• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.11-15
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• 2001

In this paper, hermetic sealing technology was studied for wafer level packaging of the RF-MEMS devices. With the flip-chip bonding method. this non-conductive B-stage epoxy sealing will be profit to the MEMS device sealing. It will be particularly profit to the RF-MEMS device sealing. B-stage epoxy can be cured by 2-step and hermetic sealing can be obtained. After defining 500 $\mu\textrm{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was, then, aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line could be maintained during the sealing process. The height of the seal-line was controlled within $\pm$0.6 $\mu\textrm{m}$ in the 4 inches wafer and the bonding strength was measured to about 20MPa by pull test. The leak rate, that is sealing characteristic of the B-stage epoxy, was about $10^{-7}$ cc/sec from the leak test.

• Korean Journal of Organic Agriculture
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• v.27 no.4
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• pp.437-452
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• 2019

The HACCP evaluation standards for the meat packaging plant are divided into general scale HACCP evaluation standard and small scale HACCP evaluation standard. There are 69 evaluation items in the general scale HACCP evaluation criteria, of which 54 items in the prerequisite management and 15 items in the HACCP management are included. The number of small scale HACCP evaluation items are 20 and about 29% of the general scale HACCP evaluation items. This may not be enough to produce a safety livestock products for the purpose of implementing the HACCP system due to the nature of the meat packaging plant, which does not show much difference in the production process or method of product depending on the scale. To improve the small scale HACCP evaluation standard, the importance of each item was compared with the small scale HACCP evaluation based on the rate of non-compliance and the severity levels in the general scale HACCP evaluation items. As a result of the study, 8 items were derived from the prerequisites management, 2 items were derived from the HACCP management, and some similar evaluation items were grouped together. Finally, 10 items were added to the 20 items of the existing small scale HACCP evaluation items. In this study, study on the safety management of domestic livestock products are continuously carried out, so that it is possible to provide safety livestock products to consumers and contributes to securing competitiveness of domestic livestock industry.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.111-119
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• 2005

Stack specimen with three dimensional interconnection structure through Cu via of $75{\mu}m$ diameter, $90{\mu}m$ height and $150{\mu}m$ pitch was successfully fabricated using subsequent processes of via hole formation with Deep RIE (reactive ion etching), Cu via filling with pulse-reverse electroplating, Si thinning with CMP, photolithography, metal film sputtering, Cu/Sn bump formation, and flip chip bonding. Contact resistance of Cu/Sn bump and Cu via resistance could be determined ken the slope of the daisy chain resistance vs the number of bump joints of the flip chip specimen containing Cu via. When flip- chip bonded at $270^{\circ}C$ for 2 minutes, the contact resistance of the Cu/Sn bump joints of $100{\times}100{\mu}m$ size was 6.7m$\Omega$ and the Cu via resistance of $75{\mu}m$ diameter, $90{\mu}m$ height was 2.3m$\Omega$.

• Journal of Food Hygiene and Safety
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• v.32 no.2
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• pp.114-122
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• 2017

N-nitrosamines can be produced in the process of heating, processing, storage and packaging. Migration specifications for N-nitrosamines exist only for rubber baby bottle nipples, which are regulated by the Ministry of Food and Drug Safety (MFDS). There is no regulation for other food contact substances (FCS) and studies on N-nitrosamines migration from FCS are rather limited. A pilot study showed an increase in N-nitrosamines contents when cooking instant noodles. Thus, the migration from the packaging was suspected and it was necessary to monitor the migration of N-nitrosamines from food packaging materials and to examine the change in N-nitrosamines contents when cooking instant foods. Three N-nitrosamines, NDMA (N-nitrosodimethtlamine), NDEA (N-nitrosodiethylamine), NDBA (N-nitrosodibutylamine), were analyzed in migration test solutions from plastics such as polyethylene, polypropylene and polystyrene, papers and aluminium containers. In all test solutions, N-nitrosamines were detected less than method quantitation limits (MQLs). Food samples were also investigated to ensure that there is no effect from food contact substances when cooking instant foods. In retort sauces such as curry, black soybean sauce and tomato sauce, NDMA concentration was ranged from 0.54 to $3.81{\mu}g/kg$, but there were no significant differences between unheated and heated samples. However, the NDMA contents were significantly increased in most of the instant noodle samples tested when cooked (p < 0.05). No effects from the food contact substances or cooking water was observed. Only when the seasoning powder and noodles were cooked together was NDMA detected. Individual components (noodle, seasoning powder or dried vegetable) or other combinations such as noodles and dried vegetables did not generate N-nitrosamines. Therefore, it is speculated that NDMA may be formed from the precursors in noodles and seasoning powders when they are solubilized in a medium of water.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.1-12
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• 2021

Here, we introduce a laser-induced graphene synthesis technology and its applications for the electric/electronic device manufacturing process. Recently, the micro/nanopatterning technique of graphene has received great attention for the utilization of these new graphene structures, which shows progress developments at present with a variety of uses in electronic devices. Some examples of practical applications suggested a great potential for the tunable graphene synthetic manners through the control of the laser set-up, such as a selection of the wavelength, power adjustment, and optical techniques. This emerging technology has expandability to electric/electronic devices combined together with existed micro-packaging technology and can be integrated with the new processing steps to be applied for the operation in the fields of biosensors, supercapacitors, electrochemical sensors, etc. We believe that the laser-induced graphene technology introduced in this paper can be easily applied to portable small electronic devices and wearable electronics in the near future.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.37-42
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• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.1
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• pp.30-36
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• 1999

Physical analysis of some composite films of outer packaging at process cheeses in Korea is as following. In comparison with four composite films, tensile strength is $72.2{\mu}PET/PVDC/PE/AL-vac/PE\;film\;MD9.55kg/15mm,\;TD8.95kg/15mm>79.3{\mu}PET/PVDC/L-LDPE\;film\;MD5.37kg/15mm,\;TD5.01kg/15mm>96.9{\mu}PE/PVDC/PE\;film\;MD5.42kg/15mm,\;TD4.73kg/15mm>61.6{\mu}PVDC/PE/AL-vac/CPS\;film\;MD4.65kg/15mm,\;TD4.22kg/15mm$. Water vapor transmission is $72.2{\mu}PET/PVDC/PE/AL-vac/PE\;film\;0.41g/m^2{\cdot}24hr>79.3{\mu}PET/PVDC/L-LDPE\;film\;3.77g/m^2{\cdot}24hr>96.9{\mu}PE/PVDC/PE\;film\;3.81g/m^2{\cdot}24hr>61.6{\mu}PVDC/PE/AL-vac/4.91g/m^2{\cdot}24hr$. Gas transmission $O_2:N_2:CO_2$ is $72.2{\mu}PET/PVDC/PE/AL-vac/PE\;film\;1.81:0.74:4.2cc/m^2{\cdot}24hr{\cdot}atm>79.3{\mu}PET/PVDC/L-LDPE\;film\;13.4:6.4:34.2cc/m^2{\cdot}24hr{\cdot}atm>96.9{\mu}PE/PVDC/PE\;film\;15.3:7.1:42.0cc/m^2{\cdot}24hr{\cdot}atm>61.6{\mu}PVDC/PE/AL-vac/CPS\;film\;25.3:12.5:59.3cc/m^2{\cdot}24hr{\cdot}atm$ each other. And for preservation this were sealed to filths $N_2,\;CO_2$ gas or defilling ai (vacuum type) in the packaging and reserved less than $10^{\circ}C$ at refrigerator.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.6
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• pp.2624-2630
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• 2013

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead flame to provide enough strength for the next process. During the process, inspection processes are very important to detect exact locations of dispensed epoxy dots and to determine bonding status of dies whether they are lies at exact positions with sufficient bonding strength. In this study, a useful machine vision based inspection system is proposed for the LED die bonder. In the proposed system, 2 cameras are used for epoxy dot position detection and 2 cameras are sued for die attaching status determination. New vision processing algorithm is proposed, and its efficiency is verified through required field experiments. Measured position error is less than $X:-29{\mu}m$, $Y:-32{\mu}m$ and rotation error:$3^{\circ}$ using proposed vision algorithm. It is concluded that the proposed machine vision based inspection system can be successfully implemented on the developed die bonding system.

• Journal of Fashion Business
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• v.19 no.4
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• pp.183-199
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• 2015

This study aimed to systematize the apparel vendor work processes and provide useful information to future employees of clothing export units by analyzing the processes of vendors' manufacturing tasks. A survey of 20 apparel vendors servicing mainly U.S. buyers was conducted on employees of overseas business departments working for more than five years. buyers. Based on the results, vendors mainly manufactured cut-and-sew knit products. Regarding the production method, OEM was used more frequently than ODM. Fourteen (70%) companies used the ODM method. This suggests that vendors are expanding their production method from OEM to ODM. In order to summarize the work of each business based on the clothing production process research results, buyers were in charge of planning products and the vendors were in charge of sampling. Production of materials and the approval of material tests were out sourced. Overseas factories of vendors were in charge of bulk (mass) production and garment finishing, as well as packaging and shipping the completed products. Even though the vendors' head offices do not directly produce clothes, they play a pivotal role in ensuring planning and management progress in clothing production. As buyers prefer direct contracts for cost reduction, the vendor additionally performs the role of an agent. Also, with the increase in ODM production ratio, the work area of the vendor is expanding. If Korean clothing exporters improve their global competitiveness by investing in the R&D of materials and design to enhance the ODM method, the development of Korea's clothing and export industry will benefit significantly.