LED Die Bonder Inspection System Using Integrated Machine Visions
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Cho, Yong-Kyu
(Department of Mechanical Engineering, Inha University)
Ha, Seok-Jae (Department of Mechanical Engineering, Inha University) Kim, Jong-Su (Department of Mechanical Engineering, Inha University) Cho, Myeong-Woo (Division of Mechanical Engineering, Inha University) Choi, Won-Ho (Wooree ATEC. Co. LTD.) |
1 | S. J. Ha, Y. K. Cho, M. W. Cho, K. C. Lee, W. H. Choi, "Process Capability Optimization of a LED Die Bonding Using Response Surface Analysis", Journal of the Korea Academia-Industrial Cooperation Society, Vol. 13, No. 10, pp. 4378-4384, 2012 DOI: http://dx.doi.org/10.5762/KAIS.2012.13.10.4378 과학기술학회마을 DOI ScienceOn |
2 | Y. K. Cho, J. W. Lee, S. J. Ha, M. W. Cho and W. H. Choi, "A Study on the Computational Design and Analysis of a Die Bonder for LED Chip Fabrication", Journal of the Korea Academia-Industrial Cooperation Society, Vol. 13, No. 8, pp. 3301-3306, 2012 DOI: http://dx.doi.org/10.5762/KAIS.2012.13.8.3301 과학기술학회마을 DOI ScienceOn |
3 | J. Li, Z. Zou and F. Wang, "The Design of Machine Vision System in Flip-chip Bonder", 7th International Conference on Electronics Packaging Technology, pp.1-7, August, 2006 |
4 | M. Fan, M. Liang, D. Guo, F. Yang, L. Wang, G. Wang and J. Li, "Color Filter-less Technology of LED Back Light for LCD-TV," Proc. SPIE, Vol. 6841, pp. 68410G1-68410G6, 2007 DOI: http://dx.doi.org/10.1117/12.760045 DOI |
5 | J. R. Ryu, "The Improvement for Performance of White LED chip using Improved Fabrication Process", Journal of the Korea Academia-Industrial Cooperation Society, Vol. 13, No. 1, pp. 329-332, 2012 DOI: http://dx.doi.org/10.5762/KAIS.2012.13.1.329 과학기술학회마을 DOI ScienceOn |
6 | B. C. Gather, A. Kohnen, A. Falcou, H. Becker and K. Meerholz, "Solution-Processed Full-Color Polymer Organic Light-Emitting Diode Displays Fabricated by Direct Photolithography", Advanced Functional Materials, Vol. 17, pp. 191-200, 2007 DOI: http://dx.doi.org/10.1002/adfm.200790007 DOI ScienceOn |
7 | H. H. Kim, S. H. Choi, S. H. Shin, Y. K. Lee, S. M. Choi and S. Yi, "Thermal Transient Characteristics of Die Attach in High Power LED PKG", Microelectronics Reliability Vol. 48, pp. 445-454, 2008 DOI: http://dx.doi.org/10.1016/j.microrel.2007.08.009 DOI ScienceOn |
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