Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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Numerical Thermal Analysis of IGBT Module Package for Electronic Locomotive Power-Control Unit

전동차 추진제어용 IGBT 모듈 패키지의 방열 수치해석

  • Suh, Il Woong (Graduate School of NID Fusion Technology, Seoul National Univ. of Science and Technology) ;
  • Lee, Young-ho (Woojin Industrial System Co., Ltd.) ;
  • Kim, Young-hoon (SP Semiconductor & Communication Co., Ltd.) ;
  • Choa, Sung-Hoon (Graduate School of NID Fusion Technology, Seoul National Univ. of Science and Technology)
  • 서일웅 (서울과학기술대학교 NID융합기술대학원) ;
  • 이영호 (우진산전(주)) ;
  • 김영훈 (에스피반도체 통신(주)) ;
  • 좌성훈 (서울과학기술대학교 NID융합기술대학원)
  • Received : 2015.05.26
  • Accepted : 2015.07.04
  • Published : 2015.10.01
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Abstract

Insulated-gate bipolar transistors (IGBTs) are the predominantly used power semiconductors for high-current applications, and are used in trains, airplanes, electrical, and hybrid vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power. This heat generation causes several reliability problems and deteriorates the performances of the IGBT devices. Therefore, thermal management is critical for IGBT modules. In particular, realizing a proper thermal design for which the device temperature does not exceed a specified limit has been a key factor in developing IGBT modules. In this study, we investigate the thermal behavior of the 1200 A, 3.3 kV IGBT module package using finite-element numerical simulation. In order to minimize the temperature of IGBT devices, we analyze the effects of various packaging materials and different thickness values on the thermal characteristics of IGBT modules, and we also perform a design-of-experiment (DOE) optimization

Insulated gate bipolar transistor (IGBT) 소자는 전동차, 항공기 및 전기 자동차에 가장 많이 사용되는 고전압, 고전력용 전력 반도체이다. 그러나 IGBT 전력소자는 동작 시 발열 온도가 매우 높고, 이로 인해, IGBT 소자의 신뢰성 및 성능에 큰 영향을 미치고 있다. 따라서 발열 문제를 해결하기 위한 IGBT 모듈 패키지의 방열 설계는 매우 핵심적인 기술이며, 특히, 소자가 동작 한계 온도에 올라가지 않도록 방열 설계를 적절히 수행하여야 한다. 본 논문에서는 전동차에 사용되는 1200 A, 3.3 kV 급 IGBT 모듈 패키지의 열 특성에 대해 수치해석을 이용하여 분석하였다. IGBT 모듈 패키지에 사용되는 다양한 재료 및 소재의 두께에 대한 영향을 분석하였으며, 실험계획법을 이용한 최적화 설계를 수행하였다. 이를 통하여 열 저항을 최소화하기 위한 최적의 방열 설계 가이드 라인을 제시하고자 하였다.

Keywords

References

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