• Title/Summary/Keyword: Package Effect

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A Study on Duty Competency and Utilizing Package Development for Construction of Marine Terminal Structure (해양터미널구조물설치분야 직무능력 및 활용패키지 개발에 대한 연구)

  • PARK, Jong-Un;KANG, Beodeul;BAEK, In-Hum
    • Journal of Fisheries and Marine Sciences Education
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    • v.28 no.2
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    • pp.456-464
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    • 2016
  • NCS development for construction of marine terminal structure was carried out through following procedures such as analysis on characteristics, analysis on duty, development of the first draft for standards, validation of industry sites, duty competency standards through expert committee, and utilizing package. The results were as follows. Firstly, duty competency was classified as levels from 3 to 7. Educational training institutions were followed by 22 universities, 21 colleges, 16 graduate schools, and 10 high schools. Secondly, developed standards were consisted of duty and competency unit. The name of duty was construction of marine terminal structure and competency units were consisted of 9 items as survey on economic effect, evaluation of conditions on construction environment, plan for construction of structure, construction of transfer, mooring, and power equipment, and construction, startup test, and maintenance of terminal structure. 33 competency unit elements below 9 competency units were developed. Thirdly, utilizing package was developed into 3 areas of life-long career path, training criteria, and guidelines for exam according to national competency standards for in order to develop development of labor's career and perform personal management such as hiring and promotion in industry sites.

Electromigration and Thermomigration Characteristics in Flip Chip Sn-3.5Ag Solder Bump (플립칩 Sn-3.5Ag 솔더범프의 Electromigration과 Thermomigration 특성)

  • Lee, Jang-Hee;Lim, Gi-Tae;Yang, Seung-Taek;Suh, Min-Suk;Chung, Qwan-Ho;Byun, Kwang-Yoo;Park, Young-Bae
    • Korean Journal of Metals and Materials
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    • v.46 no.5
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    • pp.310-314
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    • 2008
  • Electromigration test of flip chip solder bump is performed at $140^{\circ}C$ C and $4.6{\times}10^4A/cm^2$ conditions in order to compare electromigration with thermomigration behaviors by using electroplated Sn-3.5Ag solder bump with Cu under-bump-metallurgy. As a result of measuring resistance with stressing time, failure mechanism of solder bump was evaluated to have four steps by the fail time. Discrete steps of resistance change during electromigration test are directly compared with microstructural evolution of cross-sectioned solder bump at each step. Thermal gradient in solder bump is very high and the contribution of thermomigration to atomic flux is comparable with pure electromigration effect.

Effectiveness of a Training Program Based on Stress Management on NEDSA Staff and Line Staff

  • Azad, Esfandiar;Hassanvand, Bagher;Eskandari, Mohsen
    • Safety and Health at Work
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    • v.13 no.2
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    • pp.235-239
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    • 2022
  • Background: The purpose of present study was to determine the effectiveness of training program based on job stress management in NEDSA and line staff. Methods: The study method of this study was quantitative and quasi-experimental research Methods: From the statistical population (all employees of the NEDSA and line staff in 2020-2021), 30 of these people were selected by judgmental sampling method and considering the inclusion and exclusion criteria. The participants were first matched based on age and education and were randomly divided into experimental and control groups. First, pre-test was taken from both groups (Job Stress Questionnaire). The experimental group was presented with a job stress management training package and no protocol was presented in the control group. After the sessions, post-test was received from both groups (experimental and control). After two months, a follow-up test was performed. Results: The results were entered into SPSS-24 software and analyzed. The results of repeated measure showed high effectiveness of the job stress management package (researcher-made). The results showed that the job stress management training package showed 67.5% effectiveness and also the training effect of job stress management training was stable for two months (follow-up). Conclusion: Based on these results, Training program based on stress management can be effective in military staff.

Effect of Bundling Strategy on Tourists' Evaluation of Tour Packages (여행 패키지의 묶음판매 전략에 관한 연구)

  • Kim, Seung Lee;Lee, Dong Hee
    • International Area Studies Review
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    • v.16 no.1
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    • pp.53-74
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    • 2012
  • The bundling of multiple products/services at a set price has become a popular marketing strategy. However, little is known on how effects of bundling strategy influence tourists' evaluation of tour packages. Tourists evaluate a tour package based on the trade-off between the perceived benefits and costs involved in purchasing the tour package. In other words, the perceived value of the tour package influenced whether tourists to purchase a tour package or not. This study tested a tour package based on the theory of bundling, taking a moderating approach with perceived value. The data for this study wascollected by subjects who live Seoul Metropolitan Area and Gyeonggi Province and 4234 respondents, potential tourists to northeastern U.S.A/Canada. Results show that bundling taken by travel agencies include how many product items to put in a tour package and what degree of discount for the tour package. Also explaining functional relationship among product items in the tour package. Result show that tourists expect a discount, large or small, from purchasing a tour package. And the larger the number of products in a tour packages, the larger the discount size, and low functional relationship among items tourists expect to get.

A Study on Relationship among Attributes of Ramen Package Design, Ramen Image and Chinese Customer's Choice of Ramen (한국 라면 포장지 디자인 속성과 라면포장지 이미지, 그리고 중국 소비자의 한국 라면 선택간의 관계에 관한 연구)

  • Ryu, Jeong Yeol;Ha, Heon-Su
    • Culinary science and hospitality research
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    • v.22 no.4
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    • pp.156-169
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    • 2016
  • The purpose of this study is to verify relationships among attributes of ramen package design, ramen image, and chinese customer's choice of ramen. We chose, as a sample, ramen 'sour ramen', 'squid jjambbong', 'tasty ramen', 'noodle beef soup', and 'seasame ramen'. The findings and implications can be summarized as follows. first, while chinese customers chose 'sour ramen' as the most favorable ramen, followed by 'tasty ramen', 'squid jjangbbong', 'noodle beef soup', and 'seasame ramen', for ramen image they most highly evaluated 'sour ramen' followed by 'squid jjangbbong', 'tasty ramen', 'seasame ramen', and 'noodle beef soup'. Second, there is a significant difference in popularity and reliability of quality, but no significant difference in attractiveness and healthiness among most attributes of ramen package design. Third, compared to 'seasame ramen', the popularity and reliability of quality for 'sour ramen', reliability of quality for 'squid jjangbbong', reliabilty of quality, and healthiness for 'tasty ramen' had positive effect on choice, while attractiveness for 'noodle beef soup' had a negative effect on their choice.

Effect of Polypropylene Film Package and Storage Temperature on the Shelf-life Extension of Spinach (Spinacia oleracea L.) (시금치 포장 및 보관온도가 품질보존에 미치는 영향)

  • Choi, Dong-Jin;Lee, Suk-Hee;Yoon, Jae-Tak;Sim, Yong-Gu;Oh, Seok-Gui;Jun, Ha-Joon
    • Journal of Bio-Environment Control
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    • v.16 no.3
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    • pp.247-251
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    • 2007
  • To extend the shelf-life of spinach after harvest, we investigated the effect of various packaging methods and storage temperature. In case of polypropylene film package, there was no weight loss, but in non-package, remarkably weight loss occurred as storage period extended and storage temperature risen. Content of vitamin C was decreased rapidly at early stage of storage, and decrease of vitamin C in low temperature storage was lower than that of room temperature storage, but its large difference according to packaging method was not observed. In hunter's value on spinach, b value in room temperature storage was higher than that of low temperature storage. In terms of freshness, shelf-life of spinach by low temperature storage $(1{\sim}3^{\circ}C)$ after PP film packaging lasted 34 days, and that by room temperature storage $(10{\sim}15^{\circ}C)$ after PP film packaging lasted 8 days, but that by room temperature storage after non-packaging lasted 3 days.

Effect of Packaging Method on the Quality of Strawberry, Tomato, and plum during Storage

  • Lee, Se-Hee;Lee, Myung-Suk;Lee, Yong-Woo;Sun, Nam-Kyu;Song, Kyung-Bin
    • Proceedings of the Korean Society of Postharvest Science and Technology of Agricultural Products Conference
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    • 2003.10a
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    • pp.187-187
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    • 2003
  • To examine the effect of packaging method on strawberry, tomato, and plum quality, the rate of weight loss, Hunter a value, decay rate, anthocyanin contents, and microbial (total bacterial counts, mold and yeast, and pseudomonas) changes were determined during storage. Strawberry was packaged with low density polyethylene (LDPE). Tomato and plum were packaged with high density polyethylene film (HDPE). Strawberries, tomatoes, and plums were then stored at 4$^{\circ}C$ and 20$^{\circ}C$, respectively. LDPE package was the most effective on the decrease of decay rate of strawberry and the rate of weight loss for packaged strawberry was lower than that of the non-packaged. HDPE package was the most effective on the rate of weight loss during storage of tomatoes and plums regardless of storage temperature. Hunter a value increased during storage. Anthocyanin contents of plums increased overall with increasing storage time, and plums stored without package were changed more than those with package. Microbial changes of strawberry, tomato, and plum stored at 4$^{\circ}C$ and 20$^{\circ}C$ were monitored during storage. Packaging method did not affect the microbial change, yet temperature did affect the microbial change significantly. These results indicate that storage of these commodities at 4$^{\circ}C$ should be recommended in terms ,of microbial safety as well as quality and shelf-life.

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Silicon Substrate Coupling Modeling and Analysis including RF Package Inductance (RF 패키지 인덕턴스가 실리콘 기판 커플링에 미치는 영향 모델링 및 해석)

  • Jin, U-Jin;Eo, Yeong-Seon;Sim, Jong-Jin
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.39 no.1
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    • pp.49-57
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    • 2002
  • Including RF Package inductance, substrate coupling through conductive silicon(Si)-substrate is modeled and quantitatively characterized. 2-port substrate coupling model is extended for the characterization of multi-port substrate coupling between digital circuit block and analog/RF circuit block. Furthermore, scalable parameter extraction model is developed. Multi-port substrate coupling can be investigated by linearly superposing a frequency-dependent 2-port substrate coupling model using scalable parameters. In addition, Substrate coupling including RF package inductance effect is quantitatively investigated. It is shown that package effect increases substrate coupling and shifts a characteristic frequencies(i.e., poles) to the higher frequency range. The proposed methodology can be efficiently used to the mixed-signal circuit performance verification.

Effect of Heat Treatment on Mechanical Reliability of Solder Joints in LED Package (LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 열처리의 영향)

  • Ko, Min-Kwan;Ahn, Jee-Hyuk;Lee, Young-Chul;Kim, Kwang-Seok;Yoon, Jeong-Won;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
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    • v.50 no.1
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    • pp.71-77
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    • 2012
  • We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

Effect of Functional Packing Materials on the Maintenance of Freshness of Cut Lily and Cut Rose (기능성 포장재가 백합과 장미의 선도유지에 미치는 효과)

  • Suh, Jeung Keun;Kim, Ji Hee
    • FLOWER RESEARCH JOURNAL
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    • v.18 no.1
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    • pp.57-61
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    • 2010
  • This study was carried out to evaluate the effect of functional packing materials on vase life and quality of Lilium Oriental hybrid 'Le Reve' and Rosa hybrida 'Fire King'. Lily and rose were stored at $5^{\circ}C$ and $20^{\circ}C$ for two days after packing of 25% calcium or 36% wax coated package. When Lilium Oriental hybrid 'Le Reve' was stored in $5^{\circ}C$ after packing of 36% wax coated package, vase life and maintenance of freshness were improved by two days. But when Rosa hybrida 'Fire King' was stored in $5^{\circ}C$ or $20^{\circ}C$after packing of 25% calcium or 36% wax coated package, vase life and maintenance of freshness were not as effective as Lily. In our opinion, functional package seems useful in the storage of cut lily.