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http://dx.doi.org/10.3795/KSME-A.2015.39.10.1011

Numerical Thermal Analysis of IGBT Module Package for Electronic Locomotive Power-Control Unit  

Suh, Il Woong (Graduate School of NID Fusion Technology, Seoul National Univ. of Science and Technology)
Lee, Young-ho (Woojin Industrial System Co., Ltd.)
Kim, Young-hoon (SP Semiconductor & Communication Co., Ltd.)
Choa, Sung-Hoon (Graduate School of NID Fusion Technology, Seoul National Univ. of Science and Technology)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.39, no.10, 2015 , pp. 1011-1019 More about this Journal
Abstract
Insulated-gate bipolar transistors (IGBTs) are the predominantly used power semiconductors for high-current applications, and are used in trains, airplanes, electrical, and hybrid vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power. This heat generation causes several reliability problems and deteriorates the performances of the IGBT devices. Therefore, thermal management is critical for IGBT modules. In particular, realizing a proper thermal design for which the device temperature does not exceed a specified limit has been a key factor in developing IGBT modules. In this study, we investigate the thermal behavior of the 1200 A, 3.3 kV IGBT module package using finite-element numerical simulation. In order to minimize the temperature of IGBT devices, we analyze the effects of various packaging materials and different thickness values on the thermal characteristics of IGBT modules, and we also perform a design-of-experiment (DOE) optimization
Keywords
Power Device; IGBT Module Package; Thermal Management; Thermal Design; Thermal Analysis;
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Times Cited By KSCI : 3  (Citation Analysis)
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