• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.11a
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• pp.77-81
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• 1999

• Proceedings of the Korea Association of Information Systems Conference
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• 2001.12a
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• pp.158-165
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• 2001

The certification of software products can provide a greater level of acceptance and feeling of security to customers of these products. This paper presents a certification method for the quality of package software. First of all, the evaluation criteria are derived from ISO/1EC 9126 and 12119 standards, and then the evaluation module are designed considering the measurement scale type. The results can be applied to construct the certification scheme of software product quality for the commercial purpose.

• Proceedings of the Safety Management and Science Conference
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• 2002.05a
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• pp.193-197
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• 2002

The certification of software products can provide a greater level of acceptance and feeling of security to customers of these products. This paper presents a certification method for the quality of package software. First of all, the evaluation criteria are derived from IS0/1EC 9126 and 12119 standards, and then the evaluation module are designed considering the measurement scale type. The results can be applied to construct the certification scheme of software product quality for the commercial purpose.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.588-592
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• 1996

In this paper, we have constructed an expert system for semiconductor chip encapsulation which combines a knowledge-based system with CAE software. The knowledge-base module includes heuristic and pre-analysis knowledge for evaluation and redesign. Evaluation of the initial design and generation of redesign recommendations can be developed from the rules as applied to a given chip Package. The CAE programs can be used for simulating the filling and packing stage of encapsulation process. The expert system is a new tool which enables package design or process conditions with high yields and high productivity.

• Journal of the Korea Safety Management & Science
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• v.4 no.1
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• pp.93-103
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• 2002

The certification of software products can provide a greater level of acceptance and feeling of security to customers of these products. This paper presents a certification method for the quality of package software. First of all, the evaluation criteria are derived from ISO/IEC 9126 and 12119 standards, and then the evaluation module are designed considering the measurement scale type. The results can be applied to construct the certification scheme of software product quality for the commercial purpose.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.1A
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• pp.107-112
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• 2004

We propose the optimum TO-can package design in SFF/SFP optical transceiver modules to improve 3dB-bandwidth. The frequency response of TO-38 package is measured and compared to simulation where the 3dB-bandwidth was 3.5GHz. For a higher operating bandwidth (>15GHz), the new optimized physical geometries of TO-can package such as bonding-wire, lead and material was suggested. The optimal result of simulation shows that TO-can package can be used at a higher bit rate optical module of 10Gbps.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.10
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• pp.1011-1019
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• 2015

Insulated-gate bipolar transistors (IGBTs) are the predominantly used power semiconductors for high-current applications, and are used in trains, airplanes, electrical, and hybrid vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power. This heat generation causes several reliability problems and deteriorates the performances of the IGBT devices. Therefore, thermal management is critical for IGBT modules. In particular, realizing a proper thermal design for which the device temperature does not exceed a specified limit has been a key factor in developing IGBT modules. In this study, we investigate the thermal behavior of the 1200 A, 3.3 kV IGBT module package using finite-element numerical simulation. In order to minimize the temperature of IGBT devices, we analyze the effects of various packaging materials and different thickness values on the thermal characteristics of IGBT modules, and we also perform a design-of-experiment (DOE) optimization

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.3
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• pp.28-39
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• 1994

We experimented on memory multichip modules to increase the packing density of memory devices and to improve their electrical characteristics. A 128K$\times$8bit SRAM module was made of four 32K$\times$8bit SRAM memory chips. The memory multichip module was constructed on a low-cost double sided PCB(printed circuit boared) substrate. In the process of fabricating a multichip module. we focused on the improvement of its electrical characteristics. volume, and weight by employing bare memory chips. The characteristics of the bare chip module was compared with that of the module with four packaged chips. We conducted circuit routing with a PCAD program, and found the followings: the routed area for the module with bare memory chips reduced to a quarter of that area for module with packaged memory chips. 1/8 in volume, 1/5 in weight. Signal transmission delay times calculated by using transmission line model was reduced from 0.8 nsec to 0.4 nsec only on the module board, but the coupling coefficinet was not changed. Thus, we realized that the electrical characteristics of multichip packages on PCB board be improved greatly when using bare memory chips.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.295-301
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• 2011

A triple-band transceiver module for 2.3/2.5/3.5 GHz mobile WiMAX, IEEE 802.16e, applications is introduced. The suggested transceiver module consists of RFIC, reconfigurable/multi-resonance MIMO antenna, embedded PCB, mobile WiMAX base band, memory and channel selection front-end module. The RFIC is fabricated in $0.13{\mu}m$ RF CMOS process and has 3.5 dB noise figure(NF) of receiver and 1 dBm maximum power of transmitter with 68-pin QFN package, $8{\times}8\;mm^2$ area. The area reduction of transceiver module is achieved by using embedded PCB which decreases area by 9% of the area of transceiver module with normal PCB. The developed triple-band mobile WiMAX transceiver module is tested by performing radio conformance test(RCT) and measuring carrier to interference plus noise ratio (CINR) and received signal strength indication (RSSI) in each 2.3/2.5/3.5 GHz frequency.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.33-49
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• 2002

$\Box$ LTCC/LTCC-M technologies are a cost-effective SOP technology $\Box$ LTCC/LTCC-M materials have good RF characteristics and the materials can be used as excellent substrates for high band width applications $\Box$ Reliability of LTCC/LTCC-M package or module can be greatly improved by embedded passive technology and CTE control of the substrates $\Box$ To expand the application area, more development is needed in realization of embedded passives with tight tolerance