect of 0.05% Cr on Intermetallic Compound Layer Growth for Sn-Ag-Cu Lead-free Solder Joint during Isothermal Aging, 16th IEEE(The Institute of Electrical and Electronics Engineers) International Symposium(2009), 393-396 |
6 | Xi Chen, Anmin Hu, Ming Li, Dali Mao : Effect of Aging on the Interfacial Reaction between Sn-9Zn-xCr Solder and Cu Substrate, IEEE(The Institute of Electrical and Electronics Engineers), (2007), 1-4 |
7 | G. Subbarayan : A procedure for automated shape and life prediction in flip-chip and BGA solder joints, Journal Electron Packaging, 118, (1996) 127-133 DOI ScienceOn |
8 | H. Wang, A. Hu, C.C.M. Li, D.Mao, "Oxidation Behavior and Intermetallic Compounds Growth of Sn-Ag-Bi-Cr Lead-free Solder", IEEE(The Institute of Electrical and Electronics Engineers), (2007), 1-4 |
9 | Namhyun Kang, Hye Sung Na, Seong Jun Kim, Chung Yun Kang, Alloy design of Zn-Al-Cu solder for ultra high Temperatures, Journal of Alloys and compounds, 467, Issues 1-2, 7 January 2009, 246-250 DOI ScienceOn |
![]() |