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http://dx.doi.org/10.6117/kmeps.2022.29.3.037

Delamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative Humidity

Um, Hui-Jin (Department of Mechanical Convergence Engineering, Hanyang University)
Hwang, Yeon-Taek (Department of Mechanical Convergence Engineering, Hanyang University)
Kim, Hak-sung (Department of Mechanical Convergence Engineering, Hanyang University)

Publication Information

Journal of the Microelectronics and Packaging Society / v.29, no.3, 2022 , pp. 37-42 More about this Journal

Abstract

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

Keywords

Semiconductor package; hygroscopic thermal behavior; interfacial delamination; adhesion reliability;

Citations & Related Records

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